摘要:
A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is electrically connected to the conductive patterns. An encapsulant is used to at least partially filling the at least one channel.
摘要:
A drum type washer and a door thereof are provided to eliminate moisture inside a door glass using natural convection. The door of the drum type washer includes a door glass, an inner door having a holder integral to the inner door to support an outer surface of the door glass, an outer door having a support rib integral to the outer door to support an inner surface of the door glass, the support rib including a hole set formed in the support rib such that an inside of the door glass communicates with an exterior of the drum type washer. With this configuration, the moisture created inside the door glass can be rapidly eliminated.
摘要:
A semiconductor leadframe and a semiconductor package using same. More particularly, a semiconductor leadframe offering improved solder joint strength between a semiconductor package and a motherboard is disclosed. The leadframe comprises a plate-type frame body; a chip paddle on which a semiconductor chip may be mounted; a plurality of internal leads located radially and spaced at regular intervals about the perimeter of the chip paddle; external leads extending outward from the internal leads and with their terminals connecting to the frame body; and dam bars at the juncture of each external and internal lead for additional support and to ensure that the external leads remain exposed during subsequent encapsulation processes. The leadframe of the present invention providing additional solder joint strength through the use of internal leads having different lengths or surface areas.
摘要:
Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.
摘要:
Semiconductor packages are disclosed. An exemplary package includes horizontal leads each having a first side and an opposite second side. The second side includes a recessed horizontal surface. Two stacked semiconductor chips are within the package and are electrically interconnected in a flip chip style. One chip extends over the first side of the leads and is electrically connected thereto. The chips are encapsulated in a package body formed of an encapsulating material. The recessed horizontal surface of the leads is covered by the encapsulating material, and a portion of the second side of each lead is exposed at an exterior surface of the package body as an input/output terminal. A surface of one or both chips may be exposed. The stack of chips may be supported on the first side of the leads or on a chip mounting plate.
摘要:
A clothing dryer including a rotating drum, a shelf installed inside the rotating drum, and a support member, which is rotatably installed at a rear end of the shelf such that the shelf is supported by a rear surface of the rotating drum. The rear end of the shelf is installed on a rear surface of the rotating drum through the support member, so that the shelf is more stably installed inside the rotating drum.
摘要:
A drum type washer and a door thereof are provided to eliminate moisture inside a door glass using natural convection. The door of the drum type washer includes a door glass, an inner door having a holder integral to the inner door to support an outer surface of the door glass, an outer door having a support rib integral to the outer door to support an inner surface of the door glass, the support rib including a hole set formed in the support rib such that an inside of the door glass communicates with an exterior of the drum type washer. With this configuration, the moisture created inside the door glass can be rapidly eliminated.
摘要:
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.
摘要:
A clothing dryer capable of removing impurities, such as dust, accumulated in a hot air outlet duct thereof. The clothing dryer includes a drying tub to dry laundry contained therein using hot air supplied thereto, a hot air outlet duct to discharge the hot air, coming from the drying tub, to the outside, and a connecting unit to connect an external suction device to the hot air outlet duct. Accordingly, impurities, such as dust, accumulated in the hot air outlet duct can be removed by a suction force of the suction device, thereby enabling the cleaning of the hot air outlet duct.