Process to open connection vias on a planarized surface
    1.
    发明申请
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号:US20070245557A1

    公开(公告)日:2007-10-25

    申请号:US11411555

    申请日:2006-04-25

    IPC分类号: H01K3/10

    摘要: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer. The mask can then be lifted off and an electrically conductive material can be deposited into the via. Forming the via by a subtractive method rather than by a liftoff process allows the alumina to be deposited in a manner that does not result in voids. The use of reactive ion milling allows the via to be well defined and formed with substantially vertical side walls rather than in a conical or outward spreading fashion as would be formed by other material removal processes such as wet etching.

    摘要翻译: 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 在其中形成有形成有接触垫的区域形成诸如氧化铝填充层,磁性成形层等的基板。 诸如磁极和/或磁性后屏蔽的结构形成在衬底之上,并被厚层氧化铝覆盖。 可以通过在氧化铝层中不形成空隙或接缝的高沉积速率工艺来施加氧化铝。 然后可以通过化学机械抛光工艺(CMP)将氧化铝层平坦化,然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层,从而在氧化铝层中形成通孔。 然后可以将掩模剥离,并且可以将导电材料沉积到通孔中。 通过减法法而不是通过剥离工艺形成通孔允许以不会导致空隙的方式沉积氧化铝。 使用反应离子研磨允许通孔被良好地限定并且形成有基本垂直的侧壁,而不是以其它材料去除工艺(例如湿蚀刻)形成的锥形或向外扩展方式。

    Process to open connection vias on a planarized surface
    3.
    发明授权
    Process to open connection vias on a planarized surface 有权
    在平坦化表面上打开连接通孔的过程

    公开(公告)号:US07523550B2

    公开(公告)日:2009-04-28

    申请号:US11411555

    申请日:2006-04-25

    IPC分类号: H01K3/10

    摘要: A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over a substrate and is covered with a thick layer of alumina. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer.

    摘要翻译: 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 诸如磁极和/或磁性后屏蔽的结构形成在衬底上并被厚层氧化铝覆盖。 然后可以通过化学机械抛光工艺(CMP)将氧化铝层平坦化,然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层,从而在氧化铝层中形成通孔。

    Perpendicular magnetic write head having a magnetic write pole with a concave trailing edge
    5.
    发明申请
    Perpendicular magnetic write head having a magnetic write pole with a concave trailing edge 有权
    具有磁写入磁极的垂直磁性写头具有凹形后缘

    公开(公告)号:US20070258167A1

    公开(公告)日:2007-11-08

    申请号:US11411556

    申请日:2006-04-25

    IPC分类号: G11B5/147

    摘要: A magnetic write head for perpendicular magnetic recording having a write pole with a concave trailing edge. The magnetic write pole can have a trapezoidal shape with first and second laterally opposed sides that are further apart at the trailing edge than at the leading edge. The write head may or may not include a magnetic trailing shield, and if a trailing shield is included it is separated from the trailing edge by a non-magnetic write gap layer. The concave trailing edge improves magnetic performance such as by improving the transition curvature. A method for constructing the write head includes forming a magnetic write pole by forming a mask structure over a deposited write pole material, the mask structure having an alumina hard mask and an image transfer layer such as DURAMIDE®. An alumina fill layer is then deposited and a chemical mechanical polish is performed to open up the image transfer layer. A reactive on etch is performed to remove the image transfer layer and a reactive ion mill or reactive ion etch is performed to remove the alumina hard mask and form a concave surface on the write pole.

    摘要翻译: 用于垂直磁记录的磁写头,具有带有凹后缘的写极。 磁性写入极可以具有梯形形状,其中第一和第二横向相对侧在后缘处比在前缘处更远地分开。 写头可以包括或可以不包括磁性后屏蔽,并且如果包括后屏蔽,则其通过非磁性写间隙层与后缘分离。 凹形后边缘提高磁性能,例如通过改善转变曲率。 构成写入头的方法包括通过在沉积的写入极材料上形成掩模结构来形成磁性写入极,掩模结构具有氧化铝硬掩模和诸如DURAMIDE的图像转移层。 然后沉积氧化铝填充层,并执行化学机械抛光以打开图像转印层。 执行反应性蚀刻以去除图像转印层,并且执行反应性离子磨或反应离子蚀刻以除去氧化铝硬掩模并在写入极上形成凹面。

