摘要:
An antifuse memory device includes an antifuse memory cell, a reference current generation unit, and a comparison unit. The antifuse memory cell includes an antifuse. The reference current generation unit provides a reference current selected from a plurality of reference currents. The comparison unit compares an intensity of a cell current flowing through the antifuse with an intensity of the reference current and provides an output signal corresponding to a result of the comparison.
摘要:
An integrated circuit memory device includes a refresh control circuit that generates an internal memory refresh command signal having a period that is changed relative to a period of an external memory refresh command signal received by the memory device. This change in the period of the internal memory refresh command may be in response to detecting a change in temperature of the memory device. In particular, the refresh control circuit is configured so that the period of the internal memory refresh command signal is increased in response to detecting a reduction in temperature of the memory device.
摘要:
Example embodiments relate to a semiconductor memory device including a first pad having a probe region and a sensing region, the first pad may be adapted to come in contact with a primary probe, a sensing unit adapted to sense a weak contact of the first pad and the primary probe, the sensing unit may generate an output current in response to a contact point of the primary probe, and a second pad may be adapted to come in contact with a secondary probe to input/output an electric signal. The output current of the sensing unit may be output through the second pad or the secondary probe.
摘要:
An internal reference voltage generating circuit that reduces a standby current and the number of pins of a semiconductor memory device, in which a reference voltage is provided to an input buffer that receives a signal through an input to which an on die transmitor resistor is connected, includes: a voltage dividing circuit outputting the reference voltage by a power voltage; a pull down driver connected to an end of the voltage dividing circuit; and a calibration control circuit comparing a voltage level of the input and a voltage level of an end of the voltage dividing circuit, and controlling the on resistor value of the pull down driver according to a result of the comparison. The internal reference voltage generating circuit is operated while the memory controller inputs a signal into a mode register set (MRS) to enable the internal reference voltage generating circuit and the output signal of the MRS is activated.
摘要:
A semiconductor integrated circuit with low power consumption is provided. In one embodiment, the semiconductor integrated circuit includes a logic circuit portion that is connected between a first power line and a virtual ground line. The logic circuit portion includes at least one NMOS transistor having a first threshold voltage and at least one PMOS transistor having a second threshold voltage. The semiconductor integrated circuit further includes a first MOS transistor, which is connected between the virtual ground line and a ground voltage, where the first MOS transistor has the first threshold voltage and applies the ground voltage to the virtual ground line in an active state. Also included in the semiconductor integrated circuit is a controller that is connected to the first MOS transistor, where the controller applies the ground voltage to the first MOS transistor in the active state and applies a bulk voltage supplied from a bulk power line in a standby state to control a threshold voltage of the first MOS transistor.
摘要:
A metal/insulator/metal capacitor and a fabrication method thereof are presented. The method includes forming a first electrode on an insulation film; forming a side wall made of insulating material on a side surface of the first electrode; forming an interlayer insulation film on the top surface of the insulation film including the first electrode and the side wall; forming a via hole to expose the first electrode by selectively etching the interlayer insulation film such that an edge area at which a side surface and a bottom of the via hole intersect is positioned on a top surface of the side wall; forming a dielectric layer on an inner wall of the via hole; forming a second electrode on the dielectric layer such that the via hole is filled; and forming a metal wire on the second electrode such that the metal wire is electrically connected to the second electrode.
摘要:
Example methods of fabricating a silicon on insulator substrate are disclosed. One example method may include forming a plurality of trenches on a substrate, forming an insulation layer on the trenches, removing a portion of the insulation layer formed on the trenches to partially expose the substrate, and forming a silicon on insulator film in the substrate via the exposed portions of the substrate.
摘要:
The present invention is directed to a method of fabricating a capacitor having a metal/insulator/metal (MIM) structure, which is capable of providing a minimized semiconductor device with no capacitance variation of a capacitor. According to an aspect of the present invention, a method of fabricating a thin film capacitor comprises the steps of forming a first via and a second via which are isolated with a predetermined distance by selectively etching an interlayer insulating film formed over the entire structure of a semiconductor substrate, filling in the first via and the second via with a first metal material, forming a capacitor window by etching the interlayer insulating film between the first via and the second via to have a predetermined depth, forming a dielectric layer on an inner wall, and forming a second metal material to fill in the capacitor window.
摘要:
A memory device according to the present invention includes multiple refresh modes and a refresh controller. A first refresh mode can respectively select one more memory block among a plurality of banks comprising a plurality of blocks and each of all banks. In addition, the first refresh mode may perform a refresh operation with respect to selected memory blocks. The second refresh mode can select a part of the banks and perform a refresh operation of data with a selected bank. The controller may select one of the first and second refresh modes in a refresh operation.
摘要:
In the negative drop voltage generating apparatus of a semiconductor memory device and the method of controlling a negative voltage generation. The apparatus generates a negative voltage having a level necessary for an operating mode in the semiconductor memory device. The apparatus includes a negative drop voltage generator having first and second output terminals and a voltage separated/integrated unit connected between the first and second output terminals of the negative drop voltage generator. The voltage separated/integrated unit performs a voltage separation and connection so that the negative voltages are generated with individually different levels or with the same level through the first and second output terminals, in response to an applied control signal.