公开(公告)号：US07021956B2

公开(公告)日：2006-04-04

申请号：US10501396

申请日：2002-11-21

申请人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

发明人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

IPC分类号： H01R11/20

CPC分类号： H01R4/2433 ,  H01R4/2454 ,  H01R12/58 ,  H01R13/415

摘要： An insulation displacement terminal is formed entirely of an integral metal sheet. The terminal includes first and second plate-like insulation displacement groove-forming portions opposed to each other in a first direction along which an insulated wire extends. Each of the insulation displacement groove-forming portions has an insulation displacement blade of a U-shape defining an insulation displacement groove. Bottom portions of the insulation displacement groove-forming portions are interconnected by an interconnecting portion. A lead extends downwardly from one side edge of the interconnecting portion. A holding space for an insulation of the insulated wire is formed between a pair of plate portions which are formed respectively at opposite side edges of the first insulation displacement groove-forming portion by bending. Each of the plate portions has a retaining projection and a bendable piece portion.

摘要翻译： 绝缘位移端子整体由整体金属板形成。 端子包括在绝缘线延伸的第一方向上彼此相对的第一和第二板状绝缘位移槽形成部。 每个绝缘位移槽形成部分具有限定绝缘位移槽的U形绝缘位移叶片。 绝缘置换槽形成部分的底部通过互连部分相互连接。 引线从互连部分的一个侧边缘向下延伸。 用于绝缘线绝缘的保持空间形成在通过弯曲分别形成在第一绝缘置换槽形成部分的相对侧边缘处的一对板部分之间。 每个板部分具有保持突起和可弯曲的片部分。

公开(公告)号：US06971903B2

公开(公告)日：2005-12-06

申请号：US10502008

申请日：2003-11-21

申请人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

发明人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

IPC分类号： H01R4/24 ,  H01R13/66

CPC分类号： H01R4/2433 ,  H01R4/2454 ,  H01R12/515

摘要： The insulation displacement terminal 3 is retained on the terminal retainer portion 5 of the main housing 6. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. After the insulation displacement terminal 3 in such a subassembly state is connected by insulation displacement with a desired portion of the insulated wire 2, the first cover housing 7 is combined with the main housing 6. The receiving portion 44 of the second cover housing 8 receives the insulation displacement load via the bottom plate 13 of the main housing 6 and the circuit board 10. This enables the inadvertent bending of the bottom plate 13 and circuit board 10 to be prevented, the reliable insulation displacement connecting of the connector with the insulated wire to be attained, and the so-called in-housing insulation displacement connecting of the connector with the insulated wire to be substantially carried out.

摘要翻译： 绝缘位移端子3保持在主壳体6的端子保持部5上。 绝缘位移端子3的引线12通过主壳体6的底板13和电路板10焊接到电路板10的第一表面10a上，电路板10被保持在第二保持空间11之间，主体 壳体6和第二盖壳体8。 在这种组装状态下的绝缘位移端子3通过绝缘导线2的期望部分的绝缘位移连接之后，第一盖壳体7与主壳体6组合。 第二盖壳体8的接收部分44经由主壳体6的底板13和电路板10接收绝缘位移负载。 这样可以防止底板13和电路板10的无意弯曲，连接器与绝缘电线的可靠的绝缘位移连接将被实现，以及所谓的连接器与 绝缘电线基本上进行。

公开(公告)号：US20050106927A1

公开(公告)日：2005-05-19

申请号：US10502008

申请日：2003-11-21

申请人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

发明人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

IPC分类号： H01R4/24 ,  H01R13/66

CPC分类号： H01R4/2433 ,  H01R4/2454 ,  H01R12/515

摘要： The insulation displacement terminal 3 is retained on the terminal retainer portion 5 of the main housing 6. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. After the insulation displacement terminal 3 in such a subassembly state is connected by insulation displacement with a desired portion of the insulated wire 2, the first cover housing 7 is combined with the main housing 6. The receiving portion 44 of the second cover housing 8 receives the insulation displacement load via the bottom plate 13 of the main housing 6 and the circuit board 10. This enables the inadvertent bending of the bottom plate 13 and circuit board 10 to be prevented, the reliable insulation displacement connecting of the connector with the insulated wire to be attained, and the so-called in-housing insulation displacement connecting of the connector with the insulated wire to be substantially carried out.

