摘要:
First of all, a semiconductor substrate which consists of SiC is soaked for ten minutes in a buffered hydrofluoric acid, thereby the oxidized film formed on the surface of the semiconductor substrate being etched. Then, TMA, NH3, TMG, and hydrogen for carrier are supplied at the rates of 10 &mgr;mol/min., 2.5 L/min., and 2 L/min., respectively to the semiconductor substrate at a temperature of 1090° C. by using MOVPE, thereby a buffer layer which consists of single crystal AlN and has a thickness of 15 nm being grown on the main surface of the semiconductor substrate. After lowering the temperature to 800° C., TMA, TMG, TMI, and NH3are supplied at the rates of 0.2 &mgr;mol/min., 2 &mgr;mol/min., 20 &mgr;mol/min., and 5 L/min., respectively, thereby a single crystal layer which consists of AlGaInN being grown on the buffer layer.
摘要:
On an entire surface of a substrate of sapphire having a projection with a width in the lateral direction of approximately 10 .mu.m thereon, a first semiconductor layer of Al.sub.y Ga.sub.1-y N and a second semiconductor layer of In.sub.x Ga.sub.1-x N are successively grown by MOVPE. In this manner, an island-like stacked substance including the isolated first semiconductor layer and the isolated second semiconductor layer can be formed on the top surface of the projection of the substrate.
摘要翻译:在具有横向宽度为大约10μm的突起的蓝宝石衬底的整个表面上,通过MOVPE连续生长Al y Ga 1-y N的第一半导体层和In x Ga 1-x N的第二半导体层。 以这种方式,可以在基板的突起的顶表面上形成包括隔离的第一半导体层和隔离的第二半导体层的岛状堆叠物质。
摘要:
A method for manufacturing a semiconductor is disclosed. The method involves soaking a semiconductor substrate that consists of SiC for ten minutes in a buffered hydrofluoric acid, thereby etching the oxidized film formed on the surface of the semiconductor substrate. Then, TMA, NH.sub.3, TMG, and hydrogen for carrier are supplied at the rates of 10 .mu.mol/min., 2.5 L/min., and 2 L/min., respectively, to the semiconductor substrate at a temperature of 1090.degree. C. by using MOVPE. A buffer layer that consists of a single crystal AlN and has a thickness of about 15 nm is grown on the main surface of the semiconductor substrate. After lowering the temperature to 800.degree. C., TMA, TMG, TMI, and NH.sub.3 are supplied at the rates of 0.2 .mu.mol/min., 2 .mu.mol/min., 20 .mu.mol/min., and 5 L/min., respectively. A single crystal layer which consists of AlGaInN is thus grown on the buffer layer.
摘要:
To provide a drive unit and a drive module which include a shape memory alloy as a drive source to move a driven member and are capable of the high-precision movement of the driven member to a reference position. A drive unit and a drive module can be provided by controlling, in the drive unit and the drive module which include the shape memory alloy as the drive source to move the driven member, the shape memory alloy so that the resistance of the shape memory alloy is equal to the resistance when the driven member is located at the reference position.
摘要:
Provided is a Polar modulation apparatus which compensates for output characteristics of a power amplifier. A data generator generates an amplitude component signal and a phase component signal. A phase modulator generates a phase modulated signal obtained by phase modulating the phase component signal. An adder adds an amplitude offset voltage to the amplitude component signal. A power amplifier which includes a first hetero-junction bipolar transistor, amplifies the phase modulated signal by using the amplitude component signal. A monitor unit monitors the power amplifier and outputs a monitor voltage. The control unit calculates the amplitude offset voltage according to the monitor voltage and outputs the calculated amplitude offset voltage to the adder. The monitor unit includes a second hetero-junction bipolar transistor and outputs a collector emitter voltage of the second hetero-junction bipolar transistor as the monitor voltage.
摘要:
A drive device includes a setting unit 12 for setting a control value using a control value-displacement characteristic at a predetermined reference temperature showing a relationship between a control value used to position a movable unit 5 and a displacement of the movable unit 5; a drive unit 20 for supplying drive power corresponding to the control value set by the setting unit 12 to a shape-memory alloy 1 and causing the shape-memory alloy 1 to expand or contract, thereby positioning the movable unit 5; and a correction unit 13 for correcting the control value so as to correct a position shift of the movable unit 5 from a target position resulting from a difference between a control value-displacement characteristic at an ambient temperature and a control value-displacement characteristic at the reference temperature based on the ambient temperature detected by a temperature detection unit 11.
摘要:
In a first mode in which the power level of a transmission output signal (S6) is to be high, an output from the multiplier (2) is input to an amplitude modulation signal amplifier (4), and a radio frequency power amplifier (5) performs amplitude modulation on a radio frequency phase modulated signal (S4) using a nonlinear area with a supply voltage from the amplitude modulation signal amplifier (4). In a second mode in which the power level of a transmission output signal (S6) is to be low, the output from the multiplier (2) is input to a variable gain amplifier (7), and the variable gain amplifier (7) performs amplitude modulation on the radio frequency phase modulated signal (S4). The amplitude modulated signal is output without passing through the radio frequency power amplifier (5).
摘要:
An object of the preset invention is to provide a technique capable of preventing occurrence of an assembly error. A driving apparatus for driving an object includes: a driving part having a stationary part and a moving part; and a displacement transmitting part for transmitting a displacement to the object in accordance with a drive displacement of the moving part. The displacement transmitting part and the moving part coupled to the displacement transmitting part are integrally molded.
摘要:
An object of the present invention is to provide a small-sized image sensor device having high precision of moving an object to be moved. The image sensor device includes: a fixed unit; a movable unit including an image sensor; a beam unit fixed to the fixed unit and movably supporting the movable unit; a driving unit for applying a driving force for moving the movable unit; and a wire unit provided for the beam unit and electrically connecting the image sensor and an external circuit.
摘要:
Provided are an amplifier section in which N amplifiers (N is an integer of 2 or more) are serially connected to one another, and which performs an amplitude modulation on an input signal using an amplitude signal, which is a control signal; and M distortion compensation apparatuses (M is a natural number satisfying M