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公开(公告)号：US20090268297A1
公开(公告)日：2009-10-29
申请号：US12411513
申请日：2009-03-26
申请人： YI-MOU HUANG , HSIN-HO LEE , YANG-CHANG CHIEN , TSAI-SHIH TUNG , WEI-CHENG LING , KUN-I YUAN
发明人： YI-MOU HUANG , HSIN-HO LEE , YANG-CHANG CHIEN , TSAI-SHIH TUNG , WEI-CHENG LING , KUN-I YUAN
IPC分类号： G02B1/10
摘要： A lens includes a central optical portion, a peripheral portion surrounding the central optical portion, a first ZnS coating formed on the central optical portion and the peripheral portion at one side of the lens, and a first MgF2 coating formed the central optical, the peripheral portion being free of MgF2 coating formed thereon. The optical thickness of the first ZnS coating is one quarter of a wavelength of predetermined light passing therethrough. The optical thickness of the first MgF2 coating is one quarter of the wavelength of the predetermined light.
摘要翻译： 透镜包括中心光学部分，围绕中心光学部分的周边部分，在中心光学部分上形成的第一ZnS涂层和在透镜的一侧的周边部分，以及形成中心光学的第一MgF 2涂层， 部分没有形成在其上的MgF 2涂层。 第一ZnS涂层的光学厚度是通过其中的预定光的波长的四分之一。 第一MgF 2涂层的光学厚度是预定光的波长的四分之一。
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公开(公告)号：US08059190B2
公开(公告)日：2011-11-15
申请号：US12468849
申请日：2009-05-19
申请人： Jen-Tsorng Chang , Chau-Yuan Ke , Yi-Mou Huang , Yu-Chien Huang , Hsiang-Chieh Yu , Hsin-Hung Chuang , Han-Bang Chen
发明人： Jen-Tsorng Chang , Chau-Yuan Ke , Yi-Mou Huang , Yu-Chien Huang , Hsiang-Chieh Yu , Hsin-Hung Chuang , Han-Bang Chen
IPC分类号： H04N5/225
CPC分类号： H04N5/2256 , G03B15/05 , G03B29/00 , G03B2215/0567 , G03B2215/0592
摘要： A portable electronic apparatus includes a main body, a camera device, and a supplementary light device. The camera device and the supplementary light device are fixed on the main body. The supplementary light device includes a light module, a lens module, and a motor. The light module includes a circuit board, a light source, and a heat sink opposite to the light source. The lens module includes a lens barrel and a plurality of lenses received in the lens module. The motor drives the lens module to change the intensity distribution of the light from the light module.
摘要翻译： 便携式电子设备包括主体，相机装置和辅助光装置。 相机装置和辅助灯装置固定在主体上。 辅助灯装置包括光模块，透镜模块和电动机。 光模块包括电路板，光源和与光源相对的散热器。 透镜模块包括透镜镜筒和容纳在透镜模块中的多个透镜。 电机驱动镜头模块改变来自灯模块的光的强度分布。
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公开(公告)号：US20100074611A1
公开(公告)日：2010-03-25
申请号：US12475498
申请日：2009-05-30
申请人： YI-MOU HUANG , KUN-I YUAN
发明人： YI-MOU HUANG , KUN-I YUAN
IPC分类号： G03B9/08
摘要： A shutter for a micro camera module includes a substrate made from silicon wafer and a light absorbing layer covering the surface.
摘要翻译： 用于微型相机模块的快门包括由硅晶片制成的基板和覆盖该表面的光吸收层。
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公开(公告)号：US06784020B2
公开(公告)日：2004-08-31
申请号：US10283129
申请日：2002-10-30
申请人： Chengkuo Lee , Yi-Mou Huang
发明人： Chengkuo Lee , Yi-Mou Huang
IPC分类号： H01L2148
CPC分类号： B81C1/00269 , B81C2203/0109 , H01L21/50 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/24226 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/16152 , H01L2924/16235 , H01L2924/16315 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , Y10S438/974 , H01L2924/00014 , H01L2924/00
摘要： A package structure and method for making devices of system-in-a-package (SiP). Substrates with integrated and assembled elements can be aligned and pre-bonded together, and fluidic encapsulating materials is applied to seal the rest opening of pre-bonded interface of substrates. Three dimensional and protruding microstructures, elements, and MFMS devices can be accommodated and protected inside a spatial space formed by the bonded substrates. By applying the technologies of flip-chip, chip-scale-packaging, and wafer-level-packaging in conjunction with present invention, then plural elements and devices can be packaged together and become a system device in wafer-level-system-in-a-package (WLSiP) format.
