Multi-Layer Capacitor and Mold Capacitor
    1.
    发明申请
    Multi-Layer Capacitor and Mold Capacitor 审中-公开
    多层电容器和模具电容器

    公开(公告)号:US20080030922A1

    公开(公告)日:2008-02-07

    申请号:US11575656

    申请日:2005-09-27

    IPC分类号: H01G4/38

    CPC分类号: H01G4/385 H01G4/232

    摘要: A mulitilayer A capacitor includes a plurality of dielectric substrates (2) which are layered; a pair of terminal electrodes formed on the plurality of dielectric substrates; a plurality of internal electrodes (3) arranged on each of the dielectric substrates and having outer edges (30) opposed apart by a predetermined interval, wherein at least one of the internal electrodes (3) is arranged apart from the adjacent internal electrode (3) by the maximum interval (5) at the center of the outer edges (30).

    摘要翻译: 多层电容器包括层叠的多个电介质基板(2) 形成在所述多个电介质基板上的一对端子电极; 多个内部电极(3),布置在每个所述电介质基板上,并且具有相对隔开预定间隔的外边缘(30),其中所述内部电极(3)中的至少一个与所述相邻的内部电极 )在外边缘(30)的中心处的最大间隔(5)。

    Multilayer capacitor and mold capacitor
    2.
    发明授权
    Multilayer capacitor and mold capacitor 有权
    多层电容器和模具电容器

    公开(公告)号:US07133274B2

    公开(公告)日:2006-11-07

    申请号:US11333543

    申请日:2006-01-18

    IPC分类号: H01G4/05 H01G4/06

    CPC分类号: H01G4/012 H01G4/232 H01G4/30

    摘要: A multilayer capacitor including a base body, which is a dielectric substance; and a plurality of electrode layers, which is laminated in the base body and has a plurality of divided electrodes, in which there are at least three or more kinds of electrode layers having different number of electrodes, and the electrode layer having the most electrodes is interposed between the other electrode layers. The multilayer capacitor achieves high withstand voltage and high reliability with no damage to the size reduction and high capacitance of the capacitor and a mold capacitor having the multilayer capacitor built-in.

    摘要翻译: 一种多层电容器,包括作为电介质的基体; 以及层叠在基体中并具有多个分割电极的多个电极层,其中至少有三种以上具有不同数量的电极的电极层,并且具有最多电极的电极层是 介于其他电极层之间。 该层叠电容器具有高的耐受电压和高的可靠性,并且不会损坏电容器的尺寸减小和高容量以及内置多层电容器的模具电容器。

    Multilayer capacitor and mold capacitor
    4.
    发明申请
    Multilayer capacitor and mold capacitor 失效
    多层电容器和模具电容器

    公开(公告)号:US20070058326A1

    公开(公告)日:2007-03-15

    申请号:US11518220

    申请日:2006-09-11

    IPC分类号: H01G4/06

    CPC分类号: H01G4/30 H01G4/12

    摘要: A multilayer capacitor 1 has a laminated body 20 configured by laminating a plurality of dielectric substrates 2 each having a plurality of internal electrodes 3 and 5 formed on its main surface and a capacitance component is generated between the facing internal electrodes 3 and 5. The dielectric constant of the dielectric substrate located at a central portion of a lamination direction of the laminated body 20 is lower than that of the dielectric substrate 2 located at the edge of the lamination direction.

    摘要翻译: 多层电容器1具有通过层叠多个形成在其主表面上的多个内部电极3和5的电介质基板2构成的层叠体20,并且在相对的内部电极3和5之间产生电容成分。电介质 位于层叠体20的层叠方向的中央部的电介质基板的常数比位于层叠方向的边缘的电介质基板2的常数低。

    Multilayer capacitor and mold capacitor
    5.
    发明授权
    Multilayer capacitor and mold capacitor 失效
    多层电容器和模具电容器

    公开(公告)号:US07333318B2

    公开(公告)日:2008-02-19

    申请号:US11518220

    申请日:2006-09-11

    IPC分类号: H01G4/06

    CPC分类号: H01G4/30 H01G4/12

    摘要: A multilayer capacitor 1 has a laminated body 20 configured by laminating a plurality of dielectric substrates 2 each having a plurality of internal electrodes 3 and 5 formed on its main surface and a capacitance component is generated between the facing internal electrodes 3 and 5. The dielectric constant of the dielectric substrate located at a central portion of a lamination direction of the laminated body 20 is lower than that of the dielectric substrate 2 located at the edge of the lamination direction.

    摘要翻译: 多层电容器1具有通过层叠多个形成在其主表面上的多个内部电极3和5的电介质基板2构成的层叠体20,并且在相对的内部电极3和5之间产生电容成分。电介质 位于层叠体20的层叠方向的中央部的电介质基板的常数比位于层叠方向的边缘的电介质基板2的常数低。

    Electronic Component
    7.
    发明申请
    Electronic Component 有权
    电子元器件

    公开(公告)号:US20080024960A1

    公开(公告)日:2008-01-31

    申请号:US11597880

    申请日:2005-06-03

    IPC分类号: B29C45/14 H05K7/00

    摘要: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

    摘要翻译: 本发明的目的是提供一种以低成本制造工艺制造的电子部件,同时实现耐冲击性,耐久性,抗弯曲性,安装可靠性等的改善,而不需要微调等。本发明是 具有元件2的电子部件1,设置在元件2上的一对端子部4和覆盖端子部4的一部分和元件2的外部覆盖材料5, 倾斜部分10设置在底面9的角部和外部覆盖材料5的侧面的方式,端子部4从外部覆盖材料的倾斜部10和底面9的角部突出 相交。