公开(公告)号：US08650420B2

公开(公告)日：2014-02-11

申请号：US13395070

申请日：2009-09-09

申请人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

发明人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

IPC分类号： G06F1/26

CPC分类号： G06F1/20 ,  G06F1/3203 ,  H02J3/005 ,  H02J3/14 ,  Y02B70/3225 ,  Y04S20/222 ,  Y04S20/224

摘要： In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.

摘要翻译： 在包括信息处理设备组和设备设备组的信息处理系统中，获得了性能的提高和功耗的降低，从而实现了高效且灵活的操作管理。 多个信息处理设备被分成多个组，每个组包括供电设备和冷却设备。 信息处理系统的操作管理方法包括：从各组中获取表示信息处理设备的性能和功耗的操作信息的步骤，供电设备和包括在每个 团体 以及用于基于操作信息控制包括在每个组中的信息处理设备，供电设备和冷却设备的另一过程，使得相对于功耗的性能变大。

公开(公告)号：US20130098597A1

公开(公告)日：2013-04-25

申请号：US13589549

申请日：2012-08-20

申请人： Takayuki FUJIMOTO ,  Yoshihiro KONDO

发明人： Takayuki FUJIMOTO ,  Yoshihiro KONDO

IPC分类号： G05D23/00

CPC分类号： H05K7/20745 ,  F24F11/0008 ,  F24F11/30 ,  F24F2011/0006 ,  F24F2110/20 ,  H05K7/20836 ,  Y02B30/542

摘要： From a plurality of preset operation modes, an optimal mode is selected to let the supply air 206 attain a predetermined temperature and humidity. Upon adjusting the opening degrees of dampers 116-119, a cold water valve 156 and a humidifying water valve 154, the system measures the outside air 201, supply air 206 and return air 207 for temperature and humidity to see if a mode boundary is exceeded. If the boundary is exceeded, an assessment time is set. The humidity of the supply air 206 in the mode in effect before the boundary is exceeded is further predicted so as to determine whether the predicted value exceeds the upper limit of a tolerable humidity range or drops below the lower limit thereof.

摘要翻译： 从多个预设操作模式中，选择最佳模式以使供应空气206达到预定的温度和湿度。 在调节阻尼器116-119的开度，冷水阀156和加湿水阀154时，该系统测量外部空气201，供应空气206和回流空气207以获得温度和湿度，以查看是否超过模式边界 。 如果超出边界，则设置评估时间。 进一步预测在超过边界之前有效的模式中的供给空气206的湿度，以便确定预测值是否超过容许湿度范围的上限或低于其下限。

公开(公告)号：US20110048676A1

公开(公告)日：2011-03-03

申请号：US12852556

申请日：2010-08-09

申请人： Hiroyuki TOYODA ,  Tadakatsu NAKAJIMA ,  Yoshihiro KONDO ,  Shigeyuki SASAKI ,  Akio IDEI ,  Shigemasa SATOH

发明人： Hiroyuki TOYODA ,  Tadakatsu NAKAJIMA ,  Yoshihiro KONDO ,  Shigeyuki SASAKI ,  Akio IDEI ,  Shigemasa SATOH

IPC分类号： F28D15/02

CPC分类号： F28D15/0266 ,  F28D1/05366 ,  F28D15/046 ,  F28F1/325 ,  F28F13/187 ,  F28F2215/12 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

摘要翻译： 一种在其中施加热虹吸的冷却系统，具有优异的节能和/或生态学，有效的冷却，以及在其中应用的电子设备，特别是用于冷却安装在印刷电路板100内的CPU 200 其壳体包括与在其中产生加热的CPU的表面热连接的热接收套310，并且用于通过发热而蒸发存储在减压内部空间中的液体制冷剂;冷凝器320，用于从 在其减压的内部空间内的热接收套管，并且通过将热量传递到设备的外部，蒸气管331和液体返回管332将制冷剂蒸汽冷凝成液体，同时施加热虹吸 用于使制冷剂由于其相变而循环，其中，冷凝器在其内壁表面上沿着r的流动方向形成细槽 制冷剂，并且也在其横截面上形成为平坦的，用于有效地从其受热套管的内壁表面冷却制冷剂蒸汽。

