公开(公告)号：US11587958B2

公开(公告)日：2023-02-21

申请号：US15835030

申请日：2017-12-07

申请人： AGC Inc.

发明人： Kazutaka Ono ,  Takatoshi Yaoita ,  Reo Usui ,  Kenichi Ebata ,  Jun Akiyama

IPC分类号： H01L27/12 ,  B32B43/00 ,  B32B17/00 ,  B32B7/12 ,  C03C3/091 ,  H01L21/683 ,  H01L29/786 ,  B32B38/10 ,  B32B7/06 ,  C03C27/10 ,  B32B17/06 ,  G02F1/1341 ,  G02F1/1335 ,  G02F1/1368

摘要： A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

公开(公告)号：US11524439B2

公开(公告)日：2022-12-13

申请号：US17070999

申请日：2020-10-15

申请人： AGC Inc.

发明人： Yoshiaki Higuchi ,  Shintaro Fukunaga ,  Takatoshi Yaoita

IPC分类号： B29C48/08 ,  B29C48/88 ,  B32B27/08 ,  B32B27/30

摘要： To provide a process for producing a film excellent in water vapor barrier property, tensile elongations, and transparency. A resin material containing polychlorotrifluoroethylene (PCTFE) is melted and extruded into a film from an extrusion die, the extruded product is brought into contact with a cooling roll having a surface temperature of at most 120° C. in a state such that the surface temperature of the extruded product is higher than the crystallization temperature of PCTFE to form a film web, and the film web is subjected to heat treatment at from 80 to 200° C. to obtain a film.

公开(公告)号：US20210023756A1

公开(公告)日：2021-01-28

申请号：US17070990

申请日：2020-10-15

申请人： AGC Inc.

发明人： Yoshiaki Higuchi ,  Shintaro Fukunaga ,  Takatoshi Yaoita

IPC分类号： B29C48/08 ,  B29C48/00 ,  B29C48/92 ,  B32B27/30

摘要： To provide a film made of polychlorotrifluoroethylene (PCTFE), of which a laminate with other layer is less likely to curl when subjected to drawing.
A film comprising PCTFE, having thermal shrinkage rates within ±1.2% in MD and in TD when heated at 140° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.