摘要:
In one embodiment, a semiconductor chip package includes an insulation frame having an opening part formed in a center thereof and a via hole formed around the opening part; a semiconductor chip disposed cm the opening part; a conductive part filling the via hole; an inner insulation layer formed on bottom surfaces of the semiconductor chip and the insulation frame so as to expose a bottom surface of the conductive part; and an inner signal pattern formed on the inner insulation layer and electrically connecting the semiconductor chip and the conductive part. Embodiments also relate to a semiconductor module including a vertical stack of a plurality of the semiconductor chip packages, and to a method for manufacturing the same.
摘要:
A semiconductor package substrate is provided. The package substrate includes a mold base and an interposer block embedded in the mold base, said interposer block having a plurality of vertical conductive lines therein. A metallization layer is formed on the surface of the interposer block or the mold base, said metallization layer being electrically connected to at least one of the vertical conductive lines. A semiconductor chip may be mounted on or embedded in the mold base.
摘要:
This invention is about a bag for a pet. It has fluid acceptation space which is suitable for physical character of a pet. Also it makes a pet safe and a man easy to walk as wearing more closer to his body. It consist of a main body which of space made bottom gradient to body direction from the front of be in pet's head, a form frame which set a pair with a flexible cushion on open surface and get smaller in diameter, and a changeable length shoulder strap which link both of a main body.
摘要:
A chip size package for a semiconductor device according to the present invention is fabricated by: etching a copper film applied on an insulating film tape, except for longitudinal marginal portions of the copper film, metal pattern units thereof which are peripheral to portions corresponding to chip pads of a semiconductor chip and portions thereof connecting the longitudinal marginal portions and the metal pattern units; forming a solder mask on the insulating film tape excluding inner holes of the metal pattern units, the copper film excluding four edge portions of the longitudinal marginal portions thereof and exterior circular marginal portions of the metal pattern units; electroplating portions of surfaces of the metal pattern units on which the solder mask is not formed, for thereby forming metal pattern unit-electroplates; attaching the semiconductor chip to a bottom surface of the insulating film tape; sealing side surfaces and a bottom surface of the semiconductor chip with an epoxy mold compound; etching portions of the insulating film tape formed on the chip pads for thereby exposing the chip pads; electrically connecting by wires the metal pattern unit-electrodes and the corresponding chip pads; and eliminating portions of the copper film remaining at the four edge portions of the longitudinal marginal portions thereof and cutting the resultant insulating film tape to be separated into individual units.
摘要:
Disclosed here is a nucleic acid sequence encoding a recognition component of the N-end rule pathway. This nucleic acid sequence is characterized by the ability to specifically hybridize to the nucleic acid sequence of SEQ ID NO 1 under stringent hybridization conditions. Such conditions are defined below. Also disclosed is a nucleic acid sequence encoding a recognition component of the N-end rule pathway which is characterized by the ability to specifically hybridize to the nucleic acid sequence of SEQ ID NO 2 under stringent hybridization conditions. Also disclosed are DNA expression vectors containing nucleic acid sequences of the type described above, as well as cells transformed with such expression vectors. Further disclosed are applications for the compositions described above.
摘要翻译:这里公开了编码N末端规则途径的识别成分的核酸序列。 该核酸序列的特征在于在严格杂交条件下与SEQ ID NO 1的核酸序列特异性杂交的能力。 这些条件定义如下。 还公开了编码N末端规则通路的识别组分的核酸序列,其特征在于在严格杂交条件下与SEQ ID NO 2的核酸序列特异性杂交的能力。 还公开了含有上述类型的核酸序列的DNA表达载体以及用这种表达载体转化的细胞。 进一步公开的是上述组合物的应用。
摘要:
The invention provides methods and compositions for modulating angiogenesis in a subject. The methods of modulating angiogenesis in a subject include administering to the subject a modulator of N-terminal arginylation activity. The invention also provides a method of identifying such a modulator and a method of in vitro screening for modulators of N-terminal arginylation activity. Additionally, the invention provides a method of treating an angiogenesis-related disorder.
摘要:
Disclosed here is a nucleic acid sequence encoding a recognition component of the N-end rule pathway. This nucleic acid sequence is characterized by the ability to specifically hybridize to the nucleic acid sequence of SEQ ID NO 1 under stringent hybridization conditions. Such conditions are defined below. Also disclosed is a nucleic acid sequence encoding a recognition component of the N-end rule pathway which is characterized by the ability to specifically hybridize to the nucleic acid sequence of SEQ ID NO 2 under stringent hybridization conditions. Also disclosed are DNA expression vectors containing nucleic acid sequences of the type described above, as well as cells transformed with such expression vectors. Further disclosed are applications for the compositions described above.
摘要翻译:这里公开了编码N末端规则途径的识别成分的核酸序列。 该核酸序列的特征在于在严格杂交条件下与SEQ ID NO 1的核酸序列特异性杂交的能力。 这些条件定义如下。 还公开了编码N末端规则通路的识别组分的核酸序列,其特征在于在严格杂交条件下与SEQ ID NO 2的核酸序列特异性杂交的能力。 还公开了含有上述类型的核酸序列的DNA表达载体以及用这种表达载体转化的细胞。 进一步公开的是上述组合物的应用。
摘要:
In one embodiment, a semiconductor chip package includes an insulation frame having an opening part formed in a center thereof and a via hole formed around the opening part; a semiconductor chip disposed cm the opening part; a conductive part filling the via hole; an inner insulation layer formed on bottom surfaces of the semiconductor chip and the insulation frame so as to expose a bottom surface of the conductive part; and an inner signal pattern formed on the inner insulation layer and electrically connecting the semiconductor chip and the conductive part. Embodiments also relate to a semiconductor module including a vertical stack of a plurality of the semiconductor chip packages, and to a method for manufacturing the same.
摘要:
A semiconductor package is provided. The package includes a package substrate with a first surface and a second surface on the opposite side, and a plurality of via sets connecting vertically the first surface with the second surface, said via sets having a plurality of micro vias and filled with conductive material. The micro vias are grouped together, and the distance between micro vias in the via set is smaller than the distance between neighboring via sets.
摘要:
Screening assays that allow for the identification of agents that modulate the activity of the arginylation branch of the N-end rule pathway are provided. Also provided are method of using an agent that modulate the activity of the arginylation branch of the N-end rule pathway to increase or decrease protein degradation in a cell, and to modulate physiologic and pathologic associated with N-end rule pathway mediated arginylation.