公开(公告)号：US07839640B2

公开(公告)日：2010-11-23

申请号：US12544137

申请日：2009-08-19

申请人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

发明人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

IPC分类号： H05K7/20

CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。

公开(公告)号：US20100291490A1

公开(公告)日：2010-11-18

申请号：US12662632

申请日：2010-04-27

申请人： Toyohisa Tsuruda ,  Yoshihiro Kondo ,  Atsushi Ookouchi ,  Masahiro Yamamoto

发明人： Toyohisa Tsuruda ,  Yoshihiro Kondo ,  Atsushi Ookouchi ,  Masahiro Yamamoto

IPC分类号： G03F7/20

CPC分类号： G03F7/40 ,  H01L21/67155

摘要： A resist pattern slimming treatment method includes: a slimming treatment step of performing a slimming treatment on a resist pattern by applying a solution containing an acid onto a substrate having the resist pattern formed thereon, then performing a heat treatment, and then performing a developing treatment. A database storing kinds of resist material for the resist pattern, concentrations of acid contained in a solution to be applied onto the substrate having the resist pattern formed thereon, and line widths of the resist pattern corresponding to the kinds of resist material and the concentrations of acid is prepared in advance. The concentration of the acid contained in the solution used in the slimming treatment step is based on a concentration of the acid obtained from the database, using, as search keys, the kind of resist material and a target value of the line width of the resist pattern.

摘要翻译： 抗蚀剂图案减肥处理方法包括：减肥处理步骤，通过将含有酸的溶液涂布在其上形成有抗蚀剂图案的基材上，然后进行热处理，然后进行显影处理，对抗蚀剂图案进行减肥处理 。 存储抗蚀剂图案的各种抗蚀剂材料的数据库，涂布在其上形成有抗蚀剂图案的基板上的溶液中所含的酸的浓度，以及与抗蚀剂材料的种类对应的抗蚀剂图案的线宽度 预先准备酸。 在减肥处理步骤中使用的溶液中所含的酸的浓度基于从数据库中获得的酸的浓度，使用作为搜索关键字的抗蚀剂材料的种类和抗蚀剂的线宽度的目标值 模式。

公开(公告)号：US20080091381A1

公开(公告)日：2008-04-17

申请号：US11869237

申请日：2007-10-09

申请人： Kunie OGATA ,  Shinichi Shinozuka ,  Yoshihiro Kondo

发明人： Kunie OGATA ,  Shinichi Shinozuka ,  Yoshihiro Kondo

IPC分类号： G01B21/02

CPC分类号： G03F7/70625 ,  G03F7/70525 ,  H01L22/20

摘要： In the present invention, substrates in a plurality of lots are successively processed in a coating and developing treatment system, and line width measurement is performed for some of substrates of the substrate which have been through processing in each lot. The line width measurement of two successive lots is performed such that the last line width measurement in the previous lot of the two successive lots has been completed at the time of completion of processing of a substrate which is first subjected to the line width measurement in the subsequent lot. According to the present invention, the measurement of product substrates can be performed without decreasing the throughput of the product substrates.

摘要翻译： 在本发明中，多个批次中的基板在涂布显影处理系统中连续地进行处理，并且对于已经通过每个批次处理的基板的一些基板进行线宽测量。 执行两个连续批次的线宽测量，使得在完成对在第一次进行线宽测量的基板的处理完成时，两个连续批次的前一批次中的最后一行宽度测量已经完成 随后很多。 根据本发明，可以在不降低产品基板的生产量的情况下进行产品基板的测量。

公开(公告)号：US06987668B2

公开(公告)日：2006-01-17

申请号：US10847334

申请日：2004-05-18

申请人： Makoto Kitano ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Noriyuki Ashiwake ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

发明人： Makoto Kitano ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Noriyuki Ashiwake ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

