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公开(公告)号：US20070148406A1
公开(公告)日：2007-06-28
申请号：US11641888
申请日：2006-12-20
申请人： Yoshiyasu Ando , Toshiharu Kondo , Tatsuji Mizuno
发明人： Yoshiyasu Ando , Toshiharu Kondo , Tatsuji Mizuno
IPC分类号： B32B3/12
CPC分类号： C04B38/0009 , C04B2111/00793 , Y10T428/24149 , Y10T428/24157 , Y10T428/24165 , C04B35/195
摘要： A hexagonal cell honeycomb structure body has a plurality of hexagonal cells. Each hexagonal cell is surrounded by six cell walls in a hexagonal lattice shape. A R-shaped corner part of an approximate circular-arc shape is alternately formed at interior angle parts of the six cell walls forming each hexagonal cell. The three R-shaped corner parts are at the alternate internal corners of each hexagonal cell observed from a cross section of the axis direction of the hexagonal cell honeycomb structure body. A radius of curvature of each R-shaped corner part is larger than that of the interior corner part having no R-shaped corner part. The minimum radius of curvature of the R-shaped corner part is 2.8 to 5 times of a thickness of each hexagonal cell wall, namely within a range of 0.25 mm to 0.45 mm.
摘要翻译： 六边形单元蜂窝结构体具有多个六边形单元。 每个六角形单元被六角格子形状的六个单元格壁围绕。 在形成每个六边形单元的六个单元壁的内角部分交替形成大致圆弧形的R形角部。 三角形的角部位于从六边形单元状蜂窝结构体的轴方向的截面观察的每个六边形单元的交替的内角。 每个R形角部的曲率半径大于没有R形角部的内角部的曲率半径。 R形角部的最小曲率半径是每个六边形孔壁的厚度的2.8〜5倍，即在0.25mm〜0.45mm的范围内。
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2.发明授权Semiconductor pressure sensor and method for bonding semiconductor chip to metal diaphragm thereof 失效半导体压力传感器及其半导体芯片与金属膜结合的方法
公开(公告)号：US4986861A
公开(公告)日：1991-01-22
申请号：US322561
申请日：1989-03-13
CPC分类号： G01L19/0084 , G01L19/147 , G01L9/0055
摘要： A semiconductor pressure sensor having a cylindrical housing with an opening formed at its tip end which is exposed to a pressure atmosphere and a metal diaphragm for receiving pressure, which is formed in a wall of the cylindrical housing defining the opening. A metal oxide layer is formed in a surface of the metal diaphragm by oxidizing the surface of the metal diaphragm, and a glass layer is formed on the metal oxide layer. A semiconductor chip, on which a strain gauge is formed, is firmly and surely bonded to the metal diaphragm through the glass layer by virtue of the metal oxide layer. This semiconductor pressure sensor can measure high pressure with sufficient sensitivity and high accuracy.
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公开(公告)号：US20150135558A1
公开(公告)日：2015-05-21
申请号：US14399153
申请日：2012-05-10
IPC分类号： A43B13/22
CPC分类号： A43B13/223 , A43B13/14 , A43B13/141
摘要： A shoe sole including: an outsole having a tread surface to be in contact with a road surface; and a midsole arranged on the outsole, wherein: the midsole is exposed in a central section of a rear foot section and an arch section; in the central section and a lateral side section of the rear foot section of the shoe sole, a diagonal groove is formed extending in a diagonal front-rear direction in the rear foot section to an outer edge of a lateral side of the rear foot section; an angle β, formed between a virtual center line of the diagonal groove and a longitudinal axis connecting between a center of a heel and a middle point between a big-toe ball and a little-toe ball, is set in a range of 12° to 35°; and a virtual intersection point between the longitudinal axis and the center line is set within a range of 21% to 43% of a full length of the longitudinal axis of the shoe sole from a posterior end of the shoe sole, the diagonal groove extending to a point anterior and medial to the intersection point.
