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    Method and system for curing ultra violet curable sealant that is shadowed by metallization
    3.
    发明授权
    Method and system for curing ultra violet curable sealant that is shadowed by metallization 有权
    用于固化由金属化阴影的紫外线可固化密封剂的方法和系统

    公开(公告)号：US06179679B2

    公开(公告)日：2001-01-30

    申请号：US09425701

    申请日：1999-10-22

    申请人： Robert J. von Gutfeld ,  James H. Glownia ,  Gareth G. Hougham

    发明人： Robert J. von Gutfeld ,  James H. Glownia ,  Gareth G. Hougham

    IPC分类号： G02F11339

    CPC分类号： G02F1/1339

    摘要： The invention is a method for curing a sealant used to affix two substrates to one another. The sealant requires curing by heat or uv photons. To overcome the shadowing caused by metal patterns, the uv light in the form of laser light is delivered at slant angles without losing light due to strong reflections caused by shallow angles of incidence. Several embodiments are described including a modulation technique for a providing scanned uv beam. Another method utilizes a sufficiently strong pulsed stationary or moving laser beam that can heat the regions of a metallized pattern to provide thermal energy for curing the sealant while providing uv photons through open regions of the metal pattern to access the sealant so as to afford a photolytic cure of a hybrid sealant.

    摘要翻译： 本发明是用于固化用于将两个基板彼此粘合的密封剂的方法。 密封剂需要通过热或紫外光子固化。 为了克服由金属图案引起的阴影，由于由较小的入射角引起的强烈的反射，激光形式的紫外光以倾斜的角度传送而不会损失光。 描述了包括用于提供扫描的紫外线束的调制技术的几个实施例。 另一种方法使用足够强的脉冲静止或移动的激光束，其可以加热金属化图案的区域以提供用于固化密封剂的热能，同时通过金属图案的开放区域提供紫外光子以进入密封剂，以提供光解 固化混合密封剂。

    Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiation
    4.
    发明授权
    Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiation 有权
    使用激光辐射用非环氧或环氧丙烯酸酯密封剂密封两个基板的方法

    公开(公告)号：US07274426B2

    公开(公告)日：2007-09-25

    申请号：US11335252

    申请日：2006-01-18

    申请人： Robert J. von Gutfeld ,  James H. Glownia ,  Gareth G. Hougham

    发明人： Robert J. von Gutfeld ,  James H. Glownia ,  Gareth G. Hougham

    IPC分类号： G02F1/1339 ,  G02F1/13

    CPC分类号： G02F1/1341 ,  G02F1/1339 ,  G02F2202/023

    摘要： A method of joining two panels during the manufacturing of a LCD display employing the ODF (One Drop Fill) assembly technique. Using this method, the liquid crystal is deposited on one of the substrate's interior to the glue seal. The glue seal is pre-deposited near the peripheral edge of the substrates. The two substrates are then brought in contact with one another. The glue seal must be cured rapidly in order to seal the entire periphery while avoiding contamination between the glue seal, in the liquid state and the liquid crystal. The present invention teaches the use of a non-epoxy glue sealant, which is cured using photoinitiators. Experimental research has discovered the use of photons that are derived from laser beams and the control thereof. This allows for a faster, lower temperature cure.

    摘要翻译： 在使用ODF（一滴填充）组装技术的LCD显示器的制造期间连接两个面板的方法。 使用这种方法，将液晶沉积在基板的一个内部到胶封上。 粘合密封件预先沉积在基底的周缘附近。 然后将两个基板彼此接触。 必须快速固化胶水密封，以便密封整个周边，同时避免在液体状态下的胶水密封与液晶之间的污染。 本发明教导了使用光引发剂固化的非环氧胶粘剂。 实验研究发现使用衍射自激光束的光子及其控制。 这允许更快，更低温度的固化。

    TWO MASK PROCESS FOR ELECTROPLATING METAL EMPLOYING A NEGATIVE ELECTROPHORETIC PHOTORESIST
    6.
    发明申请
    TWO MASK PROCESS FOR ELECTROPLATING METAL EMPLOYING A NEGATIVE ELECTROPHORETIC PHOTORESIST 有权
    用于电镀金属的两个掩模工艺使用负极电泳光电

    公开(公告)号：US20140242524A1

    公开(公告)日：2014-08-28

    申请号：US13584326

    申请日：2012-08-13

    申请人： Gareth G. Hougham ,  Gerard McVicker ,  Anna Pratt

    发明人： Gareth G. Hougham ,  Gerard McVicker ,  Anna Pratt

    IPC分类号： G03F7/20 ,  G03F7/40

    CPC分类号： C25D17/12 ,  C25D1/003 ,  C25D5/022 ,  C25D13/00 ,  G03F7/0037 ,  G03F7/2022 ,  G03F7/203 ,  Y10T428/24562

    摘要： A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.

    摘要翻译： 将负电泳光致抗蚀剂施加在基板上的多个突出的一次性模板部分上。 筒状结构放置在横向包围多个突出的一次性模板部分的负电泳光致抗蚀剂的平面部分上。 负电泳光致抗蚀剂利用筒仓结构和第一平版印刷掩模进行光刻曝光，第一光刻掩模包括具有分离的不透明图案的透明基板。 在除去筒仓结构之后，使用第二光刻掩模将负电泳光致抗蚀剂光刻曝光，其包括覆盖负电泳光致抗蚀剂的平面部分的透明区域的图案，以减少随后通过电镀形成的金属结构基底的区域 。 负电泳光致抗蚀剂被开发以在其中形成空腔，并且通过在腔内电镀形成金属结构。 负电泳光致抗蚀剂和多个突出的一次性模板部分可以随后被去除。

    Through board stacking of multiple LGA-connected components
    7.
    发明授权
    Through board stacking of multiple LGA-connected components 有权
    通过板堆叠多个LGA连接的组件

    公开(公告)号：US08278745B2

    公开(公告)日：2012-10-02

    申请号：US12543104

    申请日：2009-08-18

    申请人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    IPC分类号： H01L23/52

    CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

    摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

    摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。