公开(公告)号：US20090104766A1

公开(公告)日：2009-04-23

申请号：US12225741

申请日：2007-03-30

申请人： Yoshihiro Gomi ,  Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hirotaka Oosato

发明人： Yoshihiro Gomi ,  Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hirotaka Oosato

IPC分类号： H01L21/443

CPC分类号： C23C14/541 ,  B23K1/0016 ,  B23K3/0607 ,  C23C14/042 ,  C23C14/228 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079

摘要： The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate. The method comprises the steps of: forming a straight hole (34) in a mask layer (30) covering one side surface of a substrate (10) on which a wiring pattern (12) is formed, wherein a prescribed position of the wiring pattern (12) is exposed in a bottom surface of the straight hole and the straight hole has an inner wall perpendicular to the one side surface of the substrate (10) and a sharp top opening portion; providing a metal plate, whose area is larger than that of the substrate (10), on the other side surface of the substrate (10) as a heat sink; placing the substrate (10) and the metal plate in a vacuum; forming a tapered metal bump (14) on the exposed surface of the wiring pattern (12), which is exposed in the bottom surface of the straight hole (34), by a gas deposition process, in which metal nanoparticles obtained by evaporating a metal are ejected from a nozzle together with a carrier gas so as to deposit on the prescribed position, with cooling the substrate (10) to a temperature lower than upper temperature limit of resin constituting the mask layer (30), by the metal plate as the heat sink, so as to retain a configuration of the straight hole (34); and removing the mask layer (30) from the one side surface of the substrate so as to complete the tapered metal bump (14) at the prescribed position of the wiring pattern (12).

摘要翻译： 本发明提供一种通过气相沉积工艺在形成在基板的一个侧表面上的金属部件的规定位置上形成能够稳定地和工业上形成微小金属凸块的微型金属凸块的方法。 该方法包括以下步骤：在覆盖其上形成有布线图案（12）的基板（10）的一个侧表面的掩模层（30）中形成直孔（34），其中布线图案 （12）暴露在直孔的底面上，直孔具有与基板（10）的一个侧面垂直的内壁和尖锐的开口部; 在作为散热器的基板（10）的另一侧表面上设置面积比基板（10）的面积大的金属板; 将基板（10）和金属板放置在真空中; 在通过气相沉积工艺暴露在直孔（34）的底表面中的布线图案（12）的暴露表面上形成锥形金属凸块（14），其中通过蒸发金属 与载气一起从喷嘴喷射，以便沉积在规定位置，通过金属板作为基板（10）冷却至低于构成掩模层（30）的树脂的上限温度的温度 散热器，以保持直孔（34）的构造; 以及从所述基板的一个侧表面去除所述掩模层（30），以在所述布线图案（12）的规定位置处完成所述锥形金属凸块（14）。

公开(公告)号：US20220103052A1

公开(公告)日：2022-03-31

申请号：US17449294

申请日：2021-09-29

申请人： Yoshihiro GOMI ,  Takanori KATO ,  Yuki TAKAHASHI

发明人： Yoshihiro GOMI ,  Takanori KATO ,  Yuki TAKAHASHI

IPC分类号： H02K33/16

摘要： Provided is a vibration actuator including: a movable body including a coil and a core around which the coil is wound; a fixing body including a magnet; and a shaft part turnably supporting the movable body with respect to the fixing body on a side of the one end part of the core. The movable body reciprocatingly and rotationally vibrates around the shaft part with respect to the fixing body by cooperation between the coil to be energized and the magnet. The magnet is disposed to face the other end part of the core in an extending direction of the core when energization is not performed. The magnet includes two magnetic poles having different polarities and arranged in a reciprocating and rotational vibration direction. A weight part is disposed in a notch on a side of the other end part of the core or in the coil.

公开(公告)号：US07767574B2

公开(公告)日：2010-08-03

申请号：US12225741

申请日：2007-03-30

申请人： Yoshihiro Gomi ,  Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hirotaka Oosato

发明人： Yoshihiro Gomi ,  Masahiro Aoyagi ,  Hiroshi Nakagawa ,  Katsuya Kikuchi ,  Yoshikuni Okada ,  Hirotaka Oosato

IPC分类号： H01L21/44

CPC分类号： C23C14/541 ,  B23K1/0016 ,  B23K3/0607 ,  C23C14/042 ,  C23C14/228 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079

摘要： The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate. The method comprises the steps of: forming a straight hole (34) in a mask layer (30) covering one side surface of a substrate (10) on which a wiring pattern (12) is formed, wherein a prescribed position of the wiring pattern (12) is exposed in a bottom surface of the straight hole and the straight hole has an inner wall perpendicular to the one side surface of the substrate (10) and a sharp top opening portion; providing a metal plate, whose area is larger than that of the substrate (10), on the other side surface of the substrate (10) as a heat sink; placing the substrate (10) and the metal plate in a vacuum; forming a tapered metal bump (14) on the exposed surface of the wiring pattern (12), which is exposed in the bottom surface of the straight hole (34), by a gas deposition process, in which metal nanoparticles obtained by evaporating a metal are ejected from a nozzle together with a carrier gas so as to deposit on the prescribed position, with cooling the substrate (10) to a temperature lower than upper temperature limit of resin constituting the mask layer (30), by the metal plate as the heat sink, so as to retain a configuration of the straight hole (34); and removing the mask layer (30) from the one side surface of the substrate so as to complete the tapered metal bump (14) at the prescribed position of the wiring pattern (12).

摘要翻译： 本发明提供一种通过气相沉积工艺在形成在基板的一个侧表面上的金属部件的规定位置上形成能够稳定地和工业上形成微小金属凸块的微型金属凸块的方法。 该方法包括以下步骤：在覆盖其上形成有布线图案（12）的基板（10）的一个侧表面的掩模层（30）中形成直孔（34），其中布线图案 （12）暴露在直孔的底面上，直孔具有与基板（10）的一个侧面垂直的内壁和尖锐的开口部; 在作为散热器的基板（10）的另一侧表面上设置面积比基板（10）的面积大的金属板; 将基板（10）和金属板放置在真空中; 在通过气相沉积工艺暴露在直孔（34）的底表面中的布线图案（12）的暴露表面上形成锥形金属凸块（14），其中通过蒸发金属 与载气一起从喷嘴喷射，以便沉积在规定位置，通过金属板作为基板（10）冷却至低于构成掩模层（30）的树脂的上限温度的温度 散热器，以保持直孔（34）的构造; 以及从所述基板的一个侧表面去除所述掩模层（30），以在所述布线图案（12）的规定位置处完成所述锥形金属凸块（14）。