公开(公告)号：US5793106A

公开(公告)日：1998-08-11

申请号：US608565

申请日：1996-02-28

申请人： Akio Yasukawa ,  Hirohisa Yamamura ,  Shotaro Naito ,  Heikichi Kuwahara ,  Osamu Suzuki ,  Masanori Muso ,  Nobuo Fujieda

发明人： Akio Yasukawa ,  Hirohisa Yamamura ,  Shotaro Naito ,  Heikichi Kuwahara ,  Osamu Suzuki ,  Masanori Muso ,  Nobuo Fujieda

IPC分类号： H01L23/31 ,  H01L23/40 ,  H01L25/07 ,  H01L25/18 ,  H01L23/34 ,  H01L23/10 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3511

摘要： A semiconductor device, suitable for use in an invertor device for large currents in which IGBT chips are used and of which a high reliability is required, has an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in the space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein, for purposes of attaching the insulating plate to the heatsink, the resin case is used to press the insulating plate onto the heatsink. Some benefits of this construction are that is makes it possible to eliminate the problem of fatigue failure of a solder layer previously used for attaching the insulating plate to the heatsink by dispensing with that solder layer, while at the same time improving the transfer of heat from the insulating plate to the heatsink, and thereby improving the removal of heat from the device. The construction also makes it possible to reduce cracking of the insulating plate, reduce breakage of mounting portions of the resin case and to use the device to make a small, thin, light and highly reliable invertor device.

摘要翻译： 适用于其中使用IGBT芯片并且需要高可靠性的大电流的逆变器装置的半导体器件具有安装半导体芯片的绝缘板，封装半导体芯片的树脂壳体，填充物 树脂填充到树脂壳体中并覆盖半导体芯片并填充半导体芯片和树脂壳体之间的空间以及安装有绝缘板的散热器，其中为了将绝缘板连接到散热器， 树脂盒用于将绝缘板压在散热片上。 这种结构的一些好处在于，可以消除先前用于通过分配该焊料层将绝缘板附着到散热器上的焊料层的疲劳破坏的问题，同时改善来自 将绝缘板连接到散热器，从而改善从装置中除去热量。 该结构还可以减少绝缘板的开裂，减少树脂壳体的安装部分的破损，并且使用该装置来制造小型，薄型，高可靠性的逆变器装置。

公开(公告)号：US20090114958A1

公开(公告)日：2009-05-07

申请号：US12264936

申请日：2008-11-05

申请人： Norio Nakazato ,  Nobuo Fujieda ,  Masayoshi Ishibashi ,  Midori Kato ,  Tadashi Arai ,  Takeo Shiba

发明人： Norio Nakazato ,  Nobuo Fujieda ,  Masayoshi Ishibashi ,  Midori Kato ,  Tadashi Arai ,  Takeo Shiba

IPC分类号： H01L29/78 ,  H01L21/311

CPC分类号： H01L21/4867 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2201/09254 ,  H01L2924/00

摘要： A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.

摘要翻译： 一种具有电子装置的布线板，包括平行布置在基板上的多个沟槽，在所述基板的一端的一端将所述多个沟槽彼此连通的公共沟槽，形成在所述多个栅极的底部的金属层 沟槽，和与金属层连接并形成在公共沟槽的底部上的电极层，其中公共沟槽的底部上的电极层构成场效应晶体管的源电极或漏电极，由此布线板 并且可以形成具有良好细线图案和使用涂料的图案之间良好窄间隙的电子电路，并且可以实现有机薄膜电子器件和电子电路的成本降低，因为它们可以是 通过开发印刷技术实现。

公开(公告)号：US08120070B2

公开(公告)日：2012-02-21

申请号：US12264936

申请日：2008-11-05

申请人： Norio Nakazato ,  Nobuo Fujieda ,  Masayoshi Ishibashi ,  Midori Kato ,  Tadashi Arai ,  Takeo Shiba

发明人： Norio Nakazato ,  Nobuo Fujieda ,  Masayoshi Ishibashi ,  Midori Kato ,  Tadashi Arai ,  Takeo Shiba

IPC分类号： H01L21/311

CPC分类号： H01L21/4867 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2201/09254 ,  H01L2924/00

摘要： A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.

摘要翻译： 一种具有电子装置的布线板，包括平行布置在基板上的多个沟槽，在所述基板的一端的一端将所述多个沟槽彼此连通的公共沟槽，形成在所述多个栅极的底部的金属层 沟槽，和与金属层连接并形成在公共沟槽的底部上的电极层，其中公共沟槽的底部上的电极层构成场效应晶体管的源电极或漏电极，由此布线板 并且可以形成具有良好细线图案和使用涂料的图案之间良好窄间隙的电子电路，并且可以实现有机薄膜电子器件和电子电路的成本降低，因为它们可以是 通过开发印刷技术实现。