MR read head with first and second gap layers
    2.
    发明授权
    MR read head with first and second gap layers 失效
    MR读头具有第一和第二间隙层

    公开(公告)号:US07532441B2

    公开(公告)日:2009-05-12

    申请号:US11559353

    申请日:2006-11-13

    申请人: Douglas Werner

    发明人: Douglas Werner

    IPC分类号: G11B5/127

    摘要: A magetoresistive (MR) read head according to one embodiment includes a shield layer with a recessed portion and a protruding portion defined by the recessed portion; a first gap layer located on top of the recessed portion of the shield layer, the first gap layer including, an upper surface substantially level with an upper surface of the protruding portion of the shield layer a second gap layer located on top of the first gap layer and the protruding portion of the shield layer, an MR sensor formed above the protruding portion of the shield layer and the second gap layer. A combined thickness of the first gap layer and second gap layer is thinner adjacent to the MR sensor and the protruding portion of the shield layer than the recessed portion of the shield layer.

    摘要翻译: 根据一个实施例的磁阻(MR)读取头包括具有凹陷部分和由凹部限定的突出部分的屏蔽层; 位于所述屏蔽层的凹部的顶部的第一间隙层,所述第一间隙层包括与所述屏蔽层的突出部的上表面大致平齐的上表面; 位于所述第一间隙层的顶部和所述屏蔽层的突出部分上的第二间隙层; MR传感器形成在屏蔽层和第二间隙层的突出部分之上。 第一间隙层和第二间隙层的组合厚度相对于MR传感器和屏蔽层的突出部分比屏蔽层的凹部更薄。

    IMAGE TRANSFER PROCESS FOR THIN FILM COMPONENT DEFINITION
    4.
    发明申请
    IMAGE TRANSFER PROCESS FOR THIN FILM COMPONENT DEFINITION 有权
    薄膜组件定义的图像传输过程

    公开(公告)号:US20080026325A1

    公开(公告)日:2008-01-31

    申请号:US11870364

    申请日:2007-10-10

    IPC分类号: G03C5/00

    CPC分类号: G11B5/3163

    摘要: A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of material to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the material layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the material layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.

    摘要翻译: 根据一个实施例的制造薄膜部件的方法包括:形成具有薄膜层,剥离层和光刻胶图案层的晶片; 将光致抗蚀剂层的图案转印到剥离层和薄膜层上; 向晶片添加一层材料; 将晶片加热到预定温度一段足以使光致抗蚀剂变形到使光致抗蚀剂在材料层中产生裂纹的程度; 施加溶剂以溶解至少一部分释放层,溶剂穿透材料层中的裂纹以到达剥离层; 以及去除脱模层和剥离层上方的层的任何部分。

    High-selectivity electromagnetic bandgap device and antenna system
    7.
    发明申请
    High-selectivity electromagnetic bandgap device and antenna system 有权
    高选择性电磁带隙装置和天线系统

    公开(公告)号:US20060017651A1

    公开(公告)日:2006-01-26

    申请号:US10909213

    申请日:2004-07-30

    IPC分类号: H01Q15/02 H01Q15/24

    摘要: An antenna system includes an antenna element and an electromagnetic bandgap element proximate the antenna element wherein the electromagnetic bandgap element is optimized for narrow bandwidth operation thereby providing radiofrequency selectivity to the antenna system. Preferably the electromagnetic bandgap element is tunable such as through use of a bias-alterable dielectric substrate or other tuning mechanism. The design approach also provides a means of creating an ultra-thin low-profile narrowband tunable channel selective antenna system suitable for low frequency applications.

    摘要翻译: 天线系统包括靠近天线元件的天线元件和电磁带隙元件,其中为窄带宽操作优化电磁带隙元件,从而为天线系统提供射频选择性。 优选地,电磁带隙元件是可调谐的,例如通过使用可偏置可变电介质基板或其它调谐机构。 该设计方法还提供了一种创建适用于低频应用的超薄低调窄带可调谐通道选择天线系统的方法。