公开(公告)号：US07942423B2

公开(公告)日：2011-05-17

申请号：US11922076

申请日：2006-05-24

申请人： Yosuke Kondo ,  Yasuaki Tanabe ,  Junichi Nakayama ,  Tamio Inamura ,  Koichi Mizunoya ,  Takeo Otani ,  Kokichi Hamamoto

发明人： Yosuke Kondo ,  Yasuaki Tanabe ,  Junichi Nakayama ,  Tamio Inamura ,  Koichi Mizunoya ,  Takeo Otani ,  Kokichi Hamamoto

IPC分类号： F16J15/32

CPC分类号： F16J15/3244 ,  F16J15/3228 ,  F16J15/3236

摘要： A resin lip type seal (1) capable of increasing safety against rupture by reducing rigidity of a plate-like lip (4) bent around a tip point A of a approximately wedge-shaped recessed part (8) to reduce stress concentration at the point A, suppressing the lowering of sealability due to a reduction in creep of the lip, and increasing the follow-up capability of the lip to the eccentricity of its axis. Indentations are formed on the slidable contact surface (41) of the plate-like lip (4) or/and the anti-slidable contact surface (42) thereof. Indentations (7) are also formed on the sloped slidable contact surface (21) of the inner lip (2) of the seal. Then, the ratio of the portion of each of the slidable contact surfaces where the indentations (7) are formed is ½ or more of each of the surface areas of the slidable contact surfaces (21, 41, 42).

摘要翻译： 一种树脂唇型密封件（1），其能够通过降低围绕大致楔形凹部（8）的尖端点A弯曲的板状唇缘（4）的刚性来提高安全性，以减少在该点处的应力集中 A，抑制由于唇部的蠕变减少引起的密封性的降低，并且增加唇缘对其轴线偏心的随动能力。 在板状唇部（4）的滑动接触表面（41）或/或其可滑动接触表面（42）上形成有凹痕。 压痕（7）也形成在密封件的内唇缘（2）的倾斜滑动接触表面（21）上。 然后，形成有凹部（7）的各滑动接触面的部分的比例为可滑动接触面（21,41,42）的每个表面积的1/2以上。

公开(公告)号：US20090322037A1

公开(公告)日：2009-12-31

申请号：US12525206

申请日：2008-02-01

申请人： Yosuke Kondo ,  Iwao Taira ,  Kazunari Seki

发明人： Yosuke Kondo ,  Iwao Taira ,  Kazunari Seki

IPC分类号： F16J15/16

CPC分类号： F16J9/14

摘要： There is provided a seal ring that makes it possible to improve attachability and sealability.The seal ring 1 is separated from each other in one area and has a shape with ends, is inserted in an annular groove in a shaft by temporarily moving both the fittable ends 3 and 4 away from each other, and thereby seals an annular gap formed between the shaft and a housing that has a shaft hole into which the shaft is inserted. The seal ring is configured such that: one of both the ends 3 and 4 has a projection 31 projecting in the direction of the circumference of the seal ring; the other end 4 has a recess 42 used in combination with the projection 31. The projection 41 and the recess 42 are fitted together while slid against each other, thereby bringing both the ends 3 and 4 into contact with each other. The seal ring is characterized in that: the recess 42 has an inclining side face 42a, which inclines from the direction of the circumference; and the projection 31 and the recess 42 form a sliding part so that a part of the edge of the leading end of the projection 31 slides over the inclining side face 42a of the recess 42, and portion of the sliding part is formed as a linear sliding portion 13.

摘要翻译： 提供了一种密封环，可以提高附着性和密封性。 密封环1在一个区域中彼此分离并且具有端部的形状通过临时移动两个可装配端部3和4而彼此远离地插入轴中的环形槽中，从而密封形成的环形间隙 在轴和具有轴孔的壳体之间，轴被插入其中。 密封环被构造成使得：端部3和4中的一个具有沿密封环的圆周方向突出的突起31; 另一端4具有与突起31组合使用的凹部42.突起41和凹部42在彼此滑动的同时被装配在一起，从而使端部3和4彼此接触。 密封圈的特征在于：凹部42具有从圆周方向倾斜的倾斜侧面42a， 并且突起31和凹部42形成滑动部，使得突起31的前端的边缘的一部分在凹部42的倾斜侧面42a上滑动，并且滑动部的一部分形成为线状 滑动部分13。

公开(公告)号：US08912453B2

公开(公告)日：2014-12-16

申请号：US13511383

申请日：2010-12-13

申请人： Minoru Hashimoto ,  Yoichi Kitamura ,  Yosuke Kondo ,  Kenichiro Ichikawa

发明人： Minoru Hashimoto ,  Yoichi Kitamura ,  Yosuke Kondo ,  Kenichiro Ichikawa

IPC分类号： H05K1/16 ,  H01L23/552 ,  H01L23/00 ,  H01L23/053

CPC分类号： H01L23/053 ,  H01L23/552 ,  H01L23/564 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.

