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公开(公告)号：US08832935B2
公开(公告)日：2014-09-16
申请号：US12952537
申请日：2010-11-23
IPC分类号： H01K3/10 , H01L23/498 , H01L23/00 , H05K3/34 , H01L21/48
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/81192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/3452 , H05K2201/0191 , H05K2201/099 , H05K2203/041 , H05K2203/0557 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A method for manufacturing a printed wiring board including providing a structure having a wiring substrate having a conductor circuit, a build-up multilayer structure formed over the wiring substrate and having an outermost conductor circuit and an outermost insulative resin layer, and a solder resist layer formed over the outermost conductor circuit and outermost insulative resin layer and having openings with an opening diameter D for mounting electronic elements, forming conductor pads with a pitch of about 200 pm or less on the outermost conductor circuit in the openings of the solder resist layer, respectively, and forming solder bumps with a height H from a surface of the solder resist layer on the conductor pads on the conductor pads, respectively, such that a ratio H/D is about 0.55 to about 1.0.
摘要翻译： 一种印刷布线板的制造方法，其特征在于，具备具有布线基板的结构的布线基板，所述布线基板具有导体电路，在所述布线基板上形成的具有最外侧导体电路和最外层绝缘性树脂层的积层叠层结构，以及阻焊层 形成在最外导体电路和最外绝缘树脂层上，具有用于安装电子元件的开口直径D的开口，在阻焊层的开口中的最外导体电路上形成具有约200μm以下间距的导体焊盘， 并且分别在导体焊盘上的导体焊盘上形成具有高度H的阻焊层的焊料凸块，使得H / D的比率为约0.55至约1.0。
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公开(公告)号：US08022314B2
公开(公告)日：2011-09-20
申请号：US12622049
申请日：2009-11-19
IPC分类号： H05K1/11
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/42 , H01L21/4853 , H01L23/49811 , H01L23/544 , H01L24/81 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/3452 , H05K2201/0191 , H05K2201/099 , H05K2203/041 , H05K2203/0557 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.
摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，设置在所述布线基板的表面上的阻焊层，至少一个导体焊盘，所述导体焊盘由设置在所述焊料中的开口露出的所述导体电路的一部分形成 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷电路板中，由于至少一个导体焊盘以约200μm以下的间距排列，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。
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公开(公告)号：US20080190658A1
公开(公告)日：2008-08-14
申请号：US12099957
申请日：2008-04-09
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/15311 , H01L2924/3011 , H05K1/0271 , H05K1/113 , H05K1/116 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K3/4688 , H05K2201/0133 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , H05K2201/09454 , H05K2201/09536 , H05K2201/09563 , H05K2201/096 , H05K2201/09627 , H05K2201/09745 , H01L2924/00
摘要： An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely takes place in the interlaminar resin insulating layers in the vicinity of via-holes. The present invention is a multilayered printed circuit board comprising: a conductor circuit and an interlaminar resin insulating layer serially formed on a substrate in alternate fashion and in repetition, wherein a connection of the conductor circuits through the interlaminar resin insulating layers is performed by a via-hole, wherein via-holes in different level layers among the via-holes are formed so as to form a stack-via structure, and wherein at least one of the land diameters of the above-mentioned via-holes in different level layers having the stack via structure is different from the land diameters of other via-holes.
摘要翻译： 本发明的目的是提供一种具有导体电路的布线距离短的多层印刷电路板，可广泛选择导体电路的设计，并且由于在层间树脂绝缘层中几乎不发生破裂 通孔附近。 本发明是一种多层印刷电路板，包括：导体电路和层间树脂绝缘层，其以交替的方式和重复地串联形成在基板上，其中通过层间树脂绝缘层的导体电路的连接通过通孔 孔，其中形成通孔中的不同级别的通孔，以形成堆叠通孔结构，并且其中不同层级中的上述通孔的平台直径中的至少一个具有 堆叠通孔结构不同于其它通孔的焊盘直径。
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公开(公告)号：US20080149369A1
公开(公告)日：2008-06-26
申请号：US11944498
申请日：2007-11-23
CPC分类号： H01L21/4846 , H01L21/563 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K3/381 , H05K3/4602 , H05K2201/10674 , H05K2201/10977 , H05K2203/0278 , Y02P70/613 , Y10T29/49117 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T428/2804 , Y10T428/31511 , Y10T428/31681 , H01L2224/16225 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.
摘要翻译： 一种制造印刷电路板的方法包括制备具有导电电路的布线基板，在导电电路上涂覆阻焊层，使阻焊层的表面平整，以获得预定范围内的最大表面粗糙度 从阻焊层的表面除去树脂膜，在阻焊层的表面形成多个开口以暴露导电电路的多个部分，以形成用于安装电子部件的多个导电焊盘。
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公开(公告)号：US20070086147A1
公开(公告)日：2007-04-19
申请号：US11476559
申请日：2006-06-29
IPC分类号： H02B1/00
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/42 , H01L21/4853 , H01L23/49811 , H01L23/544 , H01L24/81 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/3452 , H05K2201/0191 , H05K2201/099 , H05K2203/041 , H05K2203/0557 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts. on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.
