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公开(公告)号：US5581576A
公开(公告)日：1996-12-03
申请号：US371621
申请日：1995-01-12
摘要： A radio information broadcasting and receiving system consisting of three major parts: an FM transmitter station with subcarrier multiplexing capability, an FM receiver apparatus with subcarrier demodulation capability, and a computer connected in combination with the receiver apparatus. The FM transmitter station includes sources of main programming signals first digital data signals and second digital data signals. The first and second digital data signals are modulated by subcarrier 1 and subcarrier 2 frequencies respectively and are mixed with the main program signal and then transmitted. The transmitted signals are received by a receiver apparatus including an FM receiver circuit and an FM demodulator circuit for receiving the broadcast signal and demodulating it. The demodulated main program audio frequency signal is applied through a filter/deemphasis circuit and amplifier to speaker to provide an audio output. The first subcarrier frequency signal is demodulated by a first subcarrier frequency generator to provide a digital signal of the text portion of the transmitted signal which is then applied to a first input port of this digital computer. Likewise, the second subcarrier frequency is demodulated and the resultant index digital data signal is applied to a second input port of the computer.
摘要翻译： 一种无线电信息广播和接收系统，包括三个主要部分：具有子载波复用能力的FM发射机站，具有子载波解调能力的FM接收机设备，以及与接收机设备组合连接的计算机。 FM发射台包括主编程信号源，第一数字数据信号和第二数字数据信号。 第一和第二数字数据信号分别由副载波1和子载波2频率调制，并与主节目信号混合后发送。 所发送的信号由包括FM接收机电路和用于接收广播信号并对其进行解调的FM解调器电路的接收机装置接收。 解调的主程序音频信号通过滤波器/去加重电路和放大器施加到扬声器以提供音频输出。 第一副载波频率信号由第一副载波频率发生器解调，以提供发送信号的文本部分的数字信号，该数字信号然后被施加到该数字计算机的第一输入端口。 类似地，解调第二副载波频率，并将所得到的索引数字数据信号施加到计算机的第二输入端口。
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公开(公告)号：US5268815A
公开(公告)日：1993-12-07
申请号：US922257
申请日：1992-07-30
申请人： Thomas M. Cipolla , Paul W. Coteus , Brian C. Derdall , Christina M. Knoedler , Alphonso P. Lanzetta , John J. Liutkus , Linda C. Matthew , Lawrence S. Mok , Irene A. Sterian
发明人： Thomas M. Cipolla , Paul W. Coteus , Brian C. Derdall , Christina M. Knoedler , Alphonso P. Lanzetta , John J. Liutkus , Linda C. Matthew , Lawrence S. Mok , Irene A. Sterian
CPC分类号： H05K7/023 , H01L25/105 , H05K3/301 , H01L2225/1023 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , Y10T29/53265
摘要： A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks. A pair of planar packages are mechanically connected in a back-to-back arrangement so that the apertures therebetween are aligned. The associated circuit cards are also back-to-back oriented so as to enable their joint interconnection into the female connector.
摘要翻译： 高密度电路封装包括一对平面封装，平面封装呈现前后表面并且背对背设置在高密度电路封装中。 每个平面封装包括具有安装在其上的多个电路芯片的柔性电路载体。 前后平面金属散热器夹着电路载体，至少一个散热片接触安装在夹层电路载体上的芯片表面。 每个散热器设置有形成在其平面表面中并与每个电路芯片相邻的气流孔。 电路卡与互连区域中的电路载体互连，并且可插入到母连接器中。 平面金属散热器和电路载体被机械地封装，以便提供一个平面布置，其对准前后散热片中的孔。 一对平面封装以背对背布置机械连接，使得它们之间的孔对准。 相关联的电路卡也是背靠背定向的，以便使它们的连接互连到母连接器中。
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公开(公告)号：US5559670A
公开(公告)日：1996-09-24
申请号：US324567
申请日：1994-10-18
CPC分类号： G06F1/1679 , G06F1/162 , G06F1/1683
摘要： The invention is a convertible display computer structure in which the display is centrally pivoted in a frame that in turn is hinged on one side on the keyboard so that the display can be positioned to face toward the user when the frame is positioned to be essentially vertical with respect to the keyboard and when it is desired to provide graphic information entry, the display can be turned over so as to serve as a writing surface when the hinged frame is positioned over the keyboard. The conversion from keyboard to graphic stylus input is accomplished by rotating the display on the pivot mountings and then closing the frame over the keyboard with the display surface up and in the proper orientation.
