公开(公告)号：US20110312110A1

公开(公告)日：2011-12-22

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/52

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08241937B2

公开(公告)日：2012-08-14

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08039857B2

公开(公告)日：2011-10-18

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US20100140639A1

公开(公告)日：2010-06-10

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将发光元件，第一导电构件和第二导电构件密封在第一外部电极和第二外部电极之间并且被配置为透射从发光元件发射的光的外壳。

公开(公告)号：US20100006888A1

公开(公告)日：2010-01-14

申请号：US12498482

申请日：2009-07-07

申请人： Naotake WATANABE ,  Izuru Komatsu ,  Kazuo Shimokawa ,  Hisashi Ito

发明人： Naotake WATANABE ,  Izuru Komatsu ,  Kazuo Shimokawa ,  Hisashi Ito

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： Provided is a method of manufacturing an optical semiconductor device, the method including: providing a resin layer on a light-emitting substrate to cover a principle surface of the light-emitting substrate, the light-emitting substrate including a pair of electrodes in each section of the principle surface, the resin layer including multiple holes each exposing two of the electrodes located adjacent to each other but in the different sections; providing post electrodes respectively on all the paired electrodes formed in all the sections by filling a conductive material in the holes of the resin layer on the principal surface; and forming multiple optical semiconductor devices by cutting the light-emitting substrate into sections, the light-emitting substrate provided with the post electrodes respectively on all the paired electrodes formed in all the sections.

摘要翻译： 提供一种制造光半导体器件的方法，该方法包括：在发光基板上设置树脂层以覆盖发光基板的主表面，所述发光基板在每个部分中包括一对电极 所述树脂层包括多个孔，每个孔暴露位于彼此相邻但在不同部分中的两个电极; 通过在主表面上的树脂层的孔中填充导电材料，分别在所有部分形成的所有成对电极上分别提供柱状电极; 并且通过将发光基板切割成多个部分形成多个光学半导体器件，分别在所有部分上形成的所有成对电极上设置有柱状电极的发光基板。

公开(公告)号：US07910402B2

公开(公告)日：2011-03-22

申请号：US12125421

申请日：2008-05-22

申请人： Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

发明人： Masayuki Uchida ,  Hisashi Ito ,  Kazuhito Higuchi ,  Takashi Togasaki

IPC分类号： H01L21/00

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16013 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/0379 ,  H05K2201/09427 ,  H05K2203/1121 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： For a suppressed breakage after a flip chip connection of a semiconductor device using a low-permittivity insulation film and a lead-free solder together, with an enhanced production yield, bump electrodes (2) are heated by a temperature profile having, after a heating up to a melting point of the bump electrodes (2) or more, a cooling in which a temperature within a range of 190 to 210° C. is kept for an interval of time within a range of 3 to 15 minutes, and a condition is met, such that 1.4

摘要翻译： 为了在使用低介电常数绝缘膜和无铅焊料的半导体器件的倒装芯片连接之后抑制破坏，以提高的生产成本，凸起电极（2）被加热了在加热之后的温度分布 直到凸起电极（2）的熔点以上，将在190〜210℃的范围内的温度保持在3〜15分钟的范围内的时间间隔的冷却，以及条件 使得1.4

公开(公告)号：US07993914B2

公开(公告)日：2011-08-09

申请号：US11956239

申请日：2007-12-13

申请人： Hisashi Ito ,  Yoshikazu Tanaka ,  Kenichi Ogawa ,  Satoshi Kondo ,  Chikara Ohto ,  Iwao Furusawa

发明人： Hisashi Ito ,  Yoshikazu Tanaka ,  Kenichi Ogawa ,  Satoshi Kondo ,  Chikara Ohto ,  Iwao Furusawa

IPC分类号： C12N15/82

CPC分类号： C12N15/8274 ,  C12N15/8223

摘要： A paraquat resistance gene and a vascular tissue- and trichome-specific promoter are provided. The paraquat resistance gene and the vascular tissue- and trichome-specific promoter are isolated by identifying and analyzing genes of Arabidopsis thaliana.

摘要翻译： 提供百草枯抗性基因和血管组织和毛细胞特异性启动子。 通过鉴定和分析拟南芥的基因来分离百草枯抗性基因和血管组织和毛状体特异性启动子。

公开(公告)号：US07402732B2

公开(公告)日：2008-07-22

申请号：US10937710

申请日：2004-09-10

申请人： Hisashi Ito ,  Yoshikazu Tanaka ,  Kenichi Ogawa ,  Satoshi Kondo ,  Chikara Ohto ,  Iwao Furusawa

发明人： Hisashi Ito ,  Yoshikazu Tanaka ,  Kenichi Ogawa ,  Satoshi Kondo ,  Chikara Ohto ,  Iwao Furusawa

IPC分类号： C12H15/82

CPC分类号： C12N15/8274 ,  C12N15/8223

摘要： A paraquat resistance gene and a vascular tissue- and trichome-specific promoter are provided. The paraquat resistance gene and the vascular tissue- and trichome-specific promoter are isolated by identifying and analyzing genes of Arabidopsis thaliana.

摘要翻译： 提供百草枯抗性基因和血管组织和毛细胞特异性启动子。 通过鉴定和分析拟南芥的基因来分离百草枯抗性基因和血管组织和毛状体特异性启动子。

公开(公告)号：US06481880B2

公开(公告)日：2002-11-19

申请号：US09911672

申请日：2001-07-24

申请人： Hiromichi Mizuno ,  Hisashi Ito ,  Yoichi Tatsumi

发明人： Hiromichi Mizuno ,  Hisashi Ito ,  Yoichi Tatsumi

IPC分类号： F21V700

CPC分类号： B60Q1/0683

摘要： The present invention relates to a aiming apparatus to be interposed between a reflector and a housing to adjust direction of light reflected by the reflector; the aiming apparatus comprising an adjusting screw rotatably engaged at one end with the housing at a predetermined position; a pivot nut having at one end a nut portion capable of achieving thread engagement with the other end of the adjusting screw and at the other end a pivot portion, respectively; a pivot holder attached to a rear side of the reflector; and a nut receiver fixed on the front side of the housing at a predetermined position.

公开(公告)号：US06443678B1

公开(公告)日：2002-09-03

申请号：US09729591

申请日：2000-12-04

申请人： Hiromichi Mizuno ,  Hisashi Ito

发明人： Hiromichi Mizuno ,  Hisashi Ito

IPC分类号： F16B3704

摘要： A synthetic resin grommet is provided which has a substantially cylindrical body having a flange portion and a head portion. The flange portion has an inverted dish-like shape and includes an elastically deformable vane-like shaped rim portion. Stopping claws are arranged on an outer circumference of the cylindrical body such that tips of the claws face the flange portion, and an elastically compressible annular rib is formed on top of the head portion of the cylindrical body. An upper portion of the head portion has a tapered face, and the annular rib is formed above the tapered face. With this structure, an inexpensive synthetic resin grommet is provided which exhibits sealing facility when it is fitted to a body of a car or a home electric appliance and when a part is attached thereto through the grommet, and which accurately and securely prevents the entrance of water into the body without requiring intricate procedures such a fitting of a sealing annulus.