公开(公告)号：US09406711B2

公开(公告)日：2016-08-02

申请号：US13524757

申请日：2012-06-15

Applicant: Szu-Ying Chen ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Ping-Yin Liu ,  Lan-Lin Chao

Inventor： Szu-Ying Chen ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Ping-Yin Liu ,  Lan-Lin Chao

IPC: H01L31/00 ,  H01L27/146

CPC classification number: H01L27/14634 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads.

Abstract translation: 背面照明图像传感器包括光电二极管和位于第一衬底中的第一晶体管，其中第一晶体管电耦合到光电二极管。 背面照明图像传感器还包括形成在第二基板中的多个逻辑电路，其中第二基板堆叠在第一基板上，并且逻辑电路通过多个接合焊盘耦合到第一晶体管。

公开(公告)号：US09379093B2

公开(公告)日：2016-06-28

申请号：US13457637

申请日：2012-04-27

Applicant: Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

Inventor： Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

IPC: H01L27/00 ,  H01L25/16 ,  H01L27/146

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.

公开(公告)号：US09054121B2

公开(公告)日：2015-06-09

申请号：US13280075

申请日：2011-10-24

Applicant: Ping-Yin Liu ,  Xin-Hua Huang ,  Hsin-Ting Huang ,  Yuan-Chih Hsieh ,  Jung-Huei Peng ,  Lan-Lin Chao ,  Chia-Shiung Tsai ,  Chun-Wen Cheng

Inventor： Ping-Yin Liu ,  Xin-Hua Huang ,  Hsin-Ting Huang ,  Yuan-Chih Hsieh ,  Jung-Huei Peng ,  Lan-Lin Chao ,  Chia-Shiung Tsai ,  Chun-Wen Cheng

IPC: H01L21/31 ,  H01L49/02 ,  B81C1/00 ,  H01G5/16

CPC classification number: B81B7/0058 ,  B81B3/0005 ,  B81B3/0021 ,  B81C1/00269 ,  B81C1/00793 ,  B81C2201/053 ,  B81C2203/0109 ,  H01G5/16 ,  H01L28/60

Abstract: A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.

Abstract translation: 一种方法包括形成MEMS器件，形成与MEMS器件相邻的接合层，并在接合层上形成保护层。 形成接合层和保护层的步骤包括接合层和保护层的原位沉积。

公开(公告)号：US09015844B1

公开(公告)日：2015-04-21

申请号：US13532327

申请日：2012-06-25

Applicant: Jason Franklin ,  Yin Liu

Inventor： Jason Franklin ,  Yin Liu

IPC: G06F12/14 ,  G06F17/00 ,  H04L29/06 ,  G06F11/30 ,  G06F9/44 ,  G06F21/57

CPC classification number: G06F21/577 ,  G06F21/57

Abstract: Techniques for web application vulnerability scanning are disclosed. In one particular embodiment, the techniques may be realized as a method for web application vulnerability scanning comprising crawling a web application for content associated with the web application, generating a client security policy based on the content associated with the web application, and scanning the web application for vulnerabilities based on the client security policy.

Abstract translation: 披露了Web应用漏洞扫描技术。 在一个特定实施例中，可以将技术实现为用于web应用程序漏洞扫描的方法，包括：针对与web应用相关联的内容爬行Web应用，基于与web应用相关联的内容生成客户端安全策略，以及扫描web 基于客户端安全策略的漏洞应用。

公开(公告)号：US08945344B2

公开(公告)日：2015-02-03

申请号：US13554751

申请日：2012-07-20

Applicant: Xin-Hua Huang ,  Ping-Yin Liu ,  Hung-Hua Lin ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

Inventor： Xin-Hua Huang ,  Ping-Yin Liu ,  Hung-Hua Lin ,  Yuan-Chih Hsieh ,  Lan-Lin Chao ,  Chia-Shiung Tsai

IPC: B32B38/10

CPC classification number: H01L21/67092 ,  Y10T156/11 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1944 ,  Y10T156/1972

Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.

