公开(公告)号：US5242713A

公开(公告)日：1993-09-07

申请号：US290486

申请日：1988-12-23

申请人： Alfred Viehbeck ,  Stephen L. Buchwalter ,  William A. Donson ,  John J. Glenning ,  Martin J. Goldberg ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew ,  Walter P. Pawlowski ,  Mark J. Schadt ,  Michael R. Scheuermann ,  Stephen L. Tisdale

发明人： Alfred Viehbeck ,  Stephen L. Buchwalter ,  William A. Donson ,  John J. Glenning ,  Martin J. Goldberg ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew ,  Walter P. Pawlowski ,  Mark J. Schadt ,  Michael R. Scheuermann ,  Stephen L. Tisdale

IPC分类号： C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

CPC分类号： C23C18/1608 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  H05K3/381 ,  Y10S525/903

摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

公开(公告)号：US5462628A

公开(公告)日：1995-10-31

申请号：US232417

申请日：1994-04-25

申请人： Alfred Viehbeck ,  Martin Goldberg ,  Stephen L. Tisdale ,  Stephen L. Buchwalter ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew

发明人： Alfred Viehbeck ,  Martin Goldberg ,  Stephen L. Tisdale ,  Stephen L. Buchwalter ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew

IPC分类号： C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  B32B31/00

CPC分类号： C23C18/1608 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  H05K3/381 ,  Y10S525/903

摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

摘要翻译： 某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。 聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。 该改变可用于改性或蚀刻聚合物材料。 可以通过在受控的深度将金属种子并入材料中来修饰材料。 种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。 随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。 聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。 增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

公开(公告)号：US4832255A

公开(公告)日：1989-05-23

申请号：US223818

申请日：1988-07-25

申请人： Harry R. Bickford ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Michael J. Palmer

发明人： Harry R. Bickford ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Michael J. Palmer

IPC分类号： B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

CPC分类号： H01L24/27 ,  B23K3/06 ,  H05K13/0465 ,  H05K3/3473 ,  H05K3/3478 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1579 ,  H05K2203/0108 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0528 ,  H05K2203/0726 ,  H05K2203/1105 ,  H05K3/046 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49213

摘要： This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：US5546655A

公开(公告)日：1996-08-20

申请号：US329066

申请日：1994-10-25

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/02

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

摘要翻译： 适用于芯片载体应用的柔性或TAB产品，其中在功率和热循环期间由铜枝晶生长和引线弯曲引起的柔性可靠性问题通过将特殊涂层施加到柔性带的引导区域来减少。

公开(公告)号：US5074969A

公开(公告)日：1991-12-24

申请号：US666007

申请日：1991-03-07

申请人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

发明人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393

摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

摘要翻译： 本发明包括使用含铜/镍的合金组合物或者对铜载流导线施加保护性镍合金涂层，以防止带状自动键合（TAB）封装引线之间的电解迁移。

公开(公告)号：US5360946A

公开(公告)日：1994-11-01

申请号：US761182

申请日：1991-09-17

申请人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

发明人： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC分类号： H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

摘要翻译： 本发明涉及适用于硅载体或其它类型的芯片载体应用的改进的柔性（或TAB）产品，其中例如通过Cu热循环引起的柔性可靠性问题被显着地减少或消除。 更具体地，本发明体现了用于这种产品中的许多涂层以及制造和使用它们的各种方法。

公开(公告)号：US5038195A

公开(公告)日：1991-08-06

申请号：US477705

申请日：1990-02-09

申请人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

发明人： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393 ,  Y10T428/1291

摘要： The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

公开(公告)号：US4730666A

公开(公告)日：1988-03-15

申请号：US858318

申请日：1986-04-30

申请人： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

发明人： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/467 ,  F28F7/00 ,  H01R13/00

CPC分类号： H01L23/467 ,  F28F19/06 ,  F28F21/085 ,  F28F3/048 ,  H01L23/4338 ,  F28F2255/02 ,  F28F2255/14 ,  H01L2924/0002

摘要： A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils.

