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    CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, METHOD OF PREPARING THE SAME, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT, AND CHEMICAL MECHANICAL POLISHING METHOD
    8.
    发明申请
    CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, METHOD OF PREPARING THE SAME, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT, AND CHEMICAL MECHANICAL POLISHING METHOD 有权
    化学机械抛光水性分散体，其制备方法，化学机械抛光水溶液制备试剂盒和化学机械抛光方法

    公开(公告)号：US20100252774A1

    公开(公告)日：2010-10-07

    申请号：US12749934

    申请日：2010-03-30

    申请人： Hirotaka SHIDA ,  Akihiro Takemura ,  Taichi Abe

    发明人： Hirotaka SHIDA ,  Akihiro Takemura ,  Taichi Abe

    IPC分类号： C09K13/00

    CPC分类号： C09K3/1463 ,  C09K3/1409

    摘要： A chemical mechanical polishing aqueous dispersion that is used to polish a polishing target that includes a wiring layer that contains tungsten, the chemical mechanical polishing aqueous dispersion including: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica having an average particle diameter calculated from a specific surface area determined by the BET method of 10 to 60 nm, the content (MA) (mass %) of the cationic water-soluble polymer (A) and the content (MC) (mass %) of the colloidal silica (C) satisfying the relationship “MA/MC=0.0001 to 0.003”, and the chemical mechanical polishing aqueous dispersion having a pH of 1 to 3.

    摘要翻译： 一种化学机械抛光水性分散体，其用于抛光包括含有钨的布线层的抛光对象，所述化学机械抛光水分散体包括：（A）阳离子水溶性聚合物; （B）铁（III）化合物; 和（C）由BET法测定的比表面积为10〜60nm，阳离子型水溶性聚合物（A）的含量（质量％）（质量％）和含量 （C）的胶体二氧化硅（C）的质量％（MC）（质量％），pH为1〜3的化学机械研磨用水系分散体。

    Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
    10.
    发明授权
    Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing 有权
    用于化学机械抛光的水分散体，化学机械抛光工艺，半导体器件的生产过程以及用于制备用于化学机械抛光的水分散体的材料

    公开(公告)号：US07005382B2

    公开(公告)日：2006-02-28

    申请号：US10694890

    申请日：2003-10-29

    申请人： Kazuo Nishimoto ,  Tatsuaki Sakano ,  Akihiro Takemura ,  Masayuki Hattori ,  Nobuo Kawahashi ,  Naoto Miyashita ,  Atsushi Shigeta ,  Yoshitaka Matsui ,  Kazuhiko Ida

    发明人： Kazuo Nishimoto ,  Tatsuaki Sakano ,  Akihiro Takemura ,  Masayuki Hattori ,  Nobuo Kawahashi ,  Naoto Miyashita ,  Atsushi Shigeta ,  Yoshitaka Matsui ,  Kazuhiko Ida

    IPC分类号： B24B1/00

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  H01L21/02024

    摘要： Provided are an aqueous dispersion for chemical mechanical polishing, which planarizes a surface to be polished and has high shelf stability, a chemical mechanical polishing process excellent in selectivity when surfaces of different materials are polished, and a production process of a semiconductor device. A first aqueous dispersion contains a water-soluble quaternary ammonium salt, an inorganic acid salt, abrasive grains and an aqueous medium. A second aqueous dispersion contains at least a water-soluble quaternary ammonium salt, another basic organic compound other than the water-soluble quaternary ammonium salt, an inorganic acid salt, a water-soluble polymer, abrasive grains and an aqueous medium. The second aqueous dispersion is composed of a first aqueous dispersion material (I) obtained by mixing a water-soluble quaternary ammonium salt and an inorganic acid salt into an aqueous medium, and a second aqueous dispersion material (II) obtained by mixing a water-soluble polymer and another basic organic compound other than the water-soluble quaternary ammonium salt into an aqueous medium. Abrasive grains are contained in at least one of the aqueous dispersion materials.

    摘要翻译： 提供了用于化学机械抛光的水分散体，其平坦化待抛光的表面并具有高的储存稳定性，当抛光不同材料的表面时选择性优异的化学机械抛光工艺以及半导体器件的生产工艺。 第一种水性分散体含有水溶性季铵盐，无机酸盐，磨粒和水性介质。 第二水性分散体至少包含水溶性季铵盐，除水溶性季铵盐以外的其它碱性有机化合物，无机酸盐，水溶性聚合物，磨料颗粒和水性介质。 第二水性分散体由通过将水溶性季铵盐和无机酸盐混合到水性介质中而得到的第一水分散体（I）和第二水分散体（II） 水溶性聚合物和除了水溶性季铵盐之外的另一种碱性有机化合物转化成水性介质。 磨粒在至少一种水分散体中含有。