Abstract translation: 公开了分离键合晶片的系统和方法。 在一个实施例中，用于分离接合的晶片的系统包括用于接合的晶片的支撑件和用于向结合的晶片施加纯粹的力的装置。 该系统还包括用于向接合晶片施加真空的装置。

公开(公告)号：US08809305B2

公开(公告)日：2014-08-19

申请号：US12458982

申请日：2009-07-29

Applicant: Michael Graeber ,  Yin Liu ,  Barbara Gore

Inventor： Michael Graeber ,  Yin Liu ,  Barbara Gore

IPC: A61K31/60 ,  A61P17/10 ,  A61K31/235 ,  A61K31/70

CPC classification number: A61K31/192 ,  A61K9/0014 ,  A61K31/327 ,  A61K2300/00

Abstract: A regimen for the safe and effective long-term treatment of acne vulgaris entails topically applying onto the affected skin area of a subject afflicted therewith, for a period of time of at least four (4) months, e.g., for at least twelve (12) months and advantageously on a daily basis and preferably once a day, a thus effective amount of a topical medicament containing adapalene and benzoyl peroxide, formulated into a pharmaceutically acceptable medium therefor.

Abstract translation: 用于安全和有效长期治疗寻常痤疮的方案需要局部应用于受影响的受试者的受影响的皮肤区域，持续至少四（4）个月的时间，例如至少十二（12） ）月，并且有利地每天，优选每天一次，由此有效量的含有阿达帕林和过氧化苯甲酰的局部药物配制成药学上可接受的介质。

公开(公告)号：US08809123B2

公开(公告)日：2014-08-19

申请号：US13488745

申请日：2012-06-05

Applicant: Ping-Yin Liu ,  Xin-Hua Huang ,  Lan-Lin Chao ,  Chia-Shiung Tsai

Inventor： Ping-Yin Liu ,  Xin-Hua Huang ,  Lan-Lin Chao ,  Chia-Shiung Tsai

IPC: H01L21/00

CPC classification number: H01L25/0657 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L24/92 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/03845 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/08147 ,  H01L2224/08502 ,  H01L2224/80097 ,  H01L2224/80203 ,  H01L2224/80204 ,  H01L2224/80345 ,  H01L2224/80805 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2224/80 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Three dimensional integrated circuit (3DIC) structures and hybrid bonding methods for semiconductor wafers are disclosed. A 3DIC structure includes a first semiconductor device having first conductive pads disposed within a first insulating material on a top surface thereof, the first conductive pads having a first recess on a top surface thereof. The 3DIC structure includes a second semiconductor device having second conductive pads disposed within a second insulating material on a top surface thereof coupled to the first semiconductor device, the second conductive pads having a second recess on a top surface thereof. A sealing layer is disposed between the first conductive pads and the second conductive pads in the first recess and the second recess. The sealing layer bonds the first conductive pads to the second conductive pads. The first insulating material is bonded to the second insulating material.

Abstract translation: 公开了用于半导体晶片的三维集成电路（3DIC）结构和混合键合方法。 3DIC结构包括第一半导体器件，其第一导电焊盘设置在其顶表面上的第一绝缘材料内，第一导电焊盘在其顶表面上具有第一凹部。 3DIC结构包括第二半导体器件，其第二导电焊盘设置在耦合到第一半导体器件的顶表面上的第二绝缘材料内，第二导电焊盘在其顶表面上具有第二凹槽。 密封层设置在第一导电垫和第一凹槽和第二凹槽中的第二导电垫之间。 密封层将第一导电焊盘连接到第二导电焊盘。 第一绝缘材料结合到第二绝缘材料上。

公开(公告)号：US08735260B2

公开(公告)日：2014-05-27

申请号：US12966756

申请日：2010-12-13

Applicant: Shang-Ying Tsai ,  Jung-Huei Peng ,  Hsin-Ting Huang ,  Hung-Hua Lin ,  Ming-Tung Wu ,  Ping-Yin Liu ,  Yao-Te Huang ,  Yuan-Chih Hsieh

Inventor： Shang-Ying Tsai ,  Jung-Huei Peng ,  Hsin-Ting Huang ,  Hung-Hua Lin ,  Ming-Tung Wu ,  Ping-Yin Liu ,  Yao-Te Huang ,  Yuan-Chih Hsieh

IPC: H01L21/30 ,  H01L21/46

CPC classification number: B81C1/00333 ,  B81B2207/07 ,  B81C1/00825 ,  B81C2201/053 ,  B81C2203/0109 ,  H01L2924/16235

Abstract: The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a bonding pad on a first substrate; forming wiring pads on the first substrate; forming a protection material layer on the first substrate, on sidewalls and top surfaces of the wiring pads, and on sidewalls of the bonding pad, such that a top surface of the bonding pad is at least partially exposed; bonding the first substrate to a second substrate through the bonding pad; opening the second substrate to expose the wiring pads; and removing the protection material layer.

