Method and system for imaging an object using multiple distinguishable electromagnetic waves transmitted by a source array
    3.
    发明授权
    Method and system for imaging an object using multiple distinguishable electromagnetic waves transmitted by a source array 有权
    使用由源阵列传输的多个可分辨的电磁波对物体进行成像的方法和系统

    公开(公告)号:US07557348B2

    公开(公告)日:2009-07-07

    申请号:US11733613

    申请日:2007-04-10

    IPC分类号: G01J5/02

    CPC分类号: G01J3/10 G01J3/42 G01N21/3581

    摘要: A method and system for imaging an object includes transmitting distinguishable electromagnetic waves from a plurality of radiators of an antenna array, wherein each of the distinguishable electromagnetic waves is distinguishable from others by a detector. Each of the radiators transmits radiation comprising a different distinguishable electromagnetic wave. The method also includes imaging at least a portion of the antenna array onto a targeted object, wherein each image area of a plurality of image areas on the targeted object corresponds to an image of a respective radiator of the antenna array, and detecting a plurality of resultant electromagnetic waves, wherein the resultant electromagnetic waves are transmitted, scattered, or reflected by respective image areas on the targeted object in response to each of the respective image areas being illuminated by the radiation transmitted by the respective radiator of the source array.

    摘要翻译: 用于成像对象的方法和系统包括从天线阵列的多个辐射器发送可区分的电磁波,其中每个可区分电磁波通过检测器与其他可区别的电磁波区分开。 每个辐射器发射包括不同的可分辨电磁波的辐射。 该方法还包括将天线阵列的至少一部分成像到目标物体上,其中目标物体上的多个图像区域中的每个图像区域对应于天线阵列的相应散热器的图像,并且检测多个 响应于由源阵列的相应散热器发射的辐射照射的每个相应的图像区域,由此产生的电磁波由目标物体上的各个图像区域传播,散射或反射。

    LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS
    4.
    发明申请
    LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS 失效
    基于激光的材料加工方法与系统

    公开(公告)号:US20120196454A1

    公开(公告)日:2012-08-02

    申请号:US13421372

    申请日:2012-03-15

    摘要: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

    摘要翻译: 各种实施例可以用于对工件的目标材料进行基于激光的修改,同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域,使得材料有效地从该区域移除并且在该区域内靠近该区域的一些不想要的材料, 或者两者相对于以较低的重复率可获得的量减少。 超短脉冲激光系统的实施例可以包括光纤放大器或光纤激光器。 各种实施例适合于在半导体衬底上或半导体衬底内的切割,切割,划线和形成特征中的至少一个。 工件材料可以包括金属,无机或有机电介质,或任何要用飞秒,皮秒和/或纳秒脉冲微加工的材料。

    Beam scanning imaging method and apparatus
    5.
    发明授权
    Beam scanning imaging method and apparatus 有权
    光束扫描成像方法和装置

    公开(公告)号:US07897924B2

    公开(公告)日:2011-03-01

    申请号:US12055063

    申请日:2008-03-25

    IPC分类号: G01J5/02

    摘要: An imaging apparatus uses focusing and collecting optics in combination with steering optics for efficient imaging of a target using an extended terahertz electro-magnetic range challenged by weak sources and low sensitivity of detection. By proper location of optics to utilize angular conversion of the beam to a lateral scan, a rastering imaging apparatus is demonstrated without moving target or entire imaging system. In at least one embodiment a mirror-lens set is used to steer the terahertz (THz) beam along and (or) to collect the THz beam from each point of the target. The target is imaged with a much higher speed than when moving the target or the entire imaging system. A THz wave image can be taken at video frequency for practical usage of the apparatus in diverse application areas, where it has not been considered to be feasible.

