公开(公告)号：US20100121231A1

公开(公告)日：2010-05-13

申请号：US12576891

申请日：2009-10-09

申请人： Alan Y. Chow ,  George Y. McLean ,  Vincent Y. Chow ,  Jay Cech ,  Christopher M. Bonner ,  Vladimir Gelfandbein

发明人： Alan Y. Chow ,  George Y. McLean ,  Vincent Y. Chow ,  Jay Cech ,  Christopher M. Bonner ,  Vladimir Gelfandbein

IPC分类号： A61F9/00

CPC分类号： A61N1/36046 ,  A61H5/00 ,  A61N1/0543 ,  A61N2/06 ,  A61N2/12

摘要： Mechanically activated objects or devices for use in treating degenerative retinal diseases are provided. Such devices apply mechanical forces to tissues of an eye to effectuate treatment and are configured for chronic implantation (thereby applying chronic stimulation/irritation) in or on the eye. The devices may be configured for contact with a retina of the eye, preferably positioned in a subretinal space. Various embodiments comprise a moving member configured for chronic contact with at least a portion of the eye, which moving member is activated by an actuator. In some embodiments, the actuator may be distally located relative to the moving member. Alternatively, the moving member may be supported by a body member that, optionally, also supports the actuator.

摘要翻译： 提供用于治疗退行性视网膜疾病的机械活化物体或装置。 这样的装置将机械力施加到眼睛的组织以实现治疗，并且被配置为在眼睛中或眼睛上进行慢性植入（从而施加慢性刺激/刺激）。 所述装置可以被配置为与眼睛的视网膜接触，优选地定位在视网膜下空间中。 各种实施例包括构造成用于与眼睛的至少一部分慢性接触的移动构件，该移动构件由致动器致动。 在一些实施例中，致动器可以相对于移动构件向远侧定位。 或者，移动构件可以由主体构件支撑，其可选地还支撑致动器。

公开(公告)号：US07981062B2

公开(公告)日：2011-07-19

申请号：US12576891

申请日：2009-10-09

申请人： Alan Y. Chow ,  George Y. McLean ,  Vincent Y. Chow ,  Jay Cech ,  Christopher M. Bonner ,  Vladimir Gelfandbein

发明人： Alan Y. Chow ,  George Y. McLean ,  Vincent Y. Chow ,  Jay Cech ,  Christopher M. Bonner ,  Vladimir Gelfandbein

IPC分类号： A61H1/00

CPC分类号： A61N1/36046 ,  A61H5/00 ,  A61N1/0543 ,  A61N2/06 ,  A61N2/12

摘要： Mechanically activated objects or devices for use in treating degenerative retinal diseases are provided. Such devices apply mechanical forces to tissues of an eye to effectuate treatment and are configured for chronic implantation (thereby applying chronic stimulation/irritation) in or on the eye. The devices may be configured for contact with a retina of the eye, preferably positioned in a subretinal space. Various embodiments comprise a moving member configured for chronic contact with at least a portion of the eye, which moving member is activated by an actuator. In some embodiments, the actuator may be distally located relative to the moving member. Alternatively, the moving member may be supported by a body member that, optionally, also supports the actuator.

摘要翻译： 提供用于治疗退行性视网膜疾病的机械活化物体或装置。 这样的装置将机械力施加到眼睛的组织以实现治疗，并且被配置为在眼睛中或眼睛上进行慢性植入（从而施加慢性刺激/刺激）。 所述装置可以被配置为与眼睛的视网膜接触，优选地定位在视网膜下空间中。 各种实施例包括构造成用于与眼睛的至少一部分慢性接触的移动构件，该移动构件由致动器致动。 在一些实施例中，致动器可以相对于移动构件向远侧定位。 或者，移动构件可以由主体构件支撑，其可选地还支撑致动器。

公开(公告)号：US20050033202A1

公开(公告)日：2005-02-10

申请号：US10822437

申请日：2004-04-12

申请人： Alan Chow ,  George McLean ,  Vincent Chow ,  Jay Cech ,  Christopher Bonner ,  Vladimir Gelfandbein

发明人： Alan Chow ,  George McLean ,  Vincent Chow ,  Jay Cech ,  Christopher Bonner ,  Vladimir Gelfandbein

IPC分类号： A61H1/00 ,  A61H5/00 ,  A61N1/05 ,  A61N1/36 ,  A61N2/06 ,  A61N2/12

CPC分类号： A61N1/36046 ,  A61H5/00 ,  A61N1/0543 ,  A61N2/06 ,  A61N2/12

摘要： Mechanically activated objects or devices for use in treating degenerative retinal diseases are provided. Such devices apply mechanical forces to tissues of an eye to effectuate treatment and are configured for chronic implantation (thereby applying chronic stimulation/irritation) in or on the eye. The devices may be configured for contact with a retina of the eye, preferably positioned in a subretinal space. Various embodiments comprise a moving member configured for chronic contact with at least a portion of the eye, which moving member is activated by an actuator. In some embodiments, the actuator may be distally located relative to the moving member. Alternatively, the moving member may be supported by a body member that, optionally, also supports the actuator.

