公开(公告)号：US08726494B2

公开(公告)日：2014-05-20

申请号：US12574537

申请日：2009-10-06

申请人： Akio Katsube ,  Hideo Nakagoshi ,  Hidemasa Kawai

发明人： Akio Katsube ,  Hideo Nakagoshi ,  Hidemasa Kawai

IPC分类号： B23P19/00

CPC分类号： H01L24/83 ,  H01L23/142 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  Y10T29/4913 ,  Y10T29/49998 ,  Y10T29/53265 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.

摘要翻译： 在板上设置有至少表面粘合导电性的弹性材料，通过弹性材料的粘合力将构成电子部件的构成部件的基板保持在弹性材料的表面， 诸如半导体芯片的元件安装在基板上的固定位置。

公开(公告)号：US20100018041A1

公开(公告)日：2010-01-28

申请号：US12574537

申请日：2009-10-06

申请人： Akio Katsube ,  Hideo Nakagoshi ,  Hidemasa Kawai

发明人： Akio Katsube ,  Hideo Nakagoshi ,  Hidemasa Kawai

IPC分类号： B23P19/04

CPC分类号： H01L24/83 ,  H01L23/142 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  Y10T29/4913 ,  Y10T29/49998 ,  Y10T29/53265 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.

摘要翻译： 在板上设置有至少表面粘合导电性的弹性材料，通过弹性材料的粘合力将构成电子部件的构成部件的基板保持在弹性材料的表面， 诸如半导体芯片的元件安装在基板上的固定位置。

公开(公告)号：US07624492B1

公开(公告)日：2009-12-01

申请号：US09689774

申请日：2000-10-13

申请人： Akio Katsube ,  Hideo Nakagoshi ,  Hidemasa Kawai

发明人： Akio Katsube ,  Hideo Nakagoshi ,  Hidemasa Kawai

IPC分类号： B23P25/00 ,  B29C65/08

CPC分类号： H01L24/83 ,  H01L23/142 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  Y10T29/4913 ,  Y10T29/49998 ,  Y10T29/53265 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.

摘要翻译： 在板上设置有至少表面粘合导电性的弹性材料，通过弹性材料的粘合力将构成电子部件的构成部件的基板保持在弹性材料的表面， 诸如半导体芯片的元件安装在基板上的固定位置。

公开(公告)号：US08492959B2

公开(公告)日：2013-07-23

申请号：US13337331

申请日：2011-12-27

申请人： Hiroki Kitayama ,  Hideo Nakagoshi ,  Kiyoshi Kurihara

发明人： Hiroki Kitayama ,  Hideo Nakagoshi ,  Kiyoshi Kurihara

IPC分类号： H01L41/08

CPC分类号： H01L41/22 ,  C08K3/04 ,  C08K7/16 ,  C08K2201/011 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  F04B45/047 ,  H01G9/0032 ,  H01G9/155 ,  H01L41/0478 ,  H01L41/0973 ,  H01L41/29 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126

摘要： A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.

摘要翻译： 提供压电体和金属板之间的良好的导电性和接合性的接合结构包括：金属板和压电体的电极，其使用导电性粘合剂彼此接合以提供导电性，导电粘合剂包括碳 具有纳米级平均粒度的黑色，并且具有包含在无溶剂或溶剂基树脂中的糊状形式，使得炭黑形成平均粒度为约1μm至约50μm的聚集体。 导电粘合剂被施加在金属板和压电体的电极之间，并且对金属板和压电体进行加热和加压，使得炭黑团聚体变形，从而硬化导电粘合剂。

公开(公告)号：US20120091863A1

公开(公告)日：2012-04-19

申请号：US13337331

申请日：2011-12-27

申请人： Hiroki Kitayama ,  Hideo Nakagoshi ,  Kiyoshi Kurihara

发明人： Hiroki Kitayama ,  Hideo Nakagoshi ,  Kiyoshi Kurihara

IPC分类号： H01L41/00 ,  H01L41/22

CPC分类号： H01L41/22 ,  C08K3/04 ,  C08K7/16 ,  C08K2201/011 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  F04B45/047 ,  H01G9/0032 ,  H01G9/155 ,  H01L41/0478 ,  H01L41/0973 ,  H01L41/29 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126

摘要： A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.

摘要翻译： 提供压电体和金属板之间的良好的导电性和接合性的接合结构包括：金属板和压电体的电极，其使用导电性粘合剂彼此接合以提供导电性，导电粘合剂包括碳 具有纳米级平均粒径的黑色，并且具有包含在无溶剂或溶剂基树脂中的糊状形式，使得炭黑形成平均粒径为约1μm至约50μm的聚集体。 导电粘合剂被施加在金属板和压电体的电极之间，并且对金属板和压电体进行加热和加压，使得炭黑团聚体变形，从而硬化导电粘合剂。

公开(公告)号：US20090072383A1

公开(公告)日：2009-03-19

申请号：US12277360

申请日：2008-11-25

申请人： Hideo Nakagoshi

发明人： Hideo Nakagoshi

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/3677 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05666 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element is bonded to a heat sink with the conductive material disposed therebetween. Solder can be used as the conductive material, for example. By introducing molten solder into the non-through hole while having solder disposed between the semiconductor element and the heat sink, the heat dissipating path is provided and the heat sink is bonded to the semiconductor element.

摘要翻译： 半导体元件设置有由第一主表面中的非通孔限定并且填充有导电材料的散热路径。 将半导体元件与设置在其间的导电材料接合到散热器。 例如，可以使用焊料作为导电材料。 通过在半导体元件和散热器之间设置焊料的同时将熔融焊料引入非通孔中，设置散热路径，并将散热器接合到半导体元件。

公开(公告)号：US07928559B2

公开(公告)日：2011-04-19

申请号：US12277360

申请日：2008-11-25

申请人： Hideo Nakagoshi

发明人： Hideo Nakagoshi

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/3677 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05666 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element is bonded to a heat sink with the conductive material disposed therebetween. Solder can be used as the conductive material, for example. By introducing molten solder into the non-through hole while having solder disposed between the semiconductor element and the heat sink, the heat dissipating path is provided and the heat sink is bonded to the semiconductor element.

摘要翻译： 半导体元件设置有由第一主表面中的非通孔限定并且填充有导电材料的散热路径。 将半导体元件与设置在其间的导电材料接合到散热器。 例如，可以使用焊料作为导电材料。 通过在半导体元件和散热器之间设置焊料的同时将熔融焊料引入非通孔中，设置散热路径，并将散热器接合到半导体元件。