IPC分类号： G06F1/20

CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

摘要： A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

摘要翻译： 一种液体冷却系统，具有用于循环冷却液的循环器，包括用于接收冷却液的输入部分和用于供应冷却液的单独的输出部分。 供给来自循环器的冷却液的受热套，并且被配置为接收从发热体产生的热量，散热部，其由通过所述受热外套的冷却液供给的散热用的散热部，以及用于循环的部件 冷却液通过散热部分进入循环装置，使得冷却液体在封闭的流动通道内循环。 在封闭流路的一部分内进一步形成蓄积部，用于将冷却液积存在其中。

公开(公告)号：US06885556B2

公开(公告)日：2005-04-26

申请号：US10874232

申请日：2004-06-24

申请人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

发明人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

IPC分类号： G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

摘要翻译： 一种电子设备，包括在其内部安装半导体元件的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件和用于驱动液体的液体驱动器 散热构件和受热构件之间的冷却剂。 该装置还包括储存有至少预定体积的冷却剂的液体冷却剂的罐，以限定罐内的冷却剂表面，其中罐，散热构件和受热构件与管连接， 连接到罐中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与罐的位置的变化无关。

公开(公告)号：US20050046781A1

公开(公告)日：2005-03-03

申请号：US10902131

申请日：2004-07-30

申请人： Yoshihiro Kondo ,  Nariaki Shigyo

发明人： Yoshihiro Kondo ,  Nariaki Shigyo

IPC分类号： G02F1/13 ,  G02F1/133 ,  G02F1/1333

CPC分类号： G02F1/133385

摘要： A liquid crystal panel device, being able to transfer heat generation within each of cells building up a panel, into an outside thereof, effectively, therefore being suitable for use in a liquid crystal projection, etc., comprises: a TFT substrate 30, which is formed with semiconductor portions 24 and pattern layers 28 in large numbers on the surface thereof; an opposed substrate 29; and a liquid crystal layer 27 hermetically enclosed between them, wherein heat interruption layers 31 are formed on a surface of the opposed substrate, in opposite to the liquid crystal layer, at the same positions to those of the semiconductor portions, which are formed on the FTF substrate 30, and further comprises an anti-dust glass plate 23 disposed at the light-inlet side thereof, so as to define a space, including a gap 11 and grooves 32, for receiving a cooling liquid 11 therein, on the opposite side surface of the opposed substrate, in vicinity of the heat interruption layers, thereby achieving cooling, effectively, so as to obtain the liquid crystal panel device being long in the lifetime and high in reliability thereof.

摘要翻译： 能够有效地将构成面板的单电池内的发热量有效地传递到其外部的液晶面板装置，因此适用于液晶投影等，包括：TFT基板30，其中 在其表面上形成有大量的半导体部分24和图案层28; 相对基板29; 以及气密地包围在它们之间的液晶层27，其中在相对基板的与液晶层相反的表面上形成有与在半导体部分形成的相同位置处的热中断层31 FTF基板30，并且还包括设置在其光入口侧的防尘玻璃板23，以便限定在其相对侧上具有用于容纳冷却液11的间隙11和槽32的空间 相对基板的表面，在热断层附近，从而有效地实现冷却，从而获得液晶面板装置的寿命长并且其可靠性高。

公开(公告)号：US06430042B1

公开(公告)日：2002-08-06

申请号：US09653584

申请日：2000-08-31

申请人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Tsuyoshi Nakagawa

发明人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Takashi Naganawa ,  Tsuyoshi Nakagawa

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic apparatus comprises a semiconductor element mounted inside a housing, a keyboard fitted to the housing, a heat radiating member provided on one face of the semiconductor element and a thermal conductive duct provided on the other face of the element. The electronic apparatus further comprises a wall thermally connecting an upper wall and a lower wall of the duct. The duct is provided with a fan.

摘要翻译： 电子设备包括安装在壳体内的半导体元件，装配到壳体的键盘，设置在半导体元件的一个面上的散热构件和设置在元件的另一个面上的导热管。 电子设备还包括热连接管道的上壁和下壁的壁。 管道设有风扇。