    Perpendicular magnetic write head having a magnetic write pole with a concave trailing edge
    6.
    发明授权
    Perpendicular magnetic write head having a magnetic write pole with a concave trailing edge 有权
    具有磁写入磁极的垂直磁性写头具有凹形后缘

    公开(公告)号:US07576951B2

    公开(公告)日:2009-08-18

    申请号:US11411556

    申请日:2006-04-25

    IPC分类号: G11B5/127

    摘要: A magnetic write head for perpendicular magnetic recording having a write pole with a concave trailing edge. The magnetic write pole can have a trapezoidal shape with first and second laterally opposed sides that are further apart at the trailing edge than at the leading edge. The write head may or may not include a magnetic trailing shield, and if a trailing shield is included it is separated from the trailing edge by a non-magnetic write gap layer. The concave trailing edge improves magnetic performance such as by improving the transition curvature. A method for constructing the write head includes forming a magnetic write pole by forming a mask structure over a deposited write pole material, the mask structure having an alumina hard mask and an image transfer layer such as DURAMIDE®. An alumina fill layer is then deposited and a chemical mechanical polish is performed to open up the image transfer layer. A reactive on etch is performed to remove the image transfer layer and a reactive ion mill or reactive ion etch is performed to remove the alumina hard mask and form a concave surface on the write pole.

    摘要翻译: 用于垂直磁记录的磁写头,具有带有凹后缘的写极。 磁性写入极可以具有梯形形状,其中第一和第二横向相对侧在后缘处比在前缘处更远地分开。 写头可以包括或可以不包括磁性后屏蔽,并且如果包括后屏蔽,则其通过非磁性写间隙层与后缘分离。 凹形后边缘提高磁性能,例如通过改善转变曲率。 构成写入头的方法包括通过在沉积的写入极材料上形成掩模结构来形成磁性写入极,掩模结构具有氧化铝硬掩模和诸如DURAMIDE的图像转移层。 然后沉积氧化铝填充层,并执行化学机械抛光以打开图像转印层。 执行反应性蚀刻以去除图像转印层,并且执行反应性离子磨或反应离子蚀刻以除去氧化铝硬掩模并在写入极上形成凹面。

    Method for making a perpendicular magnetic recording write head
    9.
    发明授权
    Method for making a perpendicular magnetic recording write head 失效
    制作垂直磁记录头的方法

    公开(公告)号:US07509729B2

    公开(公告)日:2009-03-31

    申请号:US11380189

    申请日:2006-04-25

    IPC分类号: G11B5/127 H04R31/00

    摘要: A method for making a write pole in a perpendicular magnetic recording write head uses a metal mask to pattern the primary resist and only ion milling during the subsequent patterning steps. A layer of primary resist is deposited over the magnetic write pole material and a metal mask layer is deposited on the primary resist layer. An imaging resist layer is formed on the metal mask layer and lithographically patterned generally in the desired shape of the write pole. Ion milling without a reactive gas is then performed over the imaging resist pattern to pattern the underlying metal mask layer, which is then used as the mask to define the shape of the primary resist pattern. Ion milling with oxygen is then performed over the metal mask pattern to pattern the underlying primary resist. Ion milling without a reactive gas is then performed over the primary resist pattern to form the underlying write pole.

    摘要翻译: 用于在垂直磁记录写头中制作写极的方法使用金属掩模对主抗蚀剂进行图案化,并且在随后的图案化步骤期间仅使用离子铣削。 一层主抗蚀剂沉积在磁写磁极材料上,并且金属掩模层沉积在主抗蚀剂层上。 在金属掩模层上形成成像抗蚀剂层,并且通常以写入极的所需形状进行光刻图案化。 然后在成像抗蚀剂图案上进行无反应气体的离子研磨以对下面的金属掩模层进行图案化,然后将其用作掩模以限定主抗蚀剂图案的形状。 然后在金属掩模图案上进行用氧离子研磨以对下面的主抗蚀剂进行图案化。 然后在主抗蚀剂图案上执行没有反应气体的离子研磨以形成下面的写极。