摘要翻译： 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂将密封件固定到芯片上。 片材气密地密封芯片以免受冷却剂的污染。 热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 翅片可以通过与用于制造印刷电路的那些类似的工艺被有效地制造。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。

公开(公告)号：US5373627A

公开(公告)日：1994-12-20

申请号：US156446

申请日：1993-11-23

申请人： Kurt R. Grebe

发明人： Kurt R. Grebe

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H01L23/538 ,  H05K3/30

CPC分类号： H01L23/3672 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L21/568 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A multi-chip module having very high density interconnect structures and a technique for making it, where all of the chips have their active device surfaces in a common plane. The chips are placed face down on an adjacent adhesive layer located on a substrate, which is preferably a flexible material. A conformal material is deposited over the backsides of the chips and in the spaces between the chips. A ground plane or metallic shield can then be formed over the conformal layer, if desired. The structure is then turned over and the glass layer on which the substrate is located is removed. Access vias are made through the substrate to the chip I/O's, and metallization provided to the chips. Interconnect metallization is then provided to complete the multi-chip module. In one embodiment, the substrate on which the chips are first supported is the first level of insulation above the active device surfaces of the chips and also ensures that the active device surfaces are in a common plane.

摘要翻译： 具有非常高密度互连结构的多芯片模块和用于制造它的技术，其中所有芯片在其共同平面中具有其有源器件表面。 将芯片面朝下放置在位于衬底上的相邻粘合剂层上，该衬底优选为柔性材料。 保形材料沉积在芯片的背面和芯片之间的空间中。 如果需要，可以在保形层上形成接地平面或金属屏蔽。 然后将结构翻转，除去其上放置基板的玻璃层。 通孔通过衬底到芯片I / O，以及提供给芯片的金属化。 然后提供互连金属化以完成多芯片模块。 在一个实施例中，其上首先被支撑芯片的基板是在芯片的有源器件表面上方的第一级绝缘层，并且还确保有源器件表面处于公共平面。

公开(公告)号：US4725850A

公开(公告)日：1988-02-16

申请号：US027710

申请日：1987-03-19

申请人： Derek B. Dove ,  Kurt R. Grebe ,  George E. Keefe ,  Edward J. Yarmchuk

发明人： Derek B. Dove ,  Kurt R. Grebe ,  George E. Keefe ,  Edward J. Yarmchuk

IPC分类号： B41J2/43 ,  G01D15/00

CPC分类号： B41J2/43

摘要： An electromagnetic printhead is fabricated with a common flux returning backplate and an array of writing elements extending from the common backplate. The writing elements consist of large pedestals and small pedestals. The placement of the large pedestals provides addressability resolution; the small pedestals provide imaging resolution. The large pedestals accept electromagnetic flux from addressing conductors and transfer the flux through the respectively related small pedestals to an image receptor. There are several fabrication techniques which are eased by the separation of addressability resolution and imaging resolution, primarily because the wide separation of the large pedestals required for the addressing conductors mandate relatively massive removal of material and thus suggest relatively low precision machining techniques. The imaging resolution requires both high spacial precision and accurate dimension control, normally achievable by relatively high precision techniques. With the functions addressability resolution and imaging resolution functions separately provided, the best and most economical techniques may be used for each. The magnetic flux path for recording may be either vertical or in-plane, and the flux return may be common via the relatively low reluctance path provided by very large area paths through the mass of nonferromagnetic material to the common flux returning backplate. This simplified printhead lends itself to the use of standard flexible circuit fabrication techniques for the addressing conductors.

摘要翻译： 制造电磁打印头具有常见的磁通返回背板和从公共背板延伸的书写元件阵列。 书写元素由大型基座和小座构成。 大基座的放置提供了可寻址性分辨率; 小基座提供成像分辨率。 大基座接受来自寻址导体的电磁通量，并将磁通通过相应的小基座转移到图像接收器。 存在通过分离寻址能力分辨率和成像分辨率而减轻的几种制造技术，主要是因为寻址导体所需的大基座的宽分离需要相对大量的材料去除并因此提出相对低精度的加工技术。 成像分辨率需要高空间精度和精确的尺寸控制，通常可以通过相对较高的精度技术实现。 通过独立提供的功能寻址能力分辨率和成像分辨率功能，可以使用最佳和最经济的技术。 用于记录的磁通路径可以是垂直的或平面的，并且磁通返回可以通过通过穿过非铁磁材料的非常大的面积路径提供给相同的磁通返回背板而提供的相对低的磁阻路径是共同的。 这种简化的打印头本身适用于寻址导体的标准柔性电路制造技术。