公开(公告)号：US20050079754A1

公开(公告)日：2005-04-14

申请号：US10501396

申请日：2002-11-21

申请人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

发明人： Akira Goto ,  Yoshikazu Takagi ,  Kazushi Miyahara ,  Megumi Chiyoda

IPC分类号： H01R4/24 ,  H01R13/415

CPC分类号： H01R4/2433 ,  H01R4/2454 ,  H01R12/58 ,  H01R13/415

摘要： An insulation displacement terminal 3 is formed entirely of an integral metal sheet. The terminal includes first and second plate-like insulation displacement groove-forming portions 71 and 72 opposed to each other in a first direction X along which an insulated wire extends. Each of the insulation displacement groove-forming portions 71 and 72 has an insulation displacement blade 74 of a U-shape defining an insulation displacement groove 73. Bottom portions of the insulation displacement groove-forming portions 71 and 72 are interconnected by an interconnecting portion 75. A lead 12 extends downwardly from one side edge of the interconnecting portion 75. A holding space R for an insulation of the insulated wire is formed between a pair of plate portions 78 and 79 which are formed respectively at opposite side edges of the first insulation displacement groove-forming portion 71 by bending. Each of the plate portions 78 and 79 has a retaining projection 80 and a bendable piece portion 81. Retaining projections 76, 77 extend respectively from the opposite side edges of each of the insulation displacement groove-forming portions 71 and 72.

摘要翻译： 绝缘位移端子3整体由整体金属片形成。 端子包括在绝缘线延伸的第一方向X上彼此相对的第一和第二板状绝缘位移槽形成部分71和72。 每个绝缘位移槽形成部分71和72具有限定绝缘位移槽73的U形绝缘位移叶片74.绝缘位移槽形成部分71和72的底部通过互连部分75互连 引线12从互连部分75的一个侧边缘向下延伸。用于绝缘线绝缘的保持空间R形成在分别形成在第一绝缘体的相对侧边缘处的一对板部分78和79之间 位移槽形成部71。 每个板部分78和79具有保持突起80和可弯曲片部分81.保持突起76,77分别从每个绝缘置换槽形成部分71和72的相对侧边缘延伸。

公开(公告)号：US20060138637A1

公开(公告)日：2006-06-29

申请号：US11315450

申请日：2005-12-22

申请人： Akira Nagamine ,  Megumi Chiyoda

发明人： Akira Nagamine ,  Megumi Chiyoda

IPC分类号： H01L23/48

CPC分类号： H01R12/721 ,  H01R13/113

摘要： The card edge connector includes a housing and a card edge terminal. A plurality of through holes is formed on the housing. A cable is electrically connected to the card edge terminal. The card edge terminal to which the cable is attached by crimping is pressed and inserted into a plurality of through holes on the housing. Conductor areas are provided on the surface and the back of the substrate. The substrate is inserted and fitted into the housing and also held by the holding part of the card edge terminal which is pressed and inserted into the housing and electrically conducted to the conductor areas.

摘要翻译： 卡边缘连接器包括壳体和卡缘终端。 多个通孔形成在壳体上。 电缆电连接到卡边缘终端。 通过压接将电缆连接到的卡边缘端子被按压并插入到壳体上的多个通孔中。 导体区域设置在基板的表面和背面。 基板被插入并装配到壳体中，并且还被卡边缘终端的保持部分保持，卡边缘终端被按压并插入到壳体中并导电到导体区域。

公开(公告)号：US07198525B2

公开(公告)日：2007-04-03

申请号：US11315450

申请日：2005-12-22

申请人： Akira Nagamine ,  Megumi Chiyoda

发明人： Akira Nagamine ,  Megumi Chiyoda

IPC分类号： H01R13/187

CPC分类号： H01R12/721 ,  H01R13/113

摘要： The card edge connector includes a housing and a card edge terminal. A plurality of through holes is formed on the housing. A cable is electrically connected to the card edge terminal. The card edge terminal to which the cable is attached by crimping is pressed and inserted into a plurality of through holes on the housing. Conductor areas are provided on the surface and the back of the substrate. The substrate is inserted and fitted into the housing and also held by the holding part of the card edge terminal which is pressed and inserted into the housing and electrically conducted to the conductor areas.

摘要翻译： 卡边缘连接器包括壳体和卡缘终端。 多个通孔形成在壳体上。 电缆电连接到卡边缘终端。 通过压接将电缆连接到的卡边缘端子被按压并插入到壳体上的多个通孔中。 导体区域设置在基板的表面和背面。 基板被插入并装配到壳体中，并且还被卡边缘终端的保持部分保持，卡边缘终端被按压并插入到壳体中并导电到导体区域。