摘要翻译： 一种用于制造系统级封装（SiP）器件的封装结构和方法。 具有集成和组装元件的衬底可以对准并预粘合在一起，并且施加流体封装材料以密封衬底的预键合界面的其余开口。 三维和突出的微结构，元件和MFMS器件可以由粘合的基底形成的空间空间内容纳和保护。 通过结合本发明应用倒装芯片，芯片级封装和晶片级封装的技术，可以将多个元件和器件封装在一起，并成为晶圆级系统中的系统器件， a-package（WLSiP）格式。
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公开(公告)号：US07878720B2
公开(公告)日：2011-02-01
申请号：US12475498
申请日：2009-05-30
申请人： Yi-Mou Huang , Kun-I Yuan
发明人： Yi-Mou Huang , Kun-I Yuan
IPC分类号： G03B9/08
摘要： A shutter for a micro camera module includes a substrate made from silicon wafer and a light absorbing layer covering the surface.
摘要翻译： 用于微型相机模块的快门包括由硅晶片制成的基板和覆盖该表面的光吸收层。
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公开(公告)号：US07826150B2
公开(公告)日：2010-11-02
申请号：US12411513
申请日：2009-03-26
申请人： Yi-Mou Huang , Hsin-Ho Lee , Yang-Chang Chien , Tsai-Shih Tung , Wei-Cheng Ling , Kun-I Yuan
发明人： Yi-Mou Huang , Hsin-Ho Lee , Yang-Chang Chien , Tsai-Shih Tung , Wei-Cheng Ling , Kun-I Yuan
摘要： A lens includes a central optical portion, a peripheral portion surrounding the central optical portion, a first ZnS coating formed on the central optical portion and the peripheral portion at one side of the lens, and a first MgF2 coating formed the central optical, the peripheral portion being free of MgF2 coating formed thereon. The optical thickness of the first ZnS coating is one quarter of a wavelength of predetermined light passing therethrough. The optical thickness of the first MgF2 coating is one quarter of the wavelength of the predetermined light.
摘要翻译： 透镜包括中心光学部分，围绕中心光学部分的周边部分，在中心光学部分上形成的第一ZnS涂层和在透镜的一侧的周边部分，以及形成中心光学的第一MgF 2涂层， 部分没有形成在其上的MgF 2涂层。 第一ZnS涂层的光学厚度是通过其中的预定光的波长的四分之一。 第一MgF 2涂层的光学厚度是预定光的波长的四分之一。
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公开(公告)号：US20090322930A1
公开(公告)日：2009-12-31
申请号：US12468849
申请日：2009-05-19
申请人： JEN-TSORNG CHANG , CHAU-YUAN KE , YI-MOU HUANG , YU-CHIEN HUANG , HSIANG-CHIEH YU , HSIN-HUNG CHUANG , HAN-BANG CHEN
发明人： JEN-TSORNG CHANG , CHAU-YUAN KE , YI-MOU HUANG , YU-CHIEN HUANG , HSIANG-CHIEH YU , HSIN-HUNG CHUANG , HAN-BANG CHEN
IPC分类号： H04N5/225
CPC分类号： H04N5/2256 , G03B15/05 , G03B29/00 , G03B2215/0567 , G03B2215/0592
摘要： A portable electronic apparatus includes a main body, a camera device, and a supplementary light device. The camera device and the supplementary light device are fixed on the main body. The supplementary light device includes a light module, a lens module, and a motor. The light module includes a circuit board, a light source, and a heat sink opposite to the light source. The lens module includes a lens barrel and a plurality of lenses received in the lens module. The motor drives the lens module to change the intensity distribution of the light from the light module.