摘要翻译： 提供用于治疗退行性视网膜疾病的机械活化物体或装置。 这样的装置将机械力施加到眼睛的组织以实现治疗，并且被配置为在眼睛中或眼睛上进行慢性植入（从而施加慢性刺激/刺激）。 所述装置可以被配置为与眼睛的视网膜接触，优选地定位在视网膜下空间中。 各种实施例包括构造成用于与眼睛的至少一部分慢性接触的移动构件，该移动构件由致动器致动。 在一些实施例中，致动器可以相对于移动构件向远侧定位。 或者，移动构件可以由主体构件支撑，其可选地还支撑致动器。

公开(公告)号：US4705606A

公开(公告)日：1987-11-10

申请号：US697092

申请日：1985-01-31

申请人： Peter L. Young ,  Jay Cech ,  Kin Li

发明人： Peter L. Young ,  Jay Cech ,  Kin Li

IPC分类号： H01L21/3205 ,  H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  C25D5/02

CPC分类号： H01L23/147 ,  H01L21/4846 ,  H01L23/538 ,  H05K3/107 ,  H05K3/465 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K2201/0154 ,  H05K2201/0376 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/242 ,  H05K3/244 ,  H05K3/388 ,  H05K3/4644

摘要： A method for fabricating thin-film multilayer interconnect signal planes for connecting semiconductor integrated circuits is described. In this method, a first pattern of thin-film metallic interconnect lines is formed on a surface of a substrate. Then a first dielectric layer is formed over the entire surface of the substrate covering the pattern of thin-film metallic interconnect lines. A portion of the dielectric layer is then removed to expose the thin-film metallic interconnect lines so that a series of trenches is formed above each interconnect line. The interconnect lines are then electroplated to form a series of thicker metal interconnect lines such that the thicker metal interconnect lines and the dielectric layer form a substantially planer surface. This process can then be repeated in its entirely to form a plurality of interconnect signal planes. In the preferred embodiment, metallic vias are provided between each layer of metallic interconnect lines for electrical connection purposes.

摘要翻译： 描述了用于连接半导体集成电路的制造薄膜多层互连信号面的方法。 在该方法中，在基板的表面上形成薄膜金属互连线的第一图案。 然后，在覆盖薄膜金属互连线图形的基板的整个表面上形成第一电介质层。 然后去除电介质层的一部分以暴露薄膜金属互连线，使得在每个互连线上方形成一系列沟槽。 然后将互连线电镀以形成一系列较厚的金属互连线，使得较厚的金属互连线和电介质层形成基本上平的表面。 然后可以将该过程完全重复以形成多个互连信号平面。 在优选实施例中，为了电连接目的，金属通孔设置在每层金属互连线之间。

公开(公告)号：US20080142475A1

公开(公告)日：2008-06-19

申请号：US11611633

申请日：2006-12-15

申请人： Peter V. Loeppert ,  Anthony Minervini ,  Jay Cech ,  Sung B. Lee

发明人： Peter V. Loeppert ,  Anthony Minervini ,  Jay Cech ,  Sung B. Lee

IPC分类号： C30B33/08

CPC分类号： B81C1/00547 ,  B81C2201/0143

摘要： A directed energy source is applied to a portion of a material, creating at least one altered region and leaving at least one unaltered region. The material is exposed to an etchant which removes the at least one altered region leaving substantially all of the unaltered region.

摘要翻译： 定向能量源被施加到材料的一部分，产生至少一个改变的区域并留下至少一个未改变的区域。 该材料暴露于蚀刻剂，其除去至少一个改变的区域，留下基本上所有未改变的区域。

公开(公告)号：US4996584A

公开(公告)日：1991-02-26

申请号：US257171

申请日：1988-10-13

申请人： Peter L. Young ,  Jay Cech ,  Kin Li

发明人： Peter L. Young ,  Jay Cech ,  Kin Li

IPC分类号： H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/465 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/538 ,  H05K3/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0289 ,  H05K2201/0154 ,  H05K2201/0376 ,  H05K2201/09563 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/242 ,  H05K3/244 ,  H05K3/388 ,  H05K3/4644

摘要： A method for fabricating thin-film multilayer interconnect signal planes for connecting semiconductor integrated circuits (chips) is described. In this method, a first pattern of thin-film metallic interconnect lines is formed on a surface of a substrate. Then a first dielectric layer is formed over the entire surface of the substrate covering the pattern of thin-film metallic interconnect lines. A portion of the dielectric layer is then removed to expose the thin-film metallic interconnect lines so that a series of trenches is formed above each interconnect line. The interconnect lines are then electroplated to form a series of thicker metal interconnect lines such that the thicker metal interconnect lines and the dielectric layer form a substantially planar surface. This process can then be repeated in its entirely to form a plurality of interconnect signal planes. In the preferred embodiment, metallic vias are provided between each layer of metallic interconnect lines for electrical connection purposes.

摘要翻译： 描述了一种制造用于连接半导体集成电路（芯片）的薄膜多层互连信号面的方法。 在该方法中，在基板的表面上形成薄膜金属互连线的第一图案。 然后，在覆盖薄膜金属互连线图形的基板的整个表面上形成第一电介质层。 然后去除电介质层的一部分以暴露薄膜金属互连线，使得在每个互连线上方形成一系列沟槽。 然后将互连线电镀以形成一系列较厚的金属互连线，使得较厚的金属互连线和电介质层形成基本平坦的表面。 然后可以将该过程完全重复以形成多个互连信号平面。 在优选实施例中，为了电连接目的，金属通孔设置在每层金属互连线之间。