公开(公告)号：US20130098154A1

公开(公告)日：2013-04-25

申请号：US13635581

申请日：2011-01-19

申请人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

发明人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

IPC分类号： G01P15/09

CPC分类号： G01P15/09 ,  G01P15/0802 ,  G01P15/12 ,  G01P15/123

摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

摘要翻译： 压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。 地震质量从基板悬挂使其能够偏转。 所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。 至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。 测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

公开(公告)号：US20110233750A1

公开(公告)日：2011-09-29

申请号：US13133521

申请日：2009-10-19

申请人： Achim Trautmann ,  Ando Feyh

发明人： Achim Trautmann ,  Ando Feyh

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L23/10 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/038 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/00

摘要： An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.

摘要翻译： 公开了一种具有第一和第二基板的装置，其中两个基板通过SLID（固体液体互扩散）粘合而彼此连接。 SLID键显示第一金属材料和第二金属材料，其中SLID键包括金属间Al / Sn相。

公开(公告)号：US20100308475A1

公开(公告)日：2010-12-09

申请号：US12733861

申请日：2008-09-02

申请人： Achim Trautmann ,  Ando Feyh

发明人： Achim Trautmann ,  Ando Feyh

IPC分类号： H01L23/488 ,  H01L21/768

CPC分类号： H01L23/10 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/038 ,  H01L21/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/33 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/32057 ,  H01L2224/32506 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1631 ,  H01L2924/164 ,  H01L2924/01014 ,  H01L2924/00

摘要： A composite, including a first semiconductor substrate that is secured by soldering material to at least one second semiconductor substrate, a eutectic being formed between the soldering material and the second semiconductor substrate and/or at least one layer possibly provided on the semiconductor substrate. It is provided that the eutectic is formed between the soldering material and a microstructure, which is formed in the region of contact with the soldering material on the second semiconductor substrate and/or the layer. Also described is a production method.

摘要翻译： 一种复合材料，包括通过焊接材料固定到至少一个第二半导体衬底的第一半导体衬底，在焊料和第二半导体衬底之间形成的共晶体和/或可能设置在半导体衬底上的至少一层。 提供了在焊接材料和在与第二半导体衬底和/或层上的焊料接触的区域中形成的微结构体之间形成共晶体。 还描述了一种生产方法。

公开(公告)号：US09111787B2

公开(公告)日：2015-08-18

申请号：US13133521

申请日：2009-10-19

申请人： Achim Trautmann ,  Ando Feyh

发明人： Achim Trautmann ,  Ando Feyh

IPC分类号： H01L21/58 ,  H01L23/10 ,  B81C1/00 ,  H01L21/447

CPC分类号： H01L23/10 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/038 ,  H01L2924/0002 ,  H01L2924/1433 ,  H01L2924/00

摘要： An arrangement having a first and a second substrate is disclosed, wherein the two substrates are connected to one another by means of an SLID (Solid Liquid InterDiffusion) bond. The SLID bond exhibits a first metallic material and a second metallic material, wherein the SLID bond comprises the intermetallic Al/Sn-phase.

摘要翻译： 公开了一种具有第一和第二基板的装置，其中两个基板通过SLID（固体液体互扩散）粘合而彼此连接。 SLID键显示第一金属材料和第二金属材料，其中SLID键包括金属间Al / Sn相。

公开(公告)号：US20120187509A1

公开(公告)日：2012-07-26

申请号：US13120994

申请日：2009-09-15

申请人： Knut Gottfried ,  Maik Wiemer ,  Axel Franke ,  Achim Trautmann ,  Ando Feyh ,  Sonja Knies ,  Joerg Froemel

发明人： Knut Gottfried ,  Maik Wiemer ,  Axel Franke ,  Achim Trautmann ,  Ando Feyh ,  Sonja Knies ,  Joerg Froemel

