-
公开(公告)号：US20150279773A1
公开(公告)日：2015-10-01
申请号：US14737716
申请日：2015-06-12
Applicant: Advanced Micro Devices, Inc.
Inventor： Lei Fu , Frank Gottfried Kuechenmeister , Michael Zhuoying Su
IPC: H01L23/498 , H01L21/48 , H01L25/07 , H01L25/00
CPC classification number: H01L23/49827 , H01L21/4853 , H01L21/486 , H01L21/76898 , H01L23/481 , H01L23/49811 , H01L23/49838 , H01L25/0657 , H01L25/073 , H01L25/50 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01322 , H01L2924/15311 , H01L2924/00
Abstract: Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes coupling plural substrates to form a stack. At least one of the plural substrates is a semiconductor chip. Plural conductive vias are formed in a first of the plural substrates. Each of the plural conductive vias includes a first end positioned in the first substrate and a second end projecting out of the first substrate.
Abstract translation: 公开了将堆叠的基板连接到电路板的各种方法和装置。 一方面，提供一种制造方法，其包括将多个基板连接以形成堆叠。 多个基板中的至少一个是半导体芯片。 多个导电通孔形成在多个基板中的第一个中。 多个导电通孔中的每一个包括位于第一基板中的第一端和从第一基板伸出的第二端。
-
公开(公告)号：US09449907B2
公开(公告)日：2016-09-20
申请号：US14737716
申请日：2015-06-12
Applicant: Advanced Micro Devices, Inc.
Inventor： Lei Fu , Frank Gottfried Kuechenmeister , Michael Zhuoying Su
IPC: H01L21/48 , H01L25/07 , H01L23/498 , H01L21/768 , H01L25/065 , H01L25/00 , H01L23/48
CPC classification number: H01L23/49827 , H01L21/4853 , H01L21/486 , H01L21/76898 , H01L23/481 , H01L23/49811 , H01L23/49838 , H01L25/0657 , H01L25/073 , H01L25/50 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01322 , H01L2924/15311 , H01L2924/00
Abstract: Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes coupling plural substrates to form a stack. At least one of the plural substrates is a semiconductor chip. Plural conductive vias are formed in a first of the plural substrates. Each of the plural conductive vias includes a first end positioned in the first substrate and a second end projecting out of the first substrate.
Abstract translation: 公开了将堆叠的基板连接到电路板的各种方法和装置。 一方面，提供一种制造方法，其包括将多个基板连接以形成堆叠。 多个基板中的至少一个是半导体芯片。 多个导电通孔形成在多个基板中的第一个中。 多个导电通孔中的每一个包括位于第一基板中的第一端和从第一基板伸出的第二端。