Abstract translation: 本公开提供了一种制造微电子器件的方法。 该方法包括在第一基板上形成接合焊盘; 在所述第一基板上形成布线焊盘; 在所述第一基板上，在所述布线焊盘的侧壁和顶表面上以及所述焊盘的侧壁上形成保护材料层，使得所述焊盘的顶表面至少部分地露出; 通过接合焊盘将第一衬底接合到第二衬底; 打开第二基板以露出布线垫; 并去除保护材料层。

公开(公告)号：US20140058988A1

公开(公告)日：2014-02-27

申请号：US13593114

申请日：2012-08-23

Applicant: Dihui Lai ,  Yin Yin Liu ,  Victor Hokkiu Chan ,  Michael Campos

Inventor： Dihui Lai ,  Yin Yin Liu ,  Victor Hokkiu Chan ,  Michael Campos

IPC: G06N3/02

CPC classification number: G06N3/02 ,  G06N3/049

Abstract: Certain aspects of the present disclosure provide methods and apparatus for generating neural adaptive behavior, which may be based on neuromodulator-mediated meta-plasticity and/or gain control. In this manner, flexible associations between sensory cues and motor actions are generated, which enable an agent to efficiently gather rewards in a changing environment. One example method generally includes receiving one or more input stimuli; processing the received input stimuli to generate an output signal, wherein the processing is modulated with a first neuromodulation signal generated by a gain control unit; controlling the gain control unit to switch between at least two different neural activity modes, wherein at least one of a level or timing of the first neuromodulation signal generated by the gain control unit is determined based on the neural activity modes; and sending the output signal to an output unit.

Abstract translation: 本公开的某些方面提供用于产生神经适应行为的方法和装置，其可以基于神经调节剂介导的可塑性和/或增益控制。 以这种方式，产生感官提示和运动动作之间的灵活关联，这使得代理能够在不断变化的环境中有效地收集奖励。 一个示例性方法通常包括接收一个或多个输入刺激; 处理所接收的输入刺激以产生输出信号，其中所述处理由增益控制单元产生的第一神经调制信号进行调制; 控制增益控制单元在至少两种不同的神经活动模式之间切换，其中基于神经活动模式确定由增益控制单元产生的第一神经调节信号的电平或定时中的至少一个; 并将输出信号发送到输出单元。

公开(公告)号：US08638722B2

公开(公告)日：2014-01-28

申请号：US13063966

申请日：2009-09-16

Applicant: Hai Wang ,  Yang Hu ,  Yin Liu ,  Xinghua Song ,  Jianfeng Wang

Inventor： Hai Wang ,  Yang Hu ,  Yin Liu ,  Xinghua Song ,  Jianfeng Wang

IPC: H04W4/00

CPC classification number: H04B7/0413 ,  H04B7/0421 ,  H04B7/0617 ,  H04B7/0658 ,  H04L1/0606 ,  H04L1/0618 ,  H04L1/0668 ,  H04L5/0026 ,  H04L5/0051 ,  H04L25/0204 ,  H04L25/0226 ,  H04L25/0248 ,  H04L27/2613

Abstract: A method of operating a network node comprising one or more transmit antennas that are associated with a plurality of antenna ports includes transmitting a first user-equipment-(UE-) specific reference signal on a first antenna port and reusing the first UE-specific reference signal to transmit a second UE-specific reference signal on one of the first antenna port and a second antenna port. The second UE-specific reference signal is orthogonal to the first UE-specific reference signal.

Abstract translation: 一种操作包括与多个天线端口相关联的一个或多个发射天线的网络节点的方法包括：在第一天线端口上发送第一用户设备（UE）特定参考信号，并重新使用第一UE特定参考 信号，以在第一天线端口和第二天线端口之一上发送第二UE特定参考信号。 第二UE专用参考信号与第一UE专用参考信号正交。