摘要翻译： 一种鞋底，包括：具有与路面接触的胎面的外底; 以及布置在所述外底上的中底，其中：所述中底露出在后脚部和拱形部分的中心部分中; 在鞋底的中央部分和后脚部分的横向侧部分中，形成在后脚部分中沿对角线前后方向延伸到后足部分的侧面的外边缘的对角槽 ; 形成在斜槽的虚拟中心线和连接脚跟中心与大脚趾球与小脚趾球之间的中点之间的纵轴的角度bgr设定在12 °至35°; 并且纵轴和中心线之间的虚拟交点设置在鞋底的纵向轴线的整个长度的21％至43％的范围内，鞋底的后端延伸到 交叉点前后中点。
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公开(公告)号：US07504146B2
公开(公告)日：2009-03-17
申请号：US11641888
申请日：2006-12-20
申请人： Yoshiyasu Ando , Toshiharu Kondo , Tatsuji Mizuno
发明人： Yoshiyasu Ando , Toshiharu Kondo , Tatsuji Mizuno
IPC分类号： B32B3/12
CPC分类号： C04B38/0009 , C04B2111/00793 , Y10T428/24149 , Y10T428/24157 , Y10T428/24165 , C04B35/195
摘要： A hexagonal cell honeycomb structure body has a plurality of hexagonal cells. Each hexagonal cell is surrounded by six cell walls in a hexagonal lattice shape. A R-shaped corner part of an approximate circular-arc shape is alternately formed at interior angle parts of the six cell walls forming each hexagonal cell. The three R-shaped corner parts are at the alternate internal corners of each hexagonal cell observed from a cross section of the axis direction of the hexagonal cell honeycomb structure body. A radius of curvature of each R-shaped corner part is larger than that of the interior corner part having no R-shaped corner part. The minimum radius of curvature of the R-shaped corner part is 2.8 to 5 times of a thickness of each hexagonal cell wall, namely within a range of 0.25 mm to 0.45 mm.
摘要翻译： 六边形单元蜂窝结构体具有多个六边形单元。 每个六角形单元被六角格子形状的六个单元格壁围绕。 在形成每个六边形单元的六个单元壁的内角部分交替形成大致圆弧形的R形角部。 三角形的角部位于从六边形单元状蜂窝结构体的轴方向的截面观察的每个六边形单元的交替的内角。 每个R形角部的曲率半径大于没有R形角部的内角部的曲率半径。 R形角部的最小曲率半径是每个六边形孔壁的厚度的2.8〜5倍，即在0.25mm〜0.45mm的范围内。
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公开(公告)号：US4840067A
公开(公告)日：1989-06-20
申请号：US50031
申请日：1987-05-15
CPC分类号： G01L19/0084 , G01L19/147 , G01L9/0055
摘要： A semiconductor pressure sensor having a cylindrical housing with an opening formed at its tip end which is exposed to a pressure atmosphere and a metal diaphragm for receiving pressure which is formed in a wall of the cylindrical housing defining the opening. A metal oxide layer is formed in a surface of the metal diaphragm by oxidizing the surface of the metal diaphragm, and a glass layer is formed on the metal oxide layer. A semiconductor chip, on which a strain gauge is formed, is firmly and surely bonded to the metal diaphragm through the glass layer by virtue of the metal oxide layer. This semiconductor pressure sensor can measure high pressure with sufficient sensitivity and high accuracy.
摘要翻译： 一种具有圆筒形壳体的半导体压力传感器，其具有形成在其顶端处的开口，其暴露于压力气氛中，并且金属隔膜用于接收形成在限定开口的圆柱形壳体的壁中的压力。 通过氧化金属隔膜的表面，在金属隔膜的表面上形成金属氧化物层，在金属氧化物层上形成玻璃层。 通过金属氧化物层，通过玻璃层牢固且可靠地将形成有应变计的半导体芯片结合到金属隔膜。 该半导体压力传感器可以以足够的灵敏度和高精度测量高压。
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