Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device
    2.
    发明授权
    Nitride semiconductor light-emitting element, illuminating device, liquid crystal display device, method for producing nitride semiconductor light-emitting element and method for manufacturing illuminating device 有权
    氮化物半导体发光元件,照明装置,液晶显示装置,氮化物半导体发光元件的制造方法及照明装置的制造方法

    公开(公告)号:US08791473B2

    公开(公告)日:2014-07-29

    申请号:US13256529

    申请日:2009-07-09

    IPC分类号: H01L33/32

    摘要: An illuminating device according to the present invention includes at least a first nitride-based semiconductor light-emitting element and a second nitride-based semiconductor light-emitting element, in which: the first nitride-based semiconductor light-emitting element and the second nitride-based semiconductor light-emitting element each include a semiconductor chip; the semiconductor chip includes a nitride-based semiconductor multilayer structure 45 formed from an AlxInyGazN (x+y+z=1, x≧0, y≧0, z≧0) semiconductor, and the nitride-based semiconductor multilayer structure 20 includes an active layer region 24 having an m-plane as an interface; the first nitride-based semiconductor light-emitting element and the second nitride-based semiconductor light-emitting element each emit polarized light from the active layer region 24; and, when the polarized light emitted from the first nitride-based semiconductor light-emitting element and the polarized light emitted from the second nitride-based semiconductor light-emitting element have wavelengths λ1 and λ2, respectively, and thicknesses of the semiconductor chips 45 of the first nitride-based semiconductor light-emitting element and the second nitride-based semiconductor light-emitting element are given as d1 and d2, respectively, the following relations are satisfied: λ1

    摘要翻译: 根据本发明的照明装置至少包括第一氮化物基半导体发光元件和第二氮化物基半导体发光元件,其中:第一氮化物基半导体发光元件和第二氮化物半导体发光元件 半导体发光元件各自包括半导体芯片; 半导体芯片包括由Al x In y Ga z N(x + y + z = 1,x≥0,y≥0,z≥0)形成的氮化物基半导体多层结构45,氮化物类半导体多层结构20包括 具有m面作为界面的有源层区域24; 第一氮化物系半导体发光元件和第二氮化物系半导体发光元件均从有源层区域24发射偏振光; 并且当从第一氮化物基半导体发光元件发射的偏振光和从第二氮化物基半导体发光元件发出的偏振光分别具有波长λ1和λ2时,半导体芯片45的厚度 第一氮化物系半导体发光元件和第二氮化物系半导体发光元件分别赋予d1和d2,满足以下关系:λ1<λ2和d1

    Semiconductor device manufacturing method
    4.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US08268706B2

    公开(公告)日:2012-09-18

    申请号:US13061544

    申请日:2009-07-29

    IPC分类号: H01L21/203

    摘要: A method for fabricating a semiconductor device according to the present invention includes the steps of: growing a p-type gallium nitride-based compound semiconductor layer by performing a metalorganic chemical vapor deposition process in a heated atmosphere so that the crystal-growing plane of the semiconductor layer is an m plane (Step S13); and cooling the p-type gallium nitride-based compound semiconductor layer (Step S14) after the step of growing has been carried out. The step of growing includes supplying hydrogen gas to a reaction chamber in which the p-type gallium nitride-based compound semiconductor layer is grown. The step of cooling includes cooling the p-type gallium nitride-based compound semiconductor layer with the supply of the hydrogen gas to the reaction chamber cut off.

    摘要翻译: 根据本发明的制造半导体器件的方法包括以下步骤:通过在加热的气氛中进行金属有机化学气相沉积工艺来生长p型氮化镓基化合物半导体层,使得晶体生长面 半导体层为m面(步骤S13)。 并且在生长步骤之后冷却p型氮化镓基化合物半导体层(步骤S14)。 生长步骤包括向生长p型氮化镓系化合物半导体层的反应室供给氢气。 冷却步骤包括:将氢气供给到反应室切断时,冷却p型氮化镓系化合物半导体层。

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT, ILLUMINATING DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING ILLUMINATING DEVICE
    5.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT, ILLUMINATING DEVICE, LIQUID CRYSTAL DISPLAY DEVICE, METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING ILLUMINATING DEVICE 有权
    氮化物半导体发光元件,照明装置,液晶显示装置,用于制造氮化物半导体发光元件的方法和制造照明装置的方法

