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    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
    1.
    发明申请
    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR 有权

    公开(公告)号：US20230113153A1

    公开(公告)日：2023-04-13

    申请号：US18079956

    申请日：2022-12-13

    申请人： Amphenol Corporation

    发明人： Mark W. Gailus ,  Marc B. Cartier, JR. ,  Vysakh Sivarajan ,  David Levine

    IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01R43/20

    摘要： A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE
    3.
    发明申请
    ELECTRICAL CONNECTOR WITH HIGH SPEED MOUNTING INTERFACE 有权

    公开(公告)号：US20210257788A1

    公开(公告)日：2021-08-19

    申请号：US17159855

    申请日：2021-01-27

    申请人： Amphenol Corporation

    发明人： Marc B. Cartier, JR. ,  John Robert Dunham ,  Mark W. Gailus ,  David Levine ,  Allan Astbury ,  Vysakh Sivarajan ,  Daniel B. Provencher ,  Eric Leo

    IPC分类号： H01R13/6587 ,  H01R13/6471 ,  H01R12/71 ,  H01R12/51

    摘要： An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.

    Insulative support for very high speed electrical interconnection
    5.
    发明授权
    Insulative support for very high speed electrical interconnection 有权

    公开(公告)号：US10581203B2

    公开(公告)日：2020-03-03

    申请号：US16358143

    申请日：2019-03-19

    申请人： Amphenol Corporation

    发明人： Marc B. Cartier, Jr. ,  John Robert Dunham ,  Vysakh Sivarajan ,  Mark W. Gailus ,  David Levine ,  Michael Joseph Snyder

    IPC分类号： H01R13/648 ,  H01R13/6582 ,  H05K1/14 ,  H01R12/72 ,  H01R13/6587

    摘要： An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.

    HIGH DENSITY, HIGH SPEED ELECTRICAL CONNECTOR
    10.
    发明公开
    HIGH DENSITY, HIGH SPEED ELECTRICAL CONNECTOR 审中-公开

    公开(公告)号：US20230187861A1

    公开(公告)日：2023-06-15

    申请号：US18078720

    申请日：2022-12-09

    申请人： Amphenol Corporation

    发明人： Marc B. Cartier,, JR. ,  John Robert Dunham ,  Mark W. Gailus ,  John Pitten ,  David Levine ,  Vysakh Sivarajan

    IPC分类号： H01R12/71 ,  H01R13/6585 ,  H01R12/70 ,  H01R13/08

    CPC分类号： H01R12/716 ,  H01R13/6585 ,  H01R12/7047 ,  H01R13/08

    摘要： A dense, high-speed interconnection may be formed with a mating header and receptacle connector. The header connector may have groups of mating contact portions extending from the connector housing. Structural projections may extend from the housing adjacent some or all of the groups of mating contact portions. The groups of mating contact portions may be signal and ground mating contact portions associated with a signal pair. The groups may be arranged in an array and the structural projections may be arranged in an array intercalated with the array of the groups of mating contact portions. A receptacle connector may include an array of apertures configured to receive the structural projections. The structural projections may be shaped and positioned to reduce damage to the mating contact portions of the header connector, enable reliable manufacture, and to provide a high-density mating interface.