Reactive sputtering apparatus
    1.
    发明授权
    Reactive sputtering apparatus 有权
    反应溅射装置

    公开(公告)号:US09034152B2

    公开(公告)日:2015-05-19

    申请号:US13310230

    申请日:2011-12-02

    IPC分类号: H01J37/34 C23C14/00

    摘要: A reactive sputtering apparatus includes a chamber, a substrate holder provided in the chamber, a target holder which is provided in the chamber and configured to hold a target, a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber, a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space, an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber, and a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering.

    摘要翻译: 反应性溅射装置包括室,设置在室中的基板保持器,设置在室中并构造成保持目标的目标保持器,设置在室中的沉积屏蔽板,以在第二区域之间形成溅射空间, 目标保持架和基板支架,防止溅射粒子附着在室内壁;反应性气体引入管,被配置为将溅射空间引入反应气体;将惰性气体引入到惰性气体导入口 落在溅射空间内部和室内的空间,以及防止溅射颗粒从溅射中安装在靶保持体上的靶的溅射粒子附着在反应性气体导入管的导入口上的屏蔽部件。

    REACTIVE SPUTTERING APPARATUS
    2.
    发明申请
    REACTIVE SPUTTERING APPARATUS 有权
    反应溅射装置

    公开(公告)号:US20120152736A1

    公开(公告)日:2012-06-21

    申请号:US13310230

    申请日:2011-12-02

    IPC分类号: C23C14/34

    摘要: A reactive sputtering apparatus includes a chamber, a substrate holder provided in the chamber, a target holder which is provided in the chamber and configured to hold a target, a deposition shield plate which is provided in the chamber so as to form a sputtering space between the target holder and the substrate holder, and prevents a sputter particle from adhering to an inner wall of the chamber, a reactive gas introduction pipe configured to introduce a reactive gas into the sputtering space, an inert gas introduction port which introduces an inert gas into a space that falls outside the sputtering space and within the chamber, and a shielding member which prevents a sputter particle from the target mounted on the target holder from adhering to an introduction port of the reactive gas introduction pipe upon sputtering.

    摘要翻译: 反应性溅射装置包括室,设置在室中的基板保持器,设置在室中并构造成保持目标的目标保持器,设置在室中的沉积屏蔽板,以在第二区域之间形成溅射空间, 目标保持架和基板支架,防止溅射粒子附着在室内壁;反应性气体引入管,被配置为将溅射空间引入反应气体;将惰性气体引入到惰性气体导入口 落在溅射空间内部和室内的空间,以及防止溅射颗粒从溅射中安装在靶保持体上的靶的溅射粒子附着在反应性气体导入管的导入口上的屏蔽部件。