摘要翻译： 电子部件封装包括电路板，其具有不具有无助焊剂润湿性的安装面，并且其上安装有半导体元件的焊接图案表示无助焊剂的润湿性，并且形成为包围其上的区域 安装半导体元件，具有使得在盖和电路板之间形成空腔的形状的盖，与焊接图案的接合面形成为环状，并且不显示无助焊剂的润湿性， 焊接接合部，其通过在盖的接合面上加热由无助焊剂形成的焊料预涂层而形成;以及通气孔，其通过在所述焊接预涂层的不连续部分之后露出的盖的接合面形成 焊接部分形成。

公开(公告)号：US20120273264A1

公开(公告)日：2012-11-01

申请号：US13511383

申请日：2010-12-13

申请人： Minoru Hashimoto ,  Yoichi Kitamura ,  Yosuke Kondo ,  Kenichiro Ichikawa

发明人： Minoru Hashimoto ,  Yoichi Kitamura ,  Yosuke Kondo ,  Kenichiro Ichikawa

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H01L23/053 ,  H01L23/552 ,  H01L23/564 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.

摘要翻译： 电子部件封装包括电路板，其具有不具有无助焊剂润湿性的安装面，并且其上安装有半导体元件的焊接图案表示无助焊剂的润湿性，并且形成为包围其上的区域 安装半导体元件，具有使得在盖和电路板之间形成空腔的形状的盖，与焊接图案的接合面形成为环状，并且不显示无助焊剂的润湿性， 焊接接合部，其通过在盖的接合面上加热由无助焊剂形成的焊料预涂层而形成;以及通气孔，其通过在所述焊接预涂层的不连续部分之后露出的盖的接合面形成 焊接部分形成。

公开(公告)号：US08020079B2

公开(公告)日：2011-09-13

申请号：US12790411

申请日：2010-05-28

申请人： Yosuke Kondo ,  Kenji Yoshida

发明人： Yosuke Kondo ,  Kenji Yoshida

IPC分类号： H03M13/00 ,  G06F11/00

CPC分类号： G11B20/1833 ,  G11B2020/1287 ,  G11B2020/183 ,  G11B2020/185 ,  G11B2220/2516 ,  H03M13/1105 ,  H03M13/333 ,  H03M13/3738

摘要： According to one embodiment, a decoder device includes a decoder configured to decode a to-be-decoded sequence by performing an iterative decoding process and to perform a parity check of a decoding result using a check matrix, a detector configured to detect that the to-be-decoded sequence is a non-code word based on a parity check result for each row of the check matrix by the decoder, and a controller configured to control the decoder according to a detection result of the detector.

摘要翻译： 根据一个实施例，解码器装置包括：解码器，被配置为通过执行迭代解码处理来对待解码序列进行解码，并使用校验矩阵执行对解码结果的奇偶校验;检测器，被配置为检测到 被解码的序列是基于解码器的校验矩阵的每行的奇偶校验结果的非码字，以及被配置为根据检测器的检测结果来控制解码器的控制器。

公开(公告)号：US20100306617A1

公开(公告)日：2010-12-02

申请号：US12790411

申请日：2010-05-28

申请人： Yosuke Kondo ,  Kenji Yoshida

发明人： Yosuke Kondo ,  Kenji Yoshida

IPC分类号： H03M13/05 ,  G06F11/10

CPC分类号： G11B20/1833 ,  G11B2020/1287 ,  G11B2020/183 ,  G11B2020/185 ,  G11B2220/2516 ,  H03M13/1105 ,  H03M13/333 ,  H03M13/3738

摘要： According to one embodiment, a decoder device includes a decoder configured to decode a to-be-decoded sequence by performing an iterative decoding process and to perform a parity check of a decoding result using a check matrix, a detector configured to detect that the to-be-decoded sequence is a non-code word based on a parity check result for each row of the check matrix by the decoder, and a controller configured to control the decoder according to a detection result of the detector.

摘要翻译： 根据一个实施例，解码器装置包括：解码器，被配置为通过执行迭代解码处理来对待解码序列进行解码，并使用校验矩阵执行对解码结果的奇偶校验;检测器，被配置为检测到 被解码的序列是基于解码器的校验矩阵的每行的奇偶校验结果的非码字，以及被配置为根据检测器的检测结果来控制解码器的控制器。

公开(公告)号：US20100290151A1

公开(公告)日：2010-11-18

申请号：US12715234

申请日：2010-03-01

申请人： Yosuke KONDO ,  Kenji YOSHIDA

发明人： Yosuke KONDO ,  Kenji YOSHIDA

IPC分类号： G11B15/18

CPC分类号： G11B5/09 ,  G11B20/18 ,  G11B2020/183 ,  G11B2020/1863

摘要： According to one embodiment, a disk controller includes a reader, a selector, and a combining module. The reader performs, when retrying reading data from a magnetic disk, a plurality of read operations with respect to the same area on the magnetic disk while offsetting a head that reads data from the magnetic disk. The selector selects likely read data from a plurality of pieces of read data obtained as results of the read operations performed by the reader based on a predetermined index with respect to each of data lengths shorter than the data length of the area. The combining module combines pieces of read data selected for the data lengths, respectively.

