公开(公告)号：US20100146777A1

公开(公告)日：2010-06-17

申请号：US12711746

申请日：2010-02-24

申请人： Yoon-Ah BAIK ,  Hyun-Chul JUNG

发明人： Yoon-Ah BAIK ,  Hyun-Chul JUNG

IPC分类号： H05K3/10

CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K3/381 ,  H05K2203/013 ,  H05K2203/0793 ,  H05K2203/1157 ,  Y10T29/49124

摘要： The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

公开(公告)号：US20080083698A1

公开(公告)日：2008-04-10

申请号：US11892844

申请日：2007-08-28

申请人： Hyun-Chyl Jung ,  Jae-Woo Joung ,  Myung-Joon Jang ,  Yoon-Ah Baik

发明人： Hyun-Chyl Jung ,  Jae-Woo Joung ,  Myung-Joon Jang ,  Yoon-Ah Baik

IPC分类号： H01B13/00 ,  B05D5/12

CPC分类号： H05K3/108 ,  H05K1/095 ,  H05K1/097 ,  H05K3/1241 ,  H05K3/245

摘要： The present invention relates to a method for forming fine wiring comprising: preparing a substrate for a printed circuit board; forming a metal thin sacrificial layer on the substrate using a first metal ink; forming a wiring on the metal thin sacrificial layer by inkjet printing using a second metal ink; and removing a portion of the metal thin sacrificial layer to form a wiring pattern. The method for forming fine wiring according to the invention can improve adhesiveness by using metal thin sacrificial layer and prevent spreading of ink in forming fine wiring.

摘要翻译： 本发明涉及一种形成精细布线的方法，包括：准备印刷电路板用基板; 使用第一金属油墨在所述基板上形成金属薄牺牲层; 通过使用第二金属油墨的喷墨印刷在所述金属薄牺牲层上形成布线; 以及去除所述金属薄牺牲层的一部分以形成布线图案。 根据本发明的形成精细布线的方法可以通过使用金属薄牺牲层来改善粘合性，并防止油墨在形成精细布线时的扩散。

公开(公告)号：US20070006983A1

公开(公告)日：2007-01-11

申请号：US11483845

申请日：2006-07-11

申请人： Young-Gun Ko ,  Hyun-Chul Jung ,  Jae-Chan Park ,  Shang-Hoon Seo ,  Myung-Joon Jang ,  Yoon-Ah Baik

发明人： Young-Gun Ko ,  Hyun-Chul Jung ,  Jae-Chan Park ,  Shang-Hoon Seo ,  Myung-Joon Jang ,  Yoon-Ah Baik

IPC分类号： D21C5/02

CPC分类号： H05K3/1208 ,  H05K3/1241 ,  H05K2203/0793 ,  H05K2203/1173

摘要： The present invention provides a method for forming a circuit line which may be formed simply and economically by alleviating spread of an ink and exhibit excellent electric conductivity by having even height of the formed ink. The present invention further provides a conductive board with excellent high-dense electric conductivity including fine circuit lines. According to one embodiment of the present invention, a method for forming fine circuit lines comprises (a) treating at least one side of a circuit line pattern to be formed on a base substrate with an alkali metal hydroxide solution and (b) treating a hydrophobic ink in accordance to a circuit line pattern to be formed.

摘要翻译： 本发明提供一种形成电路线路的方法，其可以通过减少油墨的扩散而简单且经济地形成，并且通过均匀的形成的油墨的高度显示优异的导电性。 本发明还提供一种具有优异的高密度导电性的导电板，包括精细的电路线。 根据本发明的一个实施方案，用于形成精细电路线的方法包括（a）用碱金属氢氧化物溶液处理要在基底上形成的电路线图案的至少一面，和（b）处理疏水性 油墨根据要形成的电路线图案。

公开(公告)号：US08293121B2

公开(公告)日：2012-10-23

申请号：US11892844

申请日：2007-08-28

申请人： Hyun-Chyl Jung ,  Jae-Woo Joung ,  Myung-Joon Jang ,  Yoon-Ah Baik

发明人： Hyun-Chyl Jung ,  Jae-Woo Joung ,  Myung-Joon Jang ,  Yoon-Ah Baik

IPC分类号： H01B13/00

CPC分类号： H05K3/108 ,  H05K1/095 ,  H05K1/097 ,  H05K3/1241 ,  H05K3/245

摘要： The present invention relates to a method for forming fine wiring comprising: preparing a substrate for a printed circuit board; forming a metal thin sacrificial layer on the substrate using a first metal ink; forming a wiring on the metal thin sacrificial layer by inkjet printing using a second metal ink; and removing a portion of the metal thin sacrificial layer to form a wiring pattern. The method for forming fine wiring according to the invention can improve adhesiveness by using metal thin sacrificial layer and prevent spreading of ink in forming fine wiring.

