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公开(公告)号：US11891693B2
公开(公告)日：2024-02-06
申请号：US16990822
申请日：2020-08-11
Applicant: ASM IP HOLDING B.V.
Inventor： Jereld Lee Winkler , Cheuk Li , Michael F. Schultz , John Kevin Shugrue
IPC: C23C16/455 , H01L21/67 , C23C16/458 , C23C16/52
CPC classification number: C23C16/45544 , C23C16/4583 , C23C16/52 , H01L21/67017
Abstract: A semiconductor processing device can include a reactor assembly comprising a reaction chamber sized to receive a substrate therein. An exhaust line can be in fluid communication with the reaction chamber, the exhaust line configured to transfer gas out of the reaction chamber. A valve can be disposed along the exhaust line to regulate the flow of the gas along the exhaust line. A control system can be configured to operate in an open loop control mode to control the operation of the valve.
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公开(公告)号：US10774422B2
公开(公告)日：2020-09-15
申请号：US15996350
申请日：2018-06-01
Applicant: ASM IP HOLDING B.V.
Inventor： Jereld Lee Winkler , Cheuk Li , Michael F. Schultz , John Kevin Shugrue
IPC: C23C16/455 , H01L21/67 , C23C16/458 , C23C16/52
Abstract: A semiconductor processing device can include a reactor assembly comprising a reaction chamber sized to receive a substrate therein. An exhaust line can be in fluid communication with the reaction chamber, the exhaust line configured to transfer gas out of the reaction chamber. A valve can be disposed along the exhaust line to regulate the flow of the gas along the exhaust line. A control system can be configured to operate in an open loop control mode to control the operation of the valve.
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公开(公告)号：US20190368038A1
公开(公告)日：2019-12-05
申请号：US15996350
申请日：2018-06-01
Applicant: ASM IP HOLDING B.V.
Inventor： Jereld Lee Winkler , Cheuk Li , Michael F. Schultz , John Kevin Shugrue
IPC: C23C16/455 , C23C16/52 , C23C16/458 , H01L21/67
Abstract: A semiconductor processing device can include a reactor assembly comprising a reaction chamber sized to receive a substrate therein. An exhaust line can be in fluid communication with the reaction chamber, the exhaust line configured to transfer gas out of the reaction chamber. A valve can be disposed along the exhaust line to regulate the flow of the gas along the exhaust line. A control system can be configured to operate in an open loop control mode to control the operation of the valve.
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公开(公告)号：US20230203654A1
公开(公告)日：2023-06-29
申请号：US18147631
申请日：2022-12-28
Applicant: ASM IP Holding, B.V.
Inventor： Paridhi Gupta , Taku Omori , Cheuk Li , Aadil Vora , Todd Dunn
IPC: C23C16/455 , C23C16/52
CPC classification number: C23C16/45544 , C23C16/52 , C23C16/45587
Abstract: Apparatus and method for semiconductor substrate processing are presented. For devices such as valves used for semiconductor substrate processing especially a process like ALD, there is a need to monitor and control the exact time taken from the signal to open and close the valves so that delay times may be controlled. In an embodiment, an apparatus comprising a reactor, a valve, a process controller and a valve monitor system is presented. The process controller may be operationally connected to the valve and may be provided with a memory. The sensors may be either electrical or optical sensors.
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公开(公告)号：US20200370179A1
公开(公告)日：2020-11-26
申请号：US16990822
申请日：2020-08-11
Applicant: ASM IP HOLDING B.V.
Inventor： Jereld Lee Winkler , Cheuk Li , Michael F. Schultz , John Kevin Shugrue
IPC: C23C16/455 , H01L21/67 , C23C16/458 , C23C16/52
Abstract: A semiconductor processing device can include a reactor assembly comprising a reaction chamber sized to receive a substrate therein. An exhaust line can be in fluid communication with the reaction chamber, the exhaust line configured to transfer gas out of the reaction chamber. A valve can be disposed along the exhaust line to regulate the flow of the gas along the exhaust line. A control system can be configured to operate in an open loop control mode to control the operation of the valve.