摘要翻译： 便携式电子设备包括主体，相机装置和辅助光装置。 相机装置和辅助灯装置固定在主体上。 辅助灯装置包括光模块，透镜模块和电动机。 光模块包括电路板，光源和与光源相对的散热器。 透镜模块包括透镜镜筒和容纳在透镜模块中的多个透镜。 电机驱动镜头模块改变来自灯模块的光的强度分布。
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公开(公告)号：US20090260865A1
公开(公告)日：2009-10-22
申请号：US12405534
申请日：2009-03-17
申请人： Yi-Mou Huang
发明人： Yi-Mou Huang
CPC分类号： B81B7/0006 , B81B2207/012 , H01L2224/45124 , H01L2924/00014 , H01L2924/1461 , H01L2924/207 , H01L2924/00 , H01L2224/48 , H01L2924/0002
摘要： A micro-electromechanical system (MEMS) includes a micro-electromechanical chip, a printed circuit board and a metal wire. The metal wire electrically connects the micro-electromechanical chip and the printed circuit board. A connection distance and a connection angle are defined between the micro-electromechanical chip and the printed circuit board.
摘要翻译： 微机电系统（MEMS）包括微机电芯片，印刷电路板和金属线。 金属线将微机电芯片和印刷电路板电连接。 在微机电芯片和印刷电路板之间限定连接距离和连接角度。
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公开(公告)号：US20090323204A1
公开(公告)日：2009-12-31
申请号：US12247391
申请日：2008-10-08
申请人： YI-MOU HUANG
发明人： YI-MOU HUANG
摘要： A lens includes a central optical portion, and a peripheral supporting portion surrounding the central optical portion. The peripheral supporting portion has a first surface and an opposite second surface. At least one of the first surface and second surface having a light absorbing polymer layer adhered thereon.
摘要翻译： 透镜包括中心光学部分和围绕中心光学部分的周边支撑部分。 周边支撑部分具有第一表面和相对的第二表面。 第一表面和第二表面中的至少一个具有粘附在其上的光吸收聚合物层。
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公开(公告)号：US20090321110A1
公开(公告)日：2009-12-31
申请号：US12255545
申请日：2008-10-21
申请人： YI-MOU HUANG , JEN-TSORNG CHANG
发明人： YI-MOU HUANG , JEN-TSORNG CHANG
IPC分类号： H05K1/14
CPC分类号： B81B7/0006 , H01L2224/45147 , H01L2224/48091 , H05K1/148 , H05K3/323 , H01L2924/00014
摘要： In one embodiment, a MEMS includes a MEMS chip package, a first printed circuit board (PCB), an anisotropic conductive layer, a second PCB and at least one electrical wire. The MEMS chip package includes an exposed connecting portion, and at least one metallic pad formed on the exposed connecting portion. The first PCB is laminated on the connecting portion. The first PCB includes at least one first connecting metallic pad and at least one second connecting metallic pad. The first connecting metallic pad is electrically connected to a corresponding second connecting metallic pad. The anisotropic conductive layer is sandwiched between the metallic pads of the MEMS chip package and the first connecting metallic pads of the first PCB. The metallic pad of the MEMS chip package is electrically connected to the respective first connecting metallic pad of the PCB via the anisotropic conductive layer. One end of each electrical wire being bonded to a respective second connecting metallic pad and the other end being bonded to the second PCB. The MEMS actuator can be easily connected to driver circuit via tiny copper wires.
摘要翻译： 在一个实施例中，MEMS包括MEMS芯片封装，第一印刷电路板（PCB），各向异性导电层，第二PCB和至少一根电线。 MEMS芯片封装包括暴露的连接部分和形成在暴露的连接部分上的至少一个金属焊盘。 第一PCB被层压在连接部分上。 第一PCB包括至少一个第一连接金属垫和至少一个第二连接金属垫。 第一连接金属垫电连接到相应的第二连接金属垫。 各向异性导电层夹在MEMS芯片封装的金属焊盘和第一PCB的第一连接金属焊盘之间。 MEMS芯片封装的金属焊盘通过各向异性导电层电连接到PCB的相应的第一连接金属焊盘。 每个电线的一端被接合到相应的第二连接金属焊盘，另一端接合到第二PCB。 MEMS致动器可以通过微小的铜线轻松连接到驱动电路。
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