公开(公告)号：US20120240958A1

公开(公告)日：2012-09-27

申请号：US13427370

申请日：2012-03-22

申请人： Ayumi HIGUCHI ,  Yoshiyuki FUJITANI ,  Takemitsu MIURA ,  Rei TAKEAKI

发明人： Ayumi HIGUCHI ,  Yoshiyuki FUJITANI ,  Takemitsu MIURA ,  Rei TAKEAKI

IPC分类号： B08B3/04 ,  B08B3/02

CPC分类号： H01L21/67248 ,  B08B3/024 ,  B08B3/04 ,  B08B3/10 ,  B08B3/108 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/67253

摘要： A substrate treatment apparatus includes a treatment vessel in which a substrate is accommodated, a treatment liquid supply unit, a chamber enclosing the treatment vessel, a substrate holding unit, a circulation unit and a control unit. The circulation unit circulates the treatment liquid from the treatment vessel through a circulation path extending through a filter and a temperature controller and spouts the treatment liquid toward the substrate accommodated in the treatment vessel to recover the treatment liquid in the treatment vessel. The control unit controls the liquid surface level of the treatment liquid retained in the treatment vessel below the substrate held at a substrate treatment position.

摘要翻译： 基板处理装置包括容纳基板的处理容器，处理液供给单元，封闭处理容器的室，基板保持单元，循环单元和控制单元。 循环单元使来自处理容器的处理液循环通过过滤器和温度控制器的循环路径，并将处理液朝向容纳在处理容器中的基板喷出，以回收处理容器中的处理液。 控制单元控制在保持在基板处理位置的基板下方保留在处理容器中的处理液的液面。

公开(公告)号：US09230836B2

公开(公告)日：2016-01-05

申请号：US13427370

申请日：2012-03-22

申请人： Ayumi Higuchi ,  Yoshiyuki Fujitani ,  Takemitsu Miura ,  Rei Takeaki

发明人： Ayumi Higuchi ,  Yoshiyuki Fujitani ,  Takemitsu Miura ,  Rei Takeaki

IPC分类号： H01L21/67 ,  B08B3/04 ,  B08B3/10 ,  B08B3/02

CPC分类号： H01L21/67248 ,  B08B3/024 ,  B08B3/04 ,  B08B3/10 ,  B08B3/108 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67086 ,  H01L21/67253

摘要： A substrate treatment method that includes circulating a treatment liquid from a treatment vessel through a circulation path extending through a filter and a temperature controller, spouting the treatment liquid toward a substrate accommodated in the treatment vessel to recover the treatment liquid in the treatment vessel, and controlling the liquid surface level of the treatment liquid retained in the treatment vessel below the substrate held at a substrate treatment position.

摘要翻译： 一种基板处理方法，其特征在于，包括使来自处理容器的处理液通过延伸通过过滤器的循环路径和温度控制器循环，将处理液朝向容纳在处理容器内的基板喷出，回收处理容器内的处理液， 控制在保持在基板处理位置的基板下方的保留在处理容器中的处理液的液面。

公开(公告)号：US20130014787A1

公开(公告)日：2013-01-17

申请号：US13544207

申请日：2012-07-09

申请人： Shingo URATA ,  Akihiko TAKI ,  Hiroki TSUJIKAWA ,  Eri FUJITA ,  Yoshiyuki FUJITANI

发明人： Shingo URATA ,  Akihiko TAKI ,  Hiroki TSUJIKAWA ,  Eri FUJITA ,  Yoshiyuki FUJITANI

IPC分类号： B08B3/00

CPC分类号： H01L21/31133 ,  H01L21/6708

摘要： A substrate processing apparatus supplies a resist stripping solution, formed by mixing sulfuric acid and a hydrogen peroxide solution, to a surface of a substrate. The substrate processing apparatus includes a nozzle that discharges the resist stripping solution toward the substrate, a hydrogen peroxide solution supply passage through which the hydrogen peroxide solution flows toward the nozzle, a plurality of sulfuric acid supply passages respectively connected to a plurality of mixing positions along the hydrogen peroxide solution supply passage that differ in flow passage length to the nozzle, and a sulfuric acid supply passage selecting unit that introduces the sulfuric acid from a sulfuric acid supply source to a sulfuric acid supply passage selected from among the plurality of sulfuric acid supply passages.

摘要翻译： 基板处理装置将通过将硫酸和过氧化氢溶液混合形成的抗蚀剂剥离溶液提供到基板的表面。 基板处理装置包括将抗蚀剂剥离溶液朝向基板排出的喷嘴，过氧化氢溶液朝向喷嘴流动的过氧化氢溶液供给路径，分别与多个混合位置连接的多个硫酸供给通路 与喷嘴不同的流路长度的过氧化氢溶液供给流路，以及从硫酸供给源将硫酸从硫酸供给路径中选出的硫酸供给路径导入的硫酸供给路径选择部， 段落。