公开(公告)号：US20050025434A1

公开(公告)日：2005-02-03

申请号：US10631933

申请日：2003-07-31

申请人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

发明人： Alan Benner ,  Evan Colgan ,  How Lin ,  John Magerlein ,  Frank Pompeo ,  Subhash Shinde ,  Daniel Stigliani

IPC分类号： G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

摘要： An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

摘要翻译： 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

公开(公告)号：US20070014527A1

公开(公告)日：2007-01-18

申请号：US11524597

申请日：2006-09-21

申请人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

发明人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

IPC分类号： G02B6/00

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423

摘要： Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

摘要翻译： 用于安装光纤的光学装置，部件和方法以及用于使用改进的硅V形槽或光纤V沟槽阵列将光耦合到光纤的光纤，其中V形槽被设计用于精确对准/间隔光学 纤维在硅的表面下“凹进”。 光纤可以在硅衬底的表面下方凹入，从而可以去除（重叠）在硅表面之上延伸的覆层的精确控制部分。 当去除包覆层时，可以减小光纤芯和光电子器件之间的分离，从而当光纤硅阵列连接到例如VCSEL阵列时改善光耦合。

公开(公告)号：US20050169597A1

公开(公告)日：2005-08-04

申请号：US11096424

申请日：2005-04-01

申请人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

发明人： Evan Colgan ,  Fuad Doany ,  Bruce Furman ,  Daniel Stigliani

IPC分类号： G02B6/36 ,  G02B6/42 ,  G02B6/00

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/423

摘要： Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

公开(公告)号：US20050058408A1

公开(公告)日：2005-03-17

申请号：US10667234

申请日：2003-09-17

申请人： Evan Colgan ,  Bruce Furman ,  Daniel Stigliani

发明人： Evan Colgan ,  Bruce Furman ,  Daniel Stigliani

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4214 ,  G02B6/4246 ,  G02B6/4249

摘要： An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an opposite second surface is in communication with the support electronic chip set via the first surface while a second substrate is in communication with the second surface of the first substrate. The second substrate is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set and an optical fiber array is aligned at a first end with the optoelectronic transducer and with an optical signaling medium at a second end. An electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via an electrical signaling medium, and the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

公开(公告)号：US20060104031A1

公开(公告)日：2006-05-18

申请号：US10904555

申请日：2004-11-16

申请人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

发明人： Evan Colgan ,  Frank Pompeo ,  Glenn Daves ,  Hilton Toy ,  Bruce Furman ,  David Edwards ,  Michael Gaynes ,  Mukta Farooq ,  Sung Kang ,  Steven Ostrander ,  Jaimal Williamson ,  Da-Yuan Shih ,  Donald Henderson

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

摘要翻译： 提供了一种用于组件载体上的电子部件的冷却系统。 该系统包括框架，喷雾歧管和密封构件。 框架具有开口并且可连接到部件载体，使得在开口和电子部件之间限定环形区域。 喷雾歧管被密封在开口上以限定电子部件的后表面上方的喷射区域。 喷雾歧管在后表面喷洒冷却液。 密封构件密封环形区域，使得部件载体上的输入/输出连接器与冷却流体隔离。

公开(公告)号：US20060002087A1

公开(公告)日：2006-01-05

申请号：US10883534

申请日：2004-07-01

申请人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

发明人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F9/028 ,  F28F13/06 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.

摘要翻译： 提供了用于诸如IC芯片的电子器件的微通道冷却的装置和方法，其能够实现高功率密度电子器件的高效和低工作压力的微通道冷却。 用于微通道冷却的装置包括集成微通道散热装置和流体分配歧管结构，其被设计成提供冷却剂流体的均匀流动和分布并使沿着冷却剂流动路径的压降最小化。

公开(公告)号：US20050127500A1

公开(公告)日：2005-06-16

申请号：US10732015

申请日：2003-12-10

申请人： Evan Colgan ,  Claudis Feger ,  Gary Goth ,  George Katopis ,  John Magerlein ,  Edmund Sprogis

发明人： Evan Colgan ,  Claudis Feger ,  Gary Goth ,  George Katopis ,  John Magerlein ,  Edmund Sprogis

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L21/56 ,  H01L23/10 ,  H01L23/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an integrated circuit packaging structure, such as in an MCM or in a SCM, a compliant thermally conductive material is applied between a heat-generating integrated circuit chip and a substrate attached thereto. Raised regions are defined on the back side of the chip aligned to areas of a higher than average power density on the front active surface of the chip such that a thinner layer of the compliant thermally conductive material is disposed between the chip and the substrate in this area after assembly thereof resulting in a reduced “hot-spot” temperature on the chip. In an exemplary embodiment, the substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.

摘要翻译： 在诸如在MCM或SCM中的集成电路封装结构中，在发热集成电路芯片和附着于其之间的衬底之间施加兼容的导热材料。 凸起区域被限定在芯片的背面上，与芯片的前活性表面上的高于平均功率密度的区域相对准，使得在该芯片和衬底之间设置较薄的柔性导热材料层 组装后的区域导致芯片上的“热点”温度降低。 在示例性实施例中，基板包括散热器，冷却板，散热器，热管，散热帽，封装盖或其它冷却构件中的一个。

公开(公告)号：US20070232090A1

公开(公告)日：2007-10-04

申请号：US11395355

申请日：2006-03-31

申请人： Evan Colgan ,  Paul Coteus ,  Hubert Harrer ,  Gareth Hougham ,  John Magerlein ,  John Torok

发明人： Evan Colgan ,  Paul Coteus ,  Hubert Harrer ,  Gareth Hougham ,  John Magerlein ,  John Torok

IPC分类号： H01R12/00

CPC分类号： H05K1/141 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01R12/7082 ,  H01R13/2414 ,  H05K2201/0367 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10719

摘要： LGA (land grid array) interposers having variable pitch connectors and distribution wiring to support space transforming I/O interconnections between first level chip modules and second level packaging. Apparatus and methods for constructing high-performance electronic modules (such as processor modules for computer systems) using LGA interposers that provide space transform I/O interconnections between fine pitch I/O contacts on a chip module and coarse pitch contacts on a circuit board.

摘要翻译： 具有可变节距连接器和配线的LGA（地面栅格阵列）插入器，以支持第一级芯片模块与第二级封装之间的空间转换I / O互连。 使用LGA插入器构建高性能电子模块（例如计算机系统的处理器模块）的装置和方法，其提供芯片模块上的精细间距I / O触点与电路板上的粗略俯仰触点之间的空间变换I / O互连。

公开(公告)号：US20060002088A1

公开(公告)日：2006-01-05

申请号：US10883392

申请日：2004-07-01

申请人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

发明人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

IPC分类号： H05K7/20

CPC分类号： F28F3/04 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

公开(公告)号：US20080026605A1

公开(公告)日：2008-01-31

申请号：US11865217

申请日：2007-10-01

申请人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

发明人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

IPC分类号： H01R12/04

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.