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    Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device
    1.
    发明授权
    Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device 有权
    将多个苯并环丁烯层与基材和相关装置整合的方法

    公开(公告)号：US08592983B2

    公开(公告)日：2013-11-26

    申请号：US13310074

    申请日：2011-12-02

    申请人： Hasan Sharifi ,  Alexandros D. Margomenos ,  Ara K. Kurdoghlian ,  Miroslav Micovic ,  Keisuke Shinohara ,  Colleen M. Butler

    发明人： Hasan Sharifi ,  Alexandros D. Margomenos ,  Ara K. Kurdoghlian ,  Miroslav Micovic ,  Keisuke Shinohara ,  Colleen M. Butler

    IPC分类号： H01L23/532 ,  H01L51/40

    CPC分类号： H01L23/53252 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of integrating benzocyclobutene (BCB) layers with a substrate is provided along with a corresponding device. A method includes forming a first BCB layer on the substrate and depositing a first metal layer on the first BCB layer and within vias defined by the first metal layer. The method also forms a second BCB layer on the first metal layer and deposits a second metal layer on the second BCB layer and within vias defined by the second metal layer. The second metal layer extends through the vias defined by the second metal layer to establish an operable connection with the first metal layer. The first and second metal layers are independent of an electrical connection to any circuit element carried by the substrate, but the first and second metal layers secure the second BCB layer to the underlying structure and reduce the likelihood of delamination.

    摘要翻译： 将苯并环丁烯（BCB）层与基板一体化的方法与相应的装置一起提供。 一种方法包括在衬底上形成第一BCB层，并在第一BCB层上以及在由第一金属层限定的通孔内沉积第一金属层。 该方法还在第一金属层上形成第二BCB层，并在第二BCB层上以及由第二金属层限定的通孔内沉积第二金属层。 第二金属层延伸穿过由第二金属层限定的通孔，以建立与第一金属层的可操作连接。 第一和第二金属层独立于与由衬底承载的任何电路元件的电连接，但第一和第二金属层将第二BCB层固定到下面的结构并降低分层的可能性。

    METHOD OF INTEGRATING A PLURALITY OF BENZOCYCLOBUTENE LAYERS WITH A SUBSTRATE AND AN ASSOCIATED DEVICE
    3.
    发明申请
    METHOD OF INTEGRATING A PLURALITY OF BENZOCYCLOBUTENE LAYERS WITH A SUBSTRATE AND AN ASSOCIATED DEVICE 有权
    用底物和相关器件集成多种含量的苯甲酸酯层的方法

    公开(公告)号：US20130140579A1

    公开(公告)日：2013-06-06

    申请号：US13310074

    申请日：2011-12-02

    申请人： Hasan Sharifi ,  Alexandros D. Margomenos ,  Ara K. Kurdoghlian ,  Miroslav Micovic ,  Keisuke Shinohara ,  Colleen M. Butler

    发明人： Hasan Sharifi ,  Alexandros D. Margomenos ,  Ara K. Kurdoghlian ,  Miroslav Micovic ,  Keisuke Shinohara ,  Colleen M. Butler

    IPC分类号： H01L29/20 ,  H01L23/52 ,  H01L21/768

    CPC分类号： H01L23/53252 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of integrating benzocyclobutene (BCB) layers with a substrate is provided along with a corresponding device. A method includes forming a first BCB layer on the substrate and depositing a first metal layer on the first BCB layer and within vias defined by the first metal layer. The method also forms a second BCB layer on the first metal layer and deposits a second metal layer on the second BCB layer and within vias defined by the second metal layer. The second metal layer extends through the vias defined by the second metal layer to establish an operable connection with the first metal layer. The first and second metal layers are independent of an electrical connection to any circuit element carried by the substrate, but the first and second metal layers secure the second BCB layer to the underlying structure and reduce the likelihood of delamination.

    摘要翻译： 将苯并环丁烯（BCB）层与基板一体化的方法与相应的装置一起提供。 一种方法包括在衬底上形成第一BCB层，并在第一BCB层上以及在由第一金属层限定的通孔内沉积第一金属层。 该方法还在第一金属层上形成第二BCB层，并在第二BCB层上以及由第二金属层限定的通孔内沉积第二金属层。 第二金属层延伸穿过由第二金属层限定的通孔，以建立与第一金属层的可操作连接。 第一和第二金属层独立于与由衬底承载的任何电路元件的电连接，但第一和第二金属层将第二BCB层固定到下面的结构并降低分层的可能性。