IPC分类号： H01L29/84 ,  H01L21/768 ,  H01L23/48

CPC分类号： B81C1/00238 ,  B81B2207/012 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/038 ,  H01L24/94 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A contact arrangement for establishing a spaced, electrically conducting connection between a first wafer and a second wafer includes an electrical connection contact, a passivation layer on the electrical connection contact, and a dielectric spacer layer arranged on the passivation layer, wherein the contact arrangement is arranged at least on one of the first wafer and the second wafer, wherein the contact arrangement comprises trenches at least partly filled with a first material capable of forming a metal-metal connection, wherein the trenches are continuous trenches from the dielectric spacer layer through the passivation layer as far as the electrical connection contact, and wherein the first material is arranged in the trenches from the electrical connection contact as far as the upper edge of the trenches.

摘要翻译： 用于在第一晶片和第二晶片之间建立间隔的导电连接的接触装置包括电连接触点，电连接触点上的钝化层以及布置在钝化层上的电介质间隔层，其中触点布置是 布置在所述第一晶片和所述第二晶片中的至少一个上，其中所述接触装置包括至少部分地填充有能够形成金属 - 金属连接的第一材料的沟槽，其中所述沟槽是来自所述电介质间隔层的连续沟槽， 钝化层直到电连接接触，并且其中第一材料从电连接触点设置在沟槽中，直到沟槽的上边缘。

公开(公告)号：US09110090B2

公开(公告)日：2015-08-18

申请号：US13635581

申请日：2011-01-19

申请人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

发明人： Reinhard Neul ,  Christian Rettig ,  Achim Trautmann ,  Daniel Christoph Meisel ,  Alexander Buhmann ,  Manuel Engesser ,  Ando Feyh

IPC分类号： G01P15/12 ,  G01P15/09 ,  G01P15/08

CPC分类号： G01P15/09 ,  G01P15/0802 ,  G01P15/12 ,  G01P15/123

摘要： A piezoresistive micromechanical sensor component includes a substrate, a seismic mass, at least one piezoresistive bar, and a measuring device. The seismic mass is suspended from the substrate such that it can be deflected. The at least one piezoresistive bar is provided between the substrate and the seismic mass and is subject to a change in resistance when the seismic mass is deflected. The at least one piezoresistive bar has a lateral and/or upper and/or lower conductor track which at least partially covers the piezoresistive bar and extends into the region of the substrate. The measuring device is electrically connected to the substrate and to the conductor track and is configured to measure the change in resistance over a circuit path which runs from the substrate through the piezoresistive bar and from the piezoresistive bar through the lateral and/or upper and/or lower conductor track.

摘要翻译： 压阻微机电传感器部件包括基板，抗震块，至少一个压阻棒和测量装置。 地震质量从基板悬挂使其能够偏转。 所述至少一个压阻棒设置在所述基底和所述抗震块之间，并且当所述地震质量被偏转时，所述至少一个压阻棒经受阻力的变化。 至少一个压阻棒具有至少部分地覆盖压阻棒并延伸到衬底的区域中的横向和/或上部和/或下部导体轨道。 测量装置电连接到基板和导体轨道，并且被配置成测量电路的电阻变化，该电阻通过基板通过压阻棒和从压阻棒通过横向和/或上部和/ 或下导体轨道。

公开(公告)号：US10717645B2

公开(公告)日：2020-07-21

申请号：US15535687

申请日：2015-12-17

申请人： Robert Bosch GmbH ,  Ando Feyh ,  Gary O'Brien

发明人： Ando Feyh ,  Gary O'Brien

IPC分类号： H01L31/02 ,  H01L27/146 ,  H01L21/56 ,  B81C1/00 ,  H01L23/28 ,  H01L23/31 ,  H01L23/24 ,  G01L19/14 ,  G01L19/00 ,  B81B7/00

摘要： A method of encapsulating a sensor device includes providing at least one sensor device that has a sensor portion on a substrate. An exclusionary zone is formed above an upper surface of the sensor portion. An outer boundary is formed on or about the sensor device with the outer boundary encircling the exclusionary zone. A mold material is deposited into a volume defined in part by the sensor device, the exclusionary zone, and the outer boundary to encapsulate portions of the sensor device. The exclusionary zone in one embodiment is an inner boundary that is formed on the sensor portion. The inner boundary encircles a portion of the upper surface of the sensor portion. The exclusionary zone in another embodiment is a selectively removable material deposited on the upper surface of the sensor portion. The selectively removable material occupies a space above a portion of the upper surface.

