PLASMA REACTOR WITH UNIFORM PROCESS RATE DISTRIBUTION BY IMPROVED RF GROUND RETURN PATH
    1.
    发明申请
    PLASMA REACTOR WITH UNIFORM PROCESS RATE DISTRIBUTION BY IMPROVED RF GROUND RETURN PATH 有权
    具有均匀加工速率分布的等离子体反应器通过改进的RF接地返回路径

    公开(公告)号:US20110005685A1

    公开(公告)日:2011-01-13

    申请号:US12501966

    申请日:2009-07-13

    IPC分类号: C23F1/08 C23C16/503

    摘要: In a plasma reactor having an RF plasma source power applicator at its ceiling, an integrally formed grid liner includes a radially extending plasma confinement ring and an axially extending side wall liner. The plasma confinement ring extends radially outwardly near the plane of a workpiece support surface from a pedestal side wall, and includes an annular array of radial slots, each of the slots having a narrow width corresponding to an ion collision mean free path length of a plasma in the chamber. The side wall liner covers an interior surface of the chamber side wall and extends axially from a height near a height of said workpiece support surface to the chamber ceiling.

    摘要翻译: 在其顶部具有RF等离子体源功率施加器的等离子体反应器中,整体形成的栅格衬套包括径向延伸的等离子体限制环和轴向延伸的侧壁衬套。 等离子体约束环从基座侧壁在工件支撑表面的平面附近径向向外延伸,并且包括径向槽的环形阵列,每个槽具有对应于等离子体的离子碰撞平均自由路径长度的窄宽度 在房间里 侧壁衬套覆盖室侧壁的内表面并且从靠近所述工件支撑表面的高度的高度轴向延伸到室顶部。

    Plasma reactor with uniform process rate distribution by improved RF ground return path
    2.
    发明授权
    Plasma reactor with uniform process rate distribution by improved RF ground return path 有权
    等离子体反应器具有均匀的加工速率分布,通过改进的射频接地回路

    公开(公告)号:US08360003B2

    公开(公告)日:2013-01-29

    申请号:US12501966

    申请日:2009-07-13

    IPC分类号: C23C16/00 H01L21/306

    摘要: In a plasma reactor having an RF plasma source power applicator at its ceiling, an integrally formed grid liner includes a radially extending plasma confinement ring and an axially extending side wall liner. The plasma confinement ring extends radially outwardly near the plane of a workpiece support surface from a pedestal side wall, and includes an annular array of radial slots, each of the slots having a narrow width corresponding to an ion collision mean free path length of a plasma in the chamber. The side wall liner covers an interior surface of the chamber side wall and extends axially from a height near a height of said workpiece support surface to the chamber ceiling.

    摘要翻译: 在其顶部具有RF等离子体源功率施加器的等离子体反应器中,整体形成的栅格衬套包括径向延伸的等离子体限制环和轴向延伸的侧壁衬套。 等离子体约束环从基座侧壁在工件支撑表面的平面附近径向向外延伸,并且包括径向槽的环形阵列,每个槽具有对应于等离子体的离子碰撞平均自由路径长度的窄宽度 在房间里 侧壁衬套覆盖室侧壁的内表面并且从靠近所述工件支撑表面的高度的高度轴向延伸到室顶部。

    REACTOR FOR WAFER BACKSIDE POLYMER REMOVAL HAVING AN ETCH PLASMA JET STREAM SOURCE
    8.
    发明申请
    REACTOR FOR WAFER BACKSIDE POLYMER REMOVAL HAVING AN ETCH PLASMA JET STREAM SOURCE 失效
    用于离子聚合物去离子的反应器具有等离子体喷射流动源

    公开(公告)号:US20080179009A1

    公开(公告)日:2008-07-31

    申请号:US11685775

    申请日:2007-03-14

    IPC分类号: H01L21/306

    摘要: A reactor is provided for removing polymer from a backside of a workpiece. The reactor includes a vacuum chamber having a ceiling, a floor and a cylindrical side wall. A workpiece support apparatus within the chamber is configured to support a workpiece thereon so that the workpiece has its front side facing the ceiling. The support apparatus leaves at least an annular periphery of the backside of the workpiece exposed. A confinement member defines a narrow gap with the outer edge of the workpiece, the narrow gap being on the order of about 1% of the workpiece diameter, the narrow gap corresponding to a boundary dividing the chamber between an upper process zone and a lower process zone. A vacuum pump is coupled to the lower process zone. The reactor further includes a local plasma-generating chamber and a nozzle disposed on a side of the workpiece support apparatus that is opposite a support surface of the workpiece support apparatus where the workpiece is to reside, the nozzle coupled to receive plasma from the local plasma-generating chamber. The nozzle is directed at a target area of the annular periphery so as to direct a plasma stream at the workpiece backside. A supply of a polymer etch precursor gas is coupled to the local plasma-generating chamber. A rotation actuator rotates the workpiece support apparatus relative to the nozzle.

    摘要翻译: 提供反应器用于从工件的背面去除聚合物。 反应器包括具有天花板,地板和圆柱形侧壁的真空室。 室内的工件支撑装置构造成在其上支撑工件,使得工件的前侧面对天花板。 支撑装置离开被暴露的工件的背面的至少一个环形周边。 约束构件与工件的外边缘限定窄间隙,窄间隙约为工件直径的约1%,窄间隙对应于在上工艺区和下工艺之间划分室的边界 区。 真空泵联接到下部处理区。 反应器还包括局部等离子体产生室和设置在工件支撑装置的与工件所在的工件支撑装置的支撑表面相对的一侧的喷嘴,喷嘴被连接以接收来自局部等离子体的等离子体 生成室。 喷嘴指向环形周边的目标区域,以便在工件背面引导等离子体流。 聚合物蚀刻前体气体的供应物连接到局部等离子体产生室。 旋转致动器相对于喷嘴旋转工件支撑装置。

    Apparatus for VHF impedance match tuning
    10.
    发明授权
    Apparatus for VHF impedance match tuning 失效
    VHF阻抗匹配调谐装置

    公开(公告)号:US08578879B2

    公开(公告)日:2013-11-12

    申请号:US12511377

    申请日:2009-07-29

    CPC分类号: H01P7/04

    摘要: Embodiments of impedance matching networks are provided herein. In some embodiments, an impedance matching network may include a coaxial resonator having an inner and an outer conductor. A tuning capacitor may be provided for variably controlling a resonance frequency of the coaxial resonator. The tuning capacitor may be formed by a first tuning electrode and a second tuning electrode and an intervening dielectric, wherein the first tuning electrode is formed by a portion of the inner conductor. A load capacitor may be provided for variably coupling energy from the inner conductor to a load. The load capacitor may be formed by the inner conductor, an adjustable load electrode, and an intervening dielectric.

    摘要翻译: 本文提供了阻抗匹配网络的实施例。 在一些实施例中,阻抗匹配网络可以包括具有内部和外部导体的同轴谐振器。 可以提供调谐电容器以可变地控制同轴谐振器的谐振频率。 调谐电容器可以由第一调谐电极和第二调谐电极和中间电介质形成,其中第一调谐电极由内部导体的一部分形成。 可以提供负载电容器,用于可变地耦合从内部导体到负载的能量。 负载电容器可以由内部导体,可调负载电极和中间电介质形成。