SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20100052185A1

    公开(公告)日:2010-03-04

    申请号:US12546916

    申请日:2009-08-25

    IPC分类号: H01L23/28 H01L21/56

    摘要: According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of the second conductive material other than one surface contacting with the encapsulating material.

    摘要翻译: 根据本发明的一个方面,提供了一种半导体器件,其包括半导体元件的半导体芯片,半导体芯片的第一电极配置在半导体元件的第一表面上,半导体元件的第二电极 配置在与半导体芯片的第一表面相对的第二表面上,封装半导体芯片的封装材料,在封装材料中配置的第一孔和第二孔,第一电极的一部分和第二电极的一部分 电极被暴露,第一导电材料经由第一孔连接到半导体芯片的第一表面,第二导电材料经由第二孔连接到半导体芯片的第二表面,并且镀覆膜覆盖五个表面 除了与封装材料接触的一个表面之外的第一导电材料 以及第二导电材料的五个表面,而不是与封装材料接触的一个表面。

    Semiconductor device and method for fabricating the same
    5.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08193643B2

    公开(公告)日:2012-06-05

    申请号:US12546916

    申请日:2009-08-25

    IPC分类号: H01L23/28

    摘要: According to an aspect of the present invention, there is provided a semiconductor device, including a semiconductor chip including a semiconductor element, a first electrode of the semiconductor chip being configured on a first surface of the semiconductor element, a second electrode of the semiconductor element being configured on a second surface opposed to the first surface of the semiconductor chip, an encapsulating material encapsulating the semiconductor chip, a first hole and a second hole being configured in the encapsulating material, a portion of the first electrode and a portion of the second electrode being exposed, a first conductive material being connected to the first surface of the semiconductor chip via the first hole, a second conductive material being connected to the second surface of the semiconductor chip via the second hole, and a plating film covering five surfaces of the first conductive material other than one surface contacting with the encapsulating material and five surfaces of the second conductive material other than one surface contacting with the encapsulating material.

    摘要翻译: 根据本发明的一个方面,提供了一种半导体器件,其包括半导体元件的半导体芯片,半导体芯片的第一电极配置在半导体元件的第一表面上,半导体元件的第二电极 配置在与半导体芯片的第一表面相对的第二表面上,封装半导体芯片的封装材料,在封装材料中配置的第一孔和第二孔,第一电极的一部分和第二电极的一部分 电极被暴露,第一导电材料经由第一孔连接到半导体芯片的第一表面,第二导电材料经由第二孔连接到半导体芯片的第二表面,并且镀覆膜覆盖五个表面的 除了与封装材料接触的一个表面之外的第一导电材料 以及第二导电材料的五个表面,而不是与封装材料接触的一个表面。