摘要翻译： 本发明是一种可转换显示计算机结构，其中显示器在框架中心枢转，该框架又铰接在键盘的一侧上，使得当框架被定位成基本上垂直时，显示器可以定位成面向使用者 相对于键盘，当希望提供图形信息输入时，可以翻转显示器，以便当铰链框架位于键盘上方时用作书写表面。 从键盘到图形触控笔输入的转换是通过旋转显示器在旋转安装上旋转，然后通过键盘上的显示屏面向上并以正确方向闭合框架来实现的。
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公开(公告)号：US20090300914A1
公开(公告)日：2009-12-10
申请号：US12533766
申请日：2009-07-31
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R43/16
CPC分类号： H01R13/2414 , G01R1/07378 , H05K3/326 , H05K3/4007 , H05K3/4038 , H05K7/1061
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，一种形成电连接装置的方法包括以下步骤：将弹性体材料沉积在电绝缘载体上; 以及对弹性体材料进行金属化，以便形成连续穿过载体的平面并且沿弹性体材料的表面延伸的导电层。
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公开(公告)号：US20090053908A1
公开(公告)日：2009-02-26
申请号：US12127418
申请日：2008-05-27
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R12/00
CPC分类号： H01R9/09 , G01R1/07378 , H01R13/2414 , H05K3/326 , H05K3/4007 , H05K3/4038 , H05K7/1061 , Y10S439/931
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号：US20080054430A1
公开(公告)日：2008-03-06
申请号：US11511815
申请日：2006-08-29
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。
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公开(公告)号：US20090315168A1
公开(公告)日：2009-12-24
申请号：US12543104
申请日：2009-08-18
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。
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公开(公告)号：US07452212B2
公开(公告)日：2008-11-18
申请号：US11718279
申请日：2005-09-30
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R9/00
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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9.发明授权Planar antenna in the ISM band with an omnidirectional pattern in the horizontal plane 失效在水平面上具有全向图案的ISM频带中的平面天线
公开(公告)号：US5583510A
公开(公告)日：1996-12-10
申请号：US340571
申请日：1994-11-16
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： A multilayer antenna includes a first layer which is a ground plane and which has a plurality of first clearance holes. A first dielectric layer is positioned over the first layer and a second layer is positioned over the first dielectric layer and has a plurality of quarter wave transformers. A second dielectric layer is positioned over the second layer and a third layer ground plane is positioned over the second dielectric layer and has a plurality of second clearance holes for a feed structure. A third dielectric layer is positioned over the third layer and a fourth layer is positioned over the third dielectric layer and has a cross shape. The first and third layers are coupled together via plated-through holes.
摘要翻译： 多层天线包括作为接地平面的第一层，并且具有多个第一间隙孔。 第一介电层位于第一层之上，第二层位于第一介电层上方，并具有多个四分之一波长的变压器。 第二介电层位于第二层上方，第三层接地平面位于第二介电层上方，并具有用于进料结构的多个第二间隙孔。 第三电介质层位于第三层上方，第四层位于第三电介质层上方并具有十字形。 第一层和第三层通过镀通孔连接在一起。
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10.发明授权
公开(公告)号：US5558523A
公开(公告)日：1996-09-24
申请号：US275897
申请日：1994-07-15
摘要： A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under permanent compressive force in service. In high density and high performance electronic apparatus interwiring, array quantities of the spring member of contact are fabricated in unitary assembly elements for connection assemblies between both rigid and flexible type wiring.
摘要翻译： 用于电子设备的垫式接触垫及其技术，其中弹簧构件通过其形状和材料在接触时的运动中相互擦拭，并将它们保持在永久的压缩力下 服务。 在高密度和高性能的电子设备互连中，接触的弹簧构件的阵列数量被制造成用于刚性和柔性型布线之间的连接组件的单元组装元件。
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