-
公开(公告)号:US08786165B2
公开(公告)日:2014-07-22
申请号:US11521828
申请日:2006-09-15
申请人: Andreas Alfred Hase
发明人: Andreas Alfred Hase
CPC分类号: H01L24/11 , B81C1/00333 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/481 , H01L23/49805 , H01L23/49811 , H01L24/03 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/0401 , H01L2224/05554 , H01L2224/11614 , H01L2224/291 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/81801 , H01L2224/83801 , H01L2224/83851 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/1532 , H01L2924/161 , H01L2924/16152 , H01L2924/16195 , H01L2924/166 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: A leadless package and method for manufacturing silicon based leadless QFN/SON compatible packages are described. In addition the package allows for hermetic sealing of devices while maintaining electrical and optical access. Micro-vias with feed-through metallization through a silicon structure facilitates a surface mount technology-compatible silicon package with bottom SMT pads and top surface device integration. Sloped edges on the SMT side enable solder filleting for post solder inspection. Hermetic seal can be attained for example using anodic bonding of a glass lid or using metal soldering. Metal soldering enables the use of solder bumps to provide electrical connections for the package to the lid with integrated device functionality used for sealing. Hermetically sealed silicon packages eliminates the need for an extra packaging layer required in plastic packages and provides a standard interface for enclosing one or more discrete devices.
摘要翻译: 描述了一种用于制造基于硅的无引脚QFN / SON兼容封装的无引线封装和方法。 此外,该封装允许在保持电和光学访问的同时对器件进行气密密封。 通过硅结构进行直通金属化的微通孔有利于具有底部SMT焊盘和顶部表面器件集成的表面贴装技术兼容的硅封装。 SMT侧边缘的边缘可以进行焊锡切割以进行焊后检测。 例如使用玻璃盖的阳极接合或使用金属焊接可以实现密封。 金属焊接使得可以使用焊料凸块为封装提供电连接,并具有用于密封的集成器件功能。 密封硅封装不需要塑料封装所需的额外封装层,并提供用于封装一个或多个分立器件的标准接口。
-
2.
公开(公告)号:US20070292127A1
公开(公告)日:2007-12-20
申请号:US11471414
申请日:2006-06-19
申请人: Jochen Kuhmann , Andreas Alfred Hase , Ralf Hauffe , Arnd Kilian
发明人: Jochen Kuhmann , Andreas Alfred Hase , Ralf Hauffe , Arnd Kilian
IPC分类号: G03B17/00
CPC分类号: G03B17/28 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2924/00014 , H01L2924/00
摘要: A camera module includes an image sensor substrate including image sensor circuitry, and a lens barrel. A lid structure includes a transparent window and is disposed between, and attached to, the lens barrel and the image sensor substrate. The lid structure may be fabricated as part of a wafer-level process.
摘要翻译: 相机模块包括包括图像传感器电路的图像传感器基板和透镜镜筒。 盖结构包括透明窗口,并且设置在镜筒和图像传感器基板之间并附接到透镜镜筒和图像传感器基板上。 盖结构可以被制造为晶片级工艺的一部分。
-