摘要翻译： 一种印刷电路板，包括配置有至少一个导体电路的布线基板，设置在布线基板的表面上的阻焊层，至少一个导体焊盘，由导体电路的一部分露出， 抗蚀剂层和用于安装电子部件的至少一个焊料凸块。 在导体垫上。 在印刷布线板中，由于至少一个导体焊盘以约200μm或更小的间距对准，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。
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公开(公告)号：US06342682B1
公开(公告)日：2002-01-29
申请号：US09633881
申请日：2000-08-07
申请人： Yoji Mori , Yoichiro Kawamura
发明人： Yoji Mori , Yoichiro Kawamura
IPC分类号： H01R909
CPC分类号： H05K1/116 , H05K1/0201 , H05K1/0224 , H05K1/0253 , H05K1/115 , H05K3/4602 , H05K2201/062 , H05K2201/093 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09681 , H05K2201/09727 , H05K2201/0979 , H05K2201/09881 , Y10T29/49126 , Y10T428/24917
摘要： A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.
摘要翻译： 印刷电路板，其中存在于作为光电极区域的焊盘周围的开口布置成使得其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的开口面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且提供从每个开口溢出的树脂或当在每个开口中填充树脂或均匀化时的树脂量。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现可靠的印刷布线板，其中不会导致断开而实现安全连接， 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。
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公开(公告)号：US06316738B1
公开(公告)日：2001-11-13
申请号：US08894342
申请日：1997-08-26
申请人： Yoji Mori , Yoichiro Kawamura
发明人： Yoji Mori , Yoichiro Kawamura
IPC分类号： H01R909
CPC分类号： H05K1/116 , H05K1/0201 , H05K1/0224 , H05K1/0253 , H05K1/115 , H05K3/4602 , H05K2201/062 , H05K2201/093 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09681 , H05K2201/09727 , H05K2201/0979 , H05K2201/09881 , Y10T29/49126 , Y10T428/24917
摘要： A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.
摘要翻译： 印刷电路板，其中存在于作为光电极区域的焊盘周围的开口布置成使得其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的开口面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且提供从每个开口溢出的树脂或当在每个开口中填充树脂或均匀化时的树脂量。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现可靠的印刷布线板，其中不会导致断开而实现安全连接， 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。
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公开(公告)号：US08222539B2
公开(公告)日：2012-07-17
申请号：US12490409
申请日：2009-06-24
申请人： Yoichiro Kawamura , Keisuke Shimizu
发明人： Yoichiro Kawamura , Keisuke Shimizu
IPC分类号： H05K1/11
CPC分类号： H05K1/185 , H01L24/24 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/24227 , H01L2224/92144 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H01L2924/3511 , H05K1/0231 , H05K1/0269 , H05K1/188 , H05K3/0035 , H05K3/025 , H05K3/4602 , H05K2201/09918 , H05K2201/10636 , H05K2201/10674 , H05K2203/0156 , H05K2203/063 , H05K2203/166 , Y02P70/611 , Y10T29/4913 , H01L2224/82 , H01L2924/00
摘要： A wiring board has a conductive pattern, an electronic component connected to the conductive pattern by means of a via hole, and a substrate where the electronic component is built into. The connection interface between the via hole and the electronic component inclines toward the connection interface between the via hole and the conductive pattern.
摘要翻译： 布线板具有导电图案，通过通孔连接到导电图案的电子部件和内置电子部件的基板。 通孔和电子部件之间的连接接口朝向通孔和导电图案之间的连接接口倾斜。
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公开(公告)号：US08003897B2
公开(公告)日：2011-08-23
申请号：US12713274
申请日：2010-02-26
IPC分类号： H05K1/11
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/16235 , H01L2224/81192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/3452 , H05K2201/0191 , H05K2201/099 , H05K2203/041 , H05K2203/0557 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board includes a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.
摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 通过使窄阻抗层的高度H与焊锡凸块的比例（H / D）在开口直径大约0.55至1.0左右，在窄间距结构下，在距离 设置在阻焊层上的开口约为200μm以下。
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公开(公告)号：US08001683B2
公开(公告)日：2011-08-23
申请号：US12023657
申请日：2008-01-31
申请人： Yoichiro Kawamura , Katsuhiko Tanno
发明人： Yoichiro Kawamura , Katsuhiko Tanno
CPC分类号： B23K3/0623 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2924/00014 , H05K3/3478 , H05K3/4644 , H05K2201/09481 , H05K2203/0195 , H05K2203/0557 , H05K2203/082 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/53204 , Y10T29/53209 , Y10T29/53213 , H01L2224/05599
摘要： This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving the loading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.
摘要翻译： 本发明提供了一种焊球加载装置，其使得能够在焊盘上加载精细的焊球，同时在回流时阻止空隙被卡入凹陷中。 供给非活性气体，从位于球形布置掩模上方的装载圆筒吸入惰性气体，以收集焊球。 通过使装载筒水平移动，将聚集的焊球滚动在球形布置掩模上，并且焊球通过球形布置掩模中的开口落到多层印刷线路板上的连接焊盘上。 通过在不活泼气体的气氛中加载焊球来防止焊球和回流时的空隙混合物的氧化。
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