摘要:
A conveying device including: a storage unit storing two or more sheets of slide glasses to be subjected to a predetermined treatment; a stage holding only one sheet of slide glass to be subjected to the treatment; a supply arm by which one sheet of slide glass to be subjected to the treatment is picked up from the storage unit and supplied onto the stage; a discharge arm by which the slide glass mounted on the stage is picked up and discharged in the storage unit; a moving unit operable to move the supply arm and the discharge arm in an integral manner so as to bring the supply arm or the discharge arm into proximity to each of the storage unit and the stage; and a control unit operable to control the supply arm, the discharge arm and the moving unit.
摘要:
The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.
摘要:
The size of a semiconductor device is reduced. A semiconductor chip in which a power MOSFET is placed above a semiconductor chip in which another power MOSFET is formed and they are sealed with an encapsulation resin portion. The semiconductor chips are so arranged that the upper semiconductor chip does not overlap with the area positioned directly above a gate pad electrode of the lower semiconductor chip. The semiconductor chips are identical in size and the respective source pad electrodes and gate pad electrodes of the lower semiconductor chip and the upper semiconductor chip are identical in shape and arrangement. The lower semiconductor chip and the upper semiconductor chip are arranged with their respective centers displaced from each other.
摘要:
A core for photographic light-sensitive material use made of wooden source material which can be recycled or decomposed in natural environment is disclosed. The core center is made of paper covered with a buffer layer made of 100% wooden pulp having a density of not more than 0.1 g/cm.sup.3. The buffer layer is covered with a reinforcing sheet made of paper with a tensile strength of 0.3 kg/15 mm width or more.
摘要翻译:公开了一种用于在自然环境中回收或分解的木源材料制成的照相感光材料的核心。 核心中心由纸覆盖有由100%木浆制成的缓冲层,密度不超过0.1g / cm 3。 缓冲层用拉伸强度为0.3kg / 15mm以上的纸张加强片覆盖。
摘要:
Disclosed herein is a stage system, including: a stage on which to mount a slide glass; a projection block projected more than the thickness of the slide glass to the side of that surface of the stage on which to dispose the slide glass; and a pressing block which is provided on that surface of the stage on which to dispose the slide glass, is thicker than the slide glass, and presses toward the projection block the slide glass disposed between itself and the projection block.
摘要:
A slide glass storage device including: a supply tray which has a supply holding space determined by a longer edge upper limit allowed for a longer edge of a slide glass and a shorter edge upper limit allowed for a shorter edge of the slide glass and on which a slide glass to be supplied to a treatment unit operable to perform a predetermined treatment is mounted; a discharge tray which has a discharge holding space determined by a longer edge longer than the longer edge upper limit and a shorter edge longer than the shorter edge upper limit and on which a slide glass having been subjected to the treatment in the treatment unit and being to be discharged is mounted; and a support unit supporting the supply tray and the discharge tray.
摘要:
An inkjet head (3) comprises a wiring board (80) which. has, two-dimensionally arranged thereon, sets of nozzles (11) , pressure chambers (41) , and actuators (60) and which also has lines of wiring (87, 91) through-vias (85) , and ink flow paths (88); and connection sections (110, 111) which connect the lines of wiring to a drive section, the connection sections (110, 111) being disposed outside the arrangement region (R) in which the sets of the nozzles, the pressure chambers, and the actuators are arranged two-dimensionally. The nozzles are arranged in N rows (N is an integer greater than or equal to 2) , with each of the N rows comprising M nozzles (M is an integer greater than or equal to 2) which are arranged rectilinearly. The through-vias which correspond. to the nozzles of arbitrary n nozzle rows of the N nozzle rows (1≦n
摘要翻译:喷墨头(3)包括布线板(80)。 具有二维布置在其上的喷嘴组(11),压力室(41)和致动器(60),并且还具有布线(87,91)通孔(85)和油墨流动通道 88); 以及连接线路连接到驱动部分的连接部分(110,111),所述连接部分(110,111)设置在所述布置区域(R)的外侧,在所述布置区域(R)中,所述喷嘴,压力室和 致动器二维布置。 这些喷嘴排列成N行(N是大于或等于2的整数),N列包括M个喷嘴(M是大于或等于2的整数),其直线排列。 通孔对应。 在排列区域中设置有N个喷嘴列(1& nlE; n
摘要:
The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.
摘要:
An inkjet printhead includes multiple sets each of which includes a nozzle, pressure chamber, and actuator; a circuit board; and a connection member. The circuit board includes a wire, through hole via, and ink channel. The connection member, which connects the wire to a driving unit, is provided outside of an array area where the sets are two-dimensionally arrayed. The number of the nozzle rows is N, and each row includes M nozzles (M and N: integer of 2 or more). The through hole vias corresponding to the nozzles of n nozzle row of the N nozzle rows are provided inside of the array area (n: 1≦n
摘要翻译:喷墨打印头包括多组,每组包括喷嘴,压力室和致动器; 电路板; 和连接构件。 电路板包括电线,通孔通孔和墨水通道。 将线连接到驱动单元的连接构件设置在阵列二维排列的阵列区域的外侧。 喷嘴列的数量为N,每行包括M个喷嘴(M和N:2或更大的整数)。 对应于N个喷嘴列的n个喷嘴列的喷嘴的通孔过孔设置在阵列区域(n:1 @ n
摘要:
An image processing apparatus includes a position movement input unit configured to receive a position movement instruction from a user, a pointer movement unit configured to set a position of a pointer that moves in accordance with the instruction, and a screen movement unit configured to scroll a screen based on a relative position of the pointer with respect to a reference point of a predefined area around the pointer, the screen movement unit configured to move the predefined area to keep the pointer inside the predefined area when the pointer is at a border of the predefined area and moves towards an outside of the predefined area.