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    Semiconductor package molding system and molding method thereof
    5.
    发明授权
    Semiconductor package molding system and molding method thereof 有权
    半导体封装成型系统及其成型方法

    公开(公告)号：US08851875B2

    公开(公告)日：2014-10-07

    申请号：US13240045

    申请日：2011-09-22

    Applicant: Young-jin Hwang

    Inventor： Young-jin Hwang

    IPC: B29C45/14 ,  B29C70/72 ,  H01L21/56 ,  B29C45/00 ,  B29C45/42 ,  B29C45/38

    CPC classification number: H01L21/565 ,  B29C45/0084 ,  B29C45/382 ,  B29C45/42 ,  B29C45/4225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.

    Abstract translation: 一种半导体封装成型系统，包括压制单元，用于将第一构件和第一树脂构件装载在第一按压装置上的装载装置和第二压力装置上的第二构件和第二树脂构件，卸载装置， 从第一按压装置卸下模制的第一模具和来自第二冲压装置的模制的第二模具，以及适于向压制单元，装载装置和卸载装置施加控制信号的控制单元。 压榨单元包括至少一个第一压榨装置，其适于将第一树脂构件压靠第一构件以模制第一模具;以及至少一个第二压制装置，其适于将第二树脂构件压靠在第二构件上， 模制第二个模具。

    SEMICONDUCTOR PACKAGE MOLDING SYSTEM AND MOLDING METHOD THEREOF
    6.
    发明申请
    SEMICONDUCTOR PACKAGE MOLDING SYSTEM AND MOLDING METHOD THEREOF 有权
    半导体封装成型系统及其成型方法

    公开(公告)号：US20120107436A1

    公开(公告)日：2012-05-03

    申请号：US13240045

    申请日：2011-09-22

    Applicant: Young-Jin HWANG

    Inventor： Young-Jin HWANG

    IPC: B29C65/78

    CPC classification number: H01L21/565 ,  B29C45/0084 ,  B29C45/382 ,  B29C45/42 ,  B29C45/4225 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.

    Abstract translation: 一种半导体封装成型系统，包括压制单元，用于将第一构件和第一树脂构件装载在第一按压装置上的装载装置和第二压力装置上的第二构件和第二树脂构件，卸载装置， 从第一按压装置卸下模制的第一模具和来自第二冲压装置的模制的第二模具，以及适于向压制单元，装载装置和卸载装置施加控制信号的控制单元。 压榨单元包括至少一个第一压榨装置，其适于将第一树脂构件压靠第一构件以模制第一模具;以及至少一个第二压制装置，其适于将第二树脂构件压靠在第二构件上， 模制第二个模具。

    Method of winding superconducting wire and magnet fabricated using the method
    7.
    发明授权
    Method of winding superconducting wire and magnet fabricated using the method 有权
    使用该方法制造的超导线和磁体的缠绕方法

    公开(公告)号：US08344835B1

    公开(公告)日：2013-01-01

    申请号：US13436104

    申请日：2012-03-30

    Applicant: Tae Kuk Ko ,  Jae Sik Kang ,  Hyun Chul Jo ,  Suk Jin Choi ,  Jin Bae Na ,  Jae Young Jang ,  Young Jin Hwang ,  Hyung Jun Kim

    Inventor： Tae Kuk Ko ,  Jae Sik Kang ,  Hyun Chul Jo ,  Suk Jin Choi ,  Jin Bae Na ,  Jae Young Jang ,  Young Jin Hwang ,  Hyung Jun Kim

    IPC: H01F6/00

    CPC classification number: H01F41/048 ,  H01F6/06 ,  Y10T29/49014

    Abstract: The method of winding superconducting wire comprises a winding method comprising: winding the superconducting wire from the source reel onto the first lane of the first bobbin a first number of times in a first direction; fixing the first bobbin and the second bobbin to each other; winding the superconducting wire from the source reel onto the third lane of the second bobbin a second number of times in the first direction; separating the first bobbin and the second bobbin from each other; and winding the superconducting wire from the first lane of the first bobbin onto the fourth lane of the second bobbin a third number of times in a second direction which is different from the first direction while winding the superconducting wire from the third lane of the second bobbin onto the source reel the third number of times in the second direction.

    Abstract translation: 缠绕超导线的方法包括一种缠绕方法，包括：将来自所述源卷轴的所述超导线沿着第一方向卷绕到所述第一线轴的第一通道上，第一次; 将第一线轴和第二线轴彼此固定; 将所述超导线材从所述源卷轴绕所述第二线轴的所述第三通道在所述第一方向上再次次数; 将第一线轴和第二线轴彼此分离; 以及将所述超导线从所述第一线轴的第一通道卷绕到所述第二绕线筒的第四通道上，在从所述第二线轴的所述第三通道卷绕所述超导线的同时沿与所述第一方向不同的第二方向上的第三次 在第二个方向上到达源卷轴第三次。

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