公开(公告)号：US08853799B2

公开(公告)日：2014-10-07

申请号：US14041745

申请日：2013-09-30

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： H01L27/15 ,  H01L25/16 ,  H01L49/02 ,  H01L23/48 ,  G01N27/26 ,  H01L21/82 ,  H01F17/00 ,  B81B7/00 ,  H02S10/10 ,  H01L31/053 ,  G01N27/414 ,  H01L27/14 ,  H01L31/0392 ,  H01L27/06 ,  H01L23/473 ,  H01L23/367 ,  H01L23/38

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US20160109399A1

公开(公告)日：2016-04-21

申请号：US14966920

申请日：2015-12-11

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： G01N27/22 ,  B81B7/00 ,  G01N27/414

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US09513246B2

公开(公告)日：2016-12-06

申请号：US14966920

申请日：2015-12-11

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： G01N27/22 ,  B81B7/00 ,  H01L25/16 ,  H01L23/48 ,  G01N27/26 ,  H01L27/14 ,  H01L27/15 ,  H01L49/02 ,  H01L31/0392 ,  H01F17/00 ,  G01N27/414 ,  H01L21/82 ,  H01L27/06 ,  H01L23/00 ,  H01F17/04 ,  H02S40/38 ,  H02S10/10 ,  H01L35/00 ,  H01L35/28 ,  H01L23/58 ,  H01L31/06 ,  H01L31/052 ,  H01L31/056 ,  H01L31/054 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473 ,  H01L35/30

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US09267915B2

公开(公告)日：2016-02-23

申请号：US14594913

申请日：2015-01-12

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： G01N27/414 ,  H01L31/06 ,  H01L25/16 ,  H01L23/48 ,  B81B7/00 ,  G01N27/26 ,  H01L27/14 ,  H01L27/15 ,  H01L49/02 ,  H01L31/0392 ,  H01F17/00 ,  H01L21/82 ,  H01L27/06 ,  H01L23/00 ,  H01F17/04 ,  H02S40/38 ,  H02S10/10 ,  H01L31/053 ,  H01L35/00 ,  H01L35/28 ,  H01L23/58 ,  G01N27/22 ,  H01L31/052 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US08957497B2

公开(公告)日：2015-02-17

申请号：US14189788

申请日：2014-02-25

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： H01L25/16 ,  G01N27/414 ,  H01L23/48 ,  B81B7/00 ,  G01N27/26 ,  H01L27/14 ,  H01L27/15 ,  H01L49/02 ,  H01L31/0392 ,  H02S10/10 ,  H01L31/053 ,  H01F17/00 ,  H01L21/82 ,  H01L27/06 ,  H01L23/00 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US08890285B2

公开(公告)日：2014-11-18

申请号：US14041804

申请日：2013-09-30

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： H01L27/14 ,  H01L49/02 ,  G01N27/414 ,  H01L25/16 ,  H01L23/48 ,  B81B7/00 ,  G01N27/26 ,  H01L27/15 ,  H01L31/0392 ,  H02S10/10 ,  H01L31/053 ,  H01F17/00 ,  H01L21/82 ,  H01L27/06 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US09041150B2

公开(公告)日：2015-05-26

申请号：US14041780

申请日：2013-09-30

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： H01L25/16 ,  H01L23/488 ,  G01N27/414 ,  H01L23/48 ,  B81B7/00 ,  G01N27/26 ,  H01L27/14 ,  H01L27/15 ,  H01L49/02 ,  H01L31/0392 ,  H01F17/00 ,  H01L21/82 ,  H01L27/06 ,  H01L23/00 ,  H01F17/04 ,  H02S40/38 ,  H02S10/10 ,  H01L31/053 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

摘要翻译： 本发明的实施例提供一种集成电路系统，其包括在半导体管芯的前侧制造的第一有源层和在半导体管芯的背面上的第二预制层，并且其中包含电气部件，其中电气部件 包括至少一个分立的无源部件。 集成电路系统还包括耦合第一有源层和第二预制层的至少一个电路径。

公开(公告)号：US20150121995A1

公开(公告)日：2015-05-07

申请号：US14594913

申请日：2015-01-12

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： B81B7/00 ,  G01N27/414 ,  G01N27/22

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

摘要翻译： 本发明的实施例提供一种集成电路系统，其包括在半导体管芯的前侧制造的第一有源层和在半导体管芯的背面上的第二预制层，并且其中包含电气部件，其中电气部件 包括至少一个分立的无源部件。 集成电路系统还包括耦合第一有源层和第二预制层的至少一个电路径。

公开(公告)号：US08890286B2

公开(公告)日：2014-11-18

申请号：US14189805

申请日：2014-02-25

申请人： Analog Devices, Inc.

发明人： Alan J. O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin G. Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： H01L27/06 ,  H01L49/02 ,  G01N27/414 ,  H01L25/16 ,  H01L23/48 ,  B81B7/00 ,  G01N27/26 ,  H01L27/14 ,  H01L27/15 ,  H01L31/0392 ,  H02S10/10 ,  H01L31/053 ,  H01F17/00 ,  H01L21/82 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

摘要翻译： 本发明的实施例提供一种集成电路系统，其包括在半导体管芯的前侧制造的第一有源层和在半导体管芯的背面上的第二预制层，并且其中包含电气部件，其中电气部件 包括至少一个分立的无源部件。 集成电路系统还包括耦合第一有源层和第二预制层的至少一个电路径。