    公开(公告)号:US20120002134A1

    公开(公告)日:2012-01-05

    申请号:US13256529

    申请日:2009-07-09

    IPC分类号: G02F1/1335 H01L33/02

    摘要: An illuminating device according to the present invention includes at least a first nitride-based semiconductor light-emitting element and a second nitride-based semiconductor light-emitting element, in which: the first nitride-based semiconductor light-emitting element and the second nitride-based semiconductor light-emitting element each include a semiconductor chip; the semiconductor chip includes a nitride-based semiconductor multilayer structure 45 formed from an AlxInyGazN (x+y+z=1, x≧0, y≧0, z≧0) semiconductor, and the nitride-based semiconductor multilayer structure 20 includes an active layer region 24 having an m-plane as an interface; the first nitride-based semiconductor light-emitting element and the second nitride-based semiconductor light-emitting element each emit polarized light from the active layer region 24; and, when the polarized light emitted from the first nitride-based semiconductor light-emitting element and the polarized light emitted from the second nitride-based semiconductor light-emitting element have wavelengths λ1 and λ2, respectively, and thicknesses of the semiconductor chips 45 of the first nitride-based semiconductor light-emitting element and the second nitride-based semiconductor light-emitting element are given as d1 and d2, respectively, the following relations are satisfied: λ1

    摘要翻译: 根据本发明的照明装置至少包括第一氮化物基半导体发光元件和第二氮化物基半导体发光元件,其中:第一氮化物基半导体发光元件和第二氮化物半导体发光元件 半导体发光元件各自包括半导体芯片; 半导体芯片包括由Al x In y Ga z N(x + y + z = 1,x≥0,y≥0,z≥0)形成的氮化物基半导体多层结构45,氮化物类半导体多层结构20包括 具有m面作为界面的有源层区域24; 第一氮化物系半导体发光元件和第二氮化物系半导体发光元件均从有源层区域24发射偏振光; 并且当从第一氮化物基半导体发光元件发射的偏振光和从第二氮化物基半导体发光元件发出的偏振光分别具有波长λ1和λ2时,半导体芯片45的厚度 第一氮化物系半导体发光元件和第二氮化物系半导体发光元件分别赋予d1和d2,满足以下关系:λ1<λ2和d1

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    6.
    发明申请
    SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
    半导体器件制造方法

    公开(公告)号:US20110159667A1

    公开(公告)日:2011-06-30

    申请号:US13061544

    申请日:2009-07-29

    IPC分类号: H01L21/203

    摘要: A method for fabricating a semiconductor device according to the present invention includes the steps of: growing a p-type gallium nitride-based compound semiconductor layer by performing a metalorganic chemical vapor deposition process in a heated atmosphere so that the crystal-growing plane of the semiconductor layer is an m plane (Step S13); and cooling the p-type gallium nitride-based compound semiconductor layer (Step S14) after the step of growing has been carried out. The step of growing includes supplying hydrogen gas to a reaction chamber in which the p-type gallium nitride-based compound semiconductor layer is grown. The step of cooling includes cooling the p-type gallium nitride-based compound semiconductor layer with the supply of the hydrogen gas to the reaction chamber cut off.

    摘要翻译: 根据本发明的制造半导体器件的方法包括以下步骤:通过在加热的气氛中进行金属有机化学气相沉积工艺来生长p型氮化镓基化合物半导体层,使得晶体生长面 半导体层为m面(步骤S13)。 并且在生长步骤之后冷却p型氮化镓基化合物半导体层(步骤S14)。 生长步骤包括向生长p型氮化镓系化合物半导体层的反应室供给氢气。 冷却步骤包括:将氢气供给到反应室切断时,冷却p型氮化镓系化合物半导体层。

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PROCESS FOR PRODUCTION THEREOF
    10.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PROCESS FOR PRODUCTION THEREOF 有权
    氮化物半导体发光元件及其生产工艺

    公开(公告)号:US20120001223A1

    公开(公告)日:2012-01-05

    申请号:US13256061

    申请日:2010-12-27

    IPC分类号: H01L33/32

    摘要: A nitride-based semiconductor light-emitting device 31 includes: an n-type GaN substrate 1 which has an m-plane principal surface; a current diffusing layer 7 provided on the n-type GaN substrate 1; an n-type nitride semiconductor layer 2 provided on the current diffusing layer 7; an active layer 3 provided on the n-type nitride semiconductor layer 2; a p-type nitride semiconductor layer 4 provided on the active layer 3; a p-electrode 5 which is in contact with the p-type nitride semiconductor layer 4; and an n-electrode 6 which is in contact with the n-type GaN substrate 1 or the n-type nitride semiconductor layer 2. The donor impurity concentration of the n-type nitride semiconductor layer 2 is not more than 5×1018 cm−3, and the donor impurity concentration of the current diffusing layer 7 is ten or more times the donor impurity concentration of the n-type nitride semiconductor layer 2.

    摘要翻译: 氮化物系半导体发光元件31具备:具有m面主面的n型GaN衬底1, 设置在n型GaN衬底1上的电流扩散层7; 设置在电流扩散层7上的n型氮化物半导体层2; 设置在n型氮化物半导体层2上的有源层3; 设置在有源层3上的p型氮化物半导体层4; 与p型氮化物半导体层4接触的p电极5; 以及与n型GaN衬底1或n型氮化物半导体层2接触的n电极6.n型氮化物半导体层2的施主杂质浓度不大于5×1018cm- 3,电流扩散层7的施主杂质浓度为n型氮化物半导体层2的施主杂质浓度的十倍以上。