Slice based pipelined low latency codec system and method

    公开(公告)号:US11438631B1

    公开(公告)日:2022-09-06

    申请号:US17749300

    申请日:2022-05-20

    申请人: Yendo Hu Yiliang Wu

    发明人: Yendo Hu Yiliang Wu

    摘要: At least a method and an apparatus are provided for efficiently encoding or decoding a video frame, and more particularly, to a method or an apparatus for efficiently providing an improved slice based pipelined coding/decoding with low latency. In particular, each video frame of a sequence of video frames are segmented into equal number of slices, with only one slice per video frame. In addition, the position of the only I slice changes sequentially for the each video frame of the sequence of video frames over time, forming a sawtooth pattern.

    Method of forming dielectric layer with a dielectric composition
    3.
    发明授权
    Method of forming dielectric layer with a dielectric composition 有权
    用电介质组合物形成电介质层的方法

    公开(公告)号:US08821962B2

    公开(公告)日:2014-09-02

    申请号:US12957461

    申请日:2010-12-01

    摘要: An electronic device, such as a thin-film transistor, includes a substrate and a dielectric layer formed from a dielectric composition. The dielectric composition comprises a dielectric material and a low surface tension additive. The low surface tension additive allows for the formation of a thin, smooth dielectric layer with fewer pinholes and enhanced device yield. In particular embodiments, the dielectric material comprises a lower-k dielectric material and a higher-k dielectric material. When deposited, the lower-k dielectric material and the higher-k dielectric material form separate phases.

    摘要翻译: 诸如薄膜晶体管的电子器件包括由电介质组合物形成的衬底和电介质层。 电介质组合物包括介电材料和低表面张力添加剂。 低表面张力添加剂允许形成具有更少针孔和增强的器件产量的薄的平滑介电层。 在特定实施例中,介电材料包括较低介电常数材料和较高介电常数材料。 当沉积时,较低k电介质材料和较高介电材料形成分离相。

    Semiconductor composition
    6.
    发明授权
    Semiconductor composition 有权
    半导体组成

    公开(公告)号:US08643001B2

    公开(公告)日:2014-02-04

    申请号:US12977464

    申请日:2010-12-23

    IPC分类号: H01L51/30

    摘要: An electronic device, such as a thin-film transistor, includes a semiconducting layer formed from a semiconductor composition. The semiconductor composition comprises a polymer binder and a small molecule semiconductor of Formula (I): wherein R1, m, n, a, b, c, and X are as described herein. Devices formed from the composition exhibit high mobility and excellent stability.

    摘要翻译: 诸如薄膜晶体管的电子器件包括由半导体组合物形成的半导体层。 半导体组合物包含聚合物粘合剂和式(I)的小分子半导体:其中R 1,m,n,a,b,c和X如本文所述。 由该组合物形成的装置显示出高移动性和优异的稳定性。

    Palladium precursor composition
    8.
    发明授权

    公开(公告)号:US08568824B2

    公开(公告)日:2013-10-29

    申请号:US13290825

    申请日:2011-11-07

    申请人: Yiliang Wu Ping Liu

    发明人: Yiliang Wu Ping Liu

    CPC分类号: C23C18/08 C09D11/52

    摘要: A non-catalytic palladium precursor composition is disclosed, including a palladium salt and an organoamine, wherein the composition is substantially free of water. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

    DRY COATING PROCESSES FOR SUBSTRATES
    9.
    发明申请
    DRY COATING PROCESSES FOR SUBSTRATES 有权
    干燥基材涂层工艺

    公开(公告)号:US20130260136A1

    公开(公告)日:2013-10-03

    申请号:US13438088

    申请日:2012-04-03

    IPC分类号: B05D5/12 B32B5/16 B82Y40/00

    摘要: Disclosed herein are solvent free, dry coating processes for applying a layered material such as graphene, nanoplate graphite, etc., to a substrate. The applied layered material is devoid of any dispersant and substantially uniform in thickness. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. Such processes may be especially useful for applying conductive films onto a polymeric substrate without the need for additives such as a surfactant or a polymeric binder.

    摘要翻译: 本文公开了用于将诸如石墨烯,纳米板石墨等层状材料施加到基底上的无溶剂的干法涂布方法。 所施加的层状材料没有任何分散剂并且厚度基本均匀。 通常,将层状材料前体组合物与研磨介质混合,使得研磨介质涂覆有分层材料。 然后将基底与涂覆的研磨介质接触。 研磨介质上的层状材料转移到基底上以在基底上形成涂层。 这种方法对于将导电膜施加到聚合物基材上而不需要添加剂如表面活性剂或聚合物粘合剂可能是特别有用的。