    摘要翻译: 成像装置使用聚焦和收集光学元件与转向光学元件组合,用于使用由弱光源挑战的扩展的太赫兹电磁范围和低灵敏度的目标进行有效成像。 通过将光束的角度转换用于横向扫描的光学器件的适当位置,在没有移动目标或整个成像系统的情况下证明了成像设备。 在至少一个实施例中,使用镜面透镜组来转向太赫兹(THz)光束并且(或)以从目标的每个点收集THz光束。 目标以比移动目标或整个成像系统时高得多的速度成像。 可以在视频下拍摄太赫兹波图像,以便在不被认为是可行的各种应用领域中实际使用该设备。

    T-ray Microscope
    6.
    发明授权
    T-ray Microscope 有权
    T型显微镜

    公开(公告)号:US06977379B2

    公开(公告)日:2005-12-20

    申请号:US10434329

    申请日:2003-05-08

    IPC分类号: G01N21/35 G02B21/00

    摘要: A microscope for producing an image of a target using THz radiation. The microscope comprises a source for providing an optical pump pulse and an optical probe pulse; a THz emitter for activation by pump pulse to emit a THz pulse that irradiates the target to form a target-modified THz pulse; a THz detector for modulating the probe pulse with the target-modified THz pulse to create a modulated optical probe pulse characteristic of the target; an optical detection system for modifying and detecting the modulated optical probe pulse and converting the modulated optical probe pulse to electronic information; and a processor for receiving the electronic information and producing an image of the sample using the electronic information. The THz emitter and detector comprise one or more EO crystals. The target is positioned on one of the EO crystals in a near-field of the THz pulse.

    摘要翻译: 用于使用太赫兹辐射产生目标图像的显微镜。 显微镜包括用于提供光泵浦脉冲和光探针脉冲的源; 用于通过泵浦脉冲激活的THz发射器发射照射目标以形成目标修正的THz脉冲的THz脉冲; THz检测器,用于用目标修正的THz脉冲调制探针脉冲,以产生目标的调制光探针脉冲特性; 光学检测系统,用于修改和检测调制的光探针脉冲并将调制的光探针脉冲转换成电子信息; 以及处理器,用于接收电子信息并使用电子信息产生样本的图像。 太赫兹发射器和检测器包括一个或多个EO晶体。 目标位于太赫兹脉冲的近场中的一个EO晶体上。

    Laser-based material processing methods and systems
    8.
    发明授权
    Laser-based material processing methods and systems 失效
    基于激光的材料加工方法和系统

    公开(公告)号:US08785813B2

    公开(公告)日:2014-07-22

    申请号:US13421372

    申请日:2012-03-15

    摘要: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

    摘要翻译: 各种实施例可以用于对工件的目标材料进行基于激光的修改,同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域,使得材料有效地从该区域移除并且在该区域内靠近该区域的一些不想要的材料, 或者两者相对于以较低的重复率可获得的量减少。 超短脉冲激光系统的实施例可以包括光纤放大器或光纤激光器。 各种实施例适合于在半导体衬底上或半导体衬底内的切割,切割,划线和形成特征中的至少一个。 工件材料可以包括金属,无机或有机电介质,或任何要用飞秒,皮秒和/或纳秒脉冲微加工的材料。

    LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS
    9.
    发明申请
    LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS 有权
    基于激光的材料加工设备和方法

    公开(公告)号:US20110240617A1

    公开(公告)日:2011-10-06

    申请号:US13037614

    申请日:2011-03-01

    IPC分类号: B23K26/36

    CPC分类号: B23K26/00 Y02P40/57

    摘要: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.

    摘要翻译: 各种实施例可以用于对工件的目标材料进行基于激光的修改,同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并且以足够短的脉冲宽度将激光脉冲引导到工件的区域,使得材料通过来自该区域的非线性光学吸收和一定数量的热影响区域以及热应力 区域内的材料,邻近区域或两者都相对于使用具有较长脉冲的激光可获得的量减少。 在至少一个实施例中,超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在复合材料上或复合材料内的切割,切割,划线和成形特征中的至少一个。

    High repetition rate, linear, true time optical delay line

    公开(公告)号:US20070009207A1

    公开(公告)日:2007-01-11

    申请号:US10537626

    申请日:2005-03-08

    IPC分类号: G02B6/26

    摘要: An optical delay line for use with an optical source including input/output optics optically coupled to the optical source and a curved mirror with a reflective surface that is centered about an evolute curve of the delay line to retro-reflect light traveling along a delay line beam path tangent to the edge of the evolute curve. The input/output optics direct light from the optical source along the delay line beam path and direct delayed light from the delay line beam path out of the optical delay line along an output beam path. The input/output optics and/or the curved mirror rotate about the evolute curve at a selected angular speed. The reflective surface has a curvature based on a parametric curve that is calculated from the evolute curve such that the delay of the delay line varies according to a predetermined function as the input/output optics and/or the curved mirror rotate.