公开(公告)号：US10224540B2

公开(公告)日：2019-03-05

申请号：US14910695

申请日：2014-08-08

申请人： Ashwin K. Samarao ,  Gary O'Brien ,  Ando Feyh ,  Robert Bosch GmbH

发明人： Ashwin K. Samarao ,  Gary O'Brien ,  Ando Feyh

IPC分类号： H01M4/36 ,  H01M10/0525 ,  H01M10/0562 ,  C23C16/40 ,  C23C16/455 ,  C23C16/52 ,  H01M4/04 ,  H01M4/38 ,  H01M4/134 ,  H01M10/058 ,  C23C16/04 ,  H01M4/02

摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.

公开(公告)号：US20160190564A1

公开(公告)日：2016-06-30

申请号：US14910695

申请日：2014-08-08

申请人： Ashwin K. SAMARAO ,  Gary O'BRIEN ,  Ando FEYH ,  ROBERT BOSCH GMBH

发明人： Ashwin K. Samarao ,  Gary O'Brien ,  Ando Feyh

IPC分类号： H01M4/36 ,  H01M4/38 ,  C23C16/40 ,  H01M4/04 ,  C23C16/455 ,  C23C16/52 ,  H01M10/0525 ,  H01M10/0562

CPC分类号： H01M4/366 ,  C23C16/045 ,  C23C16/403 ,  C23C16/45555 ,  C23C16/52 ,  H01M4/0428 ,  H01M4/134 ,  H01M4/382 ,  H01M4/386 ,  H01M10/0525 ,  H01M10/0562 ,  H01M10/058 ,  H01M2004/021 ,  H01M2220/20 ,  H01M2220/30 ,  H01M2300/0071 ,  H01M2300/0094 ,  Y02E60/122 ,  Y02T10/7011

摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.

摘要翻译： 一个实施方案中的锂离子电池包括阴极中的锂基化合物，阳极中的第一多孔硅部分和涂覆第一多孔硅部分并与阴极接触的原子层沉积（ALD）氧化物层。

公开(公告)号：US08779533B2

公开(公告)日：2014-07-15

申请号：US13180954

申请日：2011-07-12

申请人： Ando Feyh ,  Po-Jui Chen

发明人： Ando Feyh ,  Po-Jui Chen

IPC分类号： H01L29/84

CPC分类号： F16K99/003 ,  F16K99/0044

摘要： In one embodiment, a method of opening a passageway to a cavity includes providing a donor portion, forming a heating element adjacent to the donor portion, forming a first sacrificial slab abutting the donor portion, wherein the donor portion and the sacrificial slab are a shrinkable pair, forming a first cavity, a portion of the first cavity bounded by the first sacrificial slab, generating heat with the heating element, forming a first reduced volume slab from the first sacrificial slab using the generated heat and the donor portion, and forming a passageway to the first cavity by forming the first reduced volume slab.

摘要翻译： 在一个实施例中，将通道打开到空腔的方法包括提供供体部分，形成邻近供体部分的加热元件，形成邻接供体部分的第一牺牲板，其中供体部分和牺牲板是可收缩的 形成第一空腔，由第一牺牲板限定的第一空腔的一部分，用加热元件产生热量，使用产生的热量和供体部分从第一牺牲板形成第一减小体积的板坯，并形成 通过形成第一减小体积的板坯到第一空腔的通道。