摘要翻译： 本发明涉及一种形成精细布线的方法，包括：准备印刷电路板用基板; 使用第一金属油墨在所述基板上形成金属薄牺牲层; 通过使用第二金属油墨的喷墨印刷在所述金属薄牺牲层上形成布线; 以及去除所述金属薄牺牲层的一部分以形成布线图案。 根据本发明的形成精细布线的方法可以通过使用金属薄牺牲层来改善粘合性，并防止油墨在形成精细布线时的扩散。

公开(公告)号：US20100149249A1

公开(公告)日：2010-06-17

申请号：US12711750

申请日：2010-02-24

申请人： Yoon-Ah Baik ,  Hyun-Chul Jung

发明人： Yoon-Ah Baik ,  Hyun-Chul Jung

IPC分类号： B41J2/015

CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K3/381 ,  H05K2203/013 ,  H05K2203/0793 ,  H05K2203/1157 ,  Y10T29/49124

摘要： The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

摘要翻译： 本发明涉及一种表面处理方法，一种形成电路线的方法，由此形成的印刷电路板，以及用于在基板上形成电路线的装置，其中简单，快速和经济地形成精细电路线。 本发明的电路线形成方法包括：（a）通过放电方法根据电路图案在基膜上选择性地施加包含碱金属化合物的表面处理溶液; （b）根据表面处理的电路图案涂覆包括金属纳米颗粒的导电油墨; 和（c）在还原气氛线下固化其上施加有导电油墨的基膜。

公开(公告)号：US20060223316A1

公开(公告)日：2006-10-05

申请号：US11278205

申请日：2006-03-31

申请人： Yoon-Ah BAIK ,  Hyun-Chul Jung

发明人： Yoon-Ah BAIK ,  Hyun-Chul Jung

IPC分类号： H01L21/302

CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K3/381 ,  H05K2203/013 ,  H05K2203/0793 ,  H05K2203/1157 ,  Y10T29/49124

摘要： The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

摘要翻译： 本发明涉及一种表面处理方法，一种形成电路线的方法，由此形成的印刷电路板，以及用于在基板上形成电路线的装置，其中简单，快速和经济地形成精细电路线。 本发明的电路线形成方法包括：（a）通过放电方法根据电路图案在基膜上选择性地施加包含碱金属化合物的表面处理溶液; （b）根据表面处理的电路图案涂覆包括金属纳米颗粒的导电油墨; 和（c）在还原气氛线下固化其上施加有导电油墨的基膜。

公开(公告)号：US07682652B2

公开(公告)日：2010-03-23

申请号：US11278205

申请日：2006-03-31

申请人： Yoon-Ah Baik ,  Hyun-Chul Jung

发明人： Yoon-Ah Baik ,  Hyun-Chul Jung

IPC分类号： B05D5/12

CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K3/381 ,  H05K2203/013 ,  H05K2203/0793 ,  H05K2203/1157 ,  Y10T29/49124

摘要： The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

摘要翻译： 本发明涉及一种表面处理方法，一种形成电路线的方法，由此形成的印刷电路板，以及用于在基板上形成电路线的装置，其中简单，快速和经济地形成精细电路线。 本发明的电路线形成方法包括：（a）通过放电方法根据电路图案在基膜上选择性地施加包含碱金属化合物的表面处理溶液; （b）根据表面处理的电路图案涂覆包括金属纳米颗粒的导电油墨; 和（c）在还原气氛线下固化其上施加有导电油墨的基膜。

公开(公告)号：US20080081125A1

公开(公告)日：2008-04-03

申请号：US11902486

申请日：2007-09-21

申请人： Hyun-Chul Jung ,  Jae-Woo Joung ,  Hye-Jin Cho ,  Yoon-Ah Baik ,  Sung-Il Oh

发明人： Hyun-Chul Jung ,  Jae-Woo Joung ,  Hye-Jin Cho ,  Yoon-Ah Baik ,  Sung-Il Oh

IPC分类号： C23C18/00 ,  H05H1/00

CPC分类号： H05K3/28 ,  H05K3/0091 ,  H05K2203/013

摘要： A method for manufacturing cover lay of printed circuit board is disclosed. With a method that includes preparing a board on which a circuit pattern is formed, and jetting a protecting ink selectively on the board by inkjet printing, a cover lay of a complicated shape may be formed easily with high accuracy and high productivity, as a polymer ink is jetted by inkjet printing to form the cover lay for a flexible circuit board.

摘要翻译： 公开了印刷电路板盖板的制造方法。 通过包括制备在其上形成电路图案的板并且通过喷墨印刷在板上选择性地喷射保护油墨的方法，可以以高精度和高生产率容易地形成复杂形状的盖板作为聚合物 通过喷墨打印喷墨，形成柔性电路板的盖板。