摘要翻译： 根据一个实施例，盘控制器包括读取器，选择器和组合模块。 当从磁盘重新读取数据时，读取器执行相对于磁盘上相同区域的多个读取操作，同时抵消从磁盘读取数据的磁头。 所述选择器基于与所述区域的数据长度相比短的数据长度的每一个的预定索引，从作为读取器执行的读取操作的结果获得的多条读取数据中选择可能的读取数据。 组合模块分别组合为数据长度选择的读取数据。

公开(公告)号：US07513506B2

公开(公告)日：2009-04-07

申请号：US11578365

申请日：2005-03-22

申请人： Yosuke Kondo ,  Yasuaki Tanabe ,  Katsutoshi Ishioka ,  Sosuke Ito ,  Shinji Nagasawa ,  Junichi Nakayama ,  Masatoshi Okada

发明人： Yosuke Kondo ,  Yasuaki Tanabe ,  Katsutoshi Ishioka ,  Sosuke Ito ,  Shinji Nagasawa ,  Junichi Nakayama ,  Masatoshi Okada

IPC分类号： F16J15/32

CPC分类号： F04B53/143 ,  F02M59/442 ,  F04B53/164 ,  F16J15/3216 ,  F16J15/3276 ,  F16J15/56

摘要： There is provided a plunger seal (1) for a fuel injection pump for a direct-injection gasoline engine, in which, even if a resin material is used for a fuel seal member (12), the plunger seal can be made compact, sealing ability is increased, and assembling man-hours can be reduced, and in which set sealing performance can be achieved when a U-shaped elastic member (33) for applying an energizing force in a diametrical direction is used in a groove (41) formed in the fuel seal member (12). The resin fuel seal member (12) and an oil seal member (13) are assembled to form one seal system. Further, when the U-shaped elastic member (33) is installed in the groove (41), an axial position (L1) of an end surface (44a) at the side opposite to the sealed object of a fixing collar (44) formed on an inner peripheral surface of the groove (41) is positioned at the side (B) opposite to the sealed object than the axial position (L2) of a leading end portion (15b) of a seal lip (15) of the fuel seal member (12).

公开(公告)号：US20070182103A1

公开(公告)日：2007-08-09

申请号：US11727764

申请日：2007-03-28

申请人： Masatoshi Okada ,  Iwao Taira ,  Tadashi Abiko ,  Yosuke Kondo ,  Kazuki Takeno ,  Ichiro Yamane

发明人： Masatoshi Okada ,  Iwao Taira ,  Tadashi Abiko ,  Yosuke Kondo ,  Kazuki Takeno ,  Ichiro Yamane

IPC分类号： F16J15/32

CPC分类号： F16J15/3232 ,  F02M59/442 ,  F04B53/164 ,  F16J15/002 ,  F16J15/3204 ,  F16J15/3208 ,  F16J15/3236

摘要： A high performance sealing device having an excellent pressure resistance and realizing a prevention of damage. The sealing device usable at a working pressure of 0 to 2 MPa, and not damaged even if the pressure of high-pressure fuel of 5 MPa or higher is applied thereto, wherein high pressure fuel on the high pressure side H is sealed by a first seal part 2, oil from a cam side on a low pressure side L is sealed by a second seal part 3, and the fuel slightly leaked due to failure of scraping at the first seal part is sealed by the second seal part to form a dual seal structure, and a resin ring 21 coming into slidable sealing contact with a shaft 10 is used in the first seal part 2, whereby abnormal abrasion does not occur even when fuel having less lubricity is used, and the durability of the seal is increased.

公开(公告)号：US5746948A

公开(公告)日：1998-05-05

申请号：US729533

申请日：1996-10-11

申请人： Yosuke Kondo

发明人： Yosuke Kondo

IPC分类号： C09D5/24 ,  H01B1/20

CPC分类号： C09D5/24

摘要： The present invention provides a water-dilutive and conductive coating composition capable of preparing any desired color tone which, upon applying to a thing to be coated, affords various beautiful color tones, gives electroconductivity and prevents static electricity and particularly offers a composition capable of preparing any desired color which can be effectively used in a place where the use of organic solvents and chemical contamination are strictly restricted such as factories for the manufacture of semiconductors. The invention provides a water-dilutive and conductive coating composition whereby any desired color can be afforded, characterized in that, said composition contains 10-50% by weight of water-soluble or water-dispersible synthetic resin (non-volatile content) and 5-40% by weight of white electroconductive pigment and the amount of each of sodium and potassium, in the resulting coated film is not more than 30 ppm.

摘要翻译： 本发明提供一种能够制备任何所需色调的水稀释导电涂料组合物，其在施用于被涂物时可提供各种美丽的色调，赋予导电性并防止静电，特别是提供能够制备 可以有效地使用有机溶剂和化学污染严格限制的地方使用的所需颜色，例如用于制造半导体的工厂。 本发明提供一种水稀释导电涂料组合物，其中可以提供任何所需的颜色，其特征在于，所述组合物含有10-50重量％的水溶性或水分散性合成树脂（非挥发性成分）和5 在所得涂膜中，-40重量％的白色导电颜料和钠和钾各自的量不大于30ppm。