公开(公告)号：US12194591B2

公开(公告)日：2025-01-14

申请号：US17684285

申请日：2022-03-01

Applicant: Applied Materials, Inc.

Inventor： Ekaterina A. Mikhaylichenko ,  Fred C. Redeker ,  Brian J. Brown ,  Chirantha Rodrigo ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/04 ,  B24B37/11

Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：US12030156B2

公开(公告)日：2024-07-09

申请号：US17355024

申请日：2021-06-22

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Andrew J. Nagengast ,  Justin Ho Kuen Wong

IPC: B24B37/005 ,  B24B29/00 ,  B24B37/10 ,  B24B37/32 ,  B24B47/22 ,  B24B49/10

CPC classification number: B24B37/005 ,  B24B29/00 ,  B24B37/10 ,  B24B49/10 ,  B24B37/32 ,  B24B47/22

Abstract: A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carrier plate. The first flexible membrane has an upper surface and having a lower surface that provides a substrate mounting surface. The piezoelectric actuators are positioned above the first flexible membrane so as to independently adjust compressive pressure on the upper surface of the first flexible membrane.

公开(公告)号：US20240139905A1

公开(公告)日：2024-05-02

申请号：US18365482

申请日：2023-08-04

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Thomas H. Osterheld ,  Brian J. Brown ,  Haoquan Fang ,  Jeonghoon Oh ,  Jun Qian ,  Nicholas A. Wiswell ,  Sohrab Pourmand

IPC: B24B49/00 ,  B24B37/04 ,  B24B49/16 ,  B24B51/00

CPC classification number: B24B49/003 ,  B24B37/042 ,  B24B49/16 ,  B24B51/00

Abstract: A chemical mechanical polishing apparatus has a platen to support a polishing pad, the platen having a recess, a carrier head to hold a surface of a substrate against the polishing pad and comprising a retaining ring to retain the substrate below the carrier head, a motor to generate relative motion between the platen and the carrier head so as to polish the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor arranged in the recess that receives acoustic energy from friction between the substrate and the polishing pad and from friction between the retaining ring and the polishing pad, and a controller configured to generate a value for a carrier head status parameter based on received acoustic signals from the in-situ acoustic monitoring system, and change or polishing parameter or generate an alert based on the carrier head status parameter.

公开(公告)号：US20240139900A1

公开(公告)日：2024-05-02

申请号：US18101025

申请日：2023-01-24

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Jianshe Tang ,  Steven M. Zuniga ,  Brian J. Brown ,  Andrew J. Nagengast ,  Derek R. Witty ,  Rushabhkumar Desai ,  Shih-Haur Shen ,  Haosheng Wu ,  Yufei Hu

IPC: B24B37/005 ,  B24B37/04

CPC classification number: B24B37/005 ,  B24B37/042

Abstract: A chemical mechanical polishing apparatus has a platen to support a polishing pad, a carrier head comprising a rigid housing and configured to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish the substrate, an in-situ carrier head monitoring system including a sensor positioned to interact with the housing and to detect vibrational motion of the housing and generate signals based on the detected vibrational motion, and a controller. The controller is configured to generate a value for a carrier head status parameter based on received signals from the in-situ carrier head monitoring system, and change a polishing parameter or generate an alert based on the carrier head status parameter.

公开(公告)号：US20240042570A1

公开(公告)日：2024-02-08

申请号：US18358563

申请日：2023-07-25

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Yasuhiro Hori ,  Sameer Deshpande ,  Chad Pollard ,  Sih-Ling Yeh ,  Priscilla Diep ,  Ningzhuo Cui ,  Brian J. Brown ,  Hui Chen

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.

公开(公告)号：US20240017371A1

公开(公告)日：2024-01-18

申请号：US18352432

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US20230390883A1

公开(公告)日：2023-12-07

申请号：US17961516

申请日：2022-10-06

Applicant: Applied Materials, Inc.

Inventor： Haoquan Fang ,  Thomas H. Osterheld ,  Benjamin Cherian ,  Jun Qian ,  Kun Xu ,  Sohrab Pourmand ,  Boguslaw A. Swedek ,  Jeonghoon Oh ,  Dominic J. Benvegnu ,  Brian J. Brown

IPC: B24B37/005 ,  B24B37/32 ,  G01N29/44 ,  G01N29/46

CPC classification number: B24B37/005 ,  B24B37/32 ,  G01N29/4436 ,  G01N29/4427 ,  G01N29/46

Abstract: A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relative motion between the platen and the carrier head so as to polish the substrate. The carrier head includes a retaining ring for holding the substrate, and the acoustic sensor travels in a path below the carrier head and the retaining ring. A controller is configured to analyze a signal from the acoustic sensor and determine a characteristic of the retaining ring based on the signal.

公开(公告)号：US20210046604A1

公开(公告)日：2021-02-18

申请号：US16989734

申请日：2020-08-10

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  H01L21/321 ,  H01L21/67 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US20210046603A1

公开(公告)日：2021-02-18

申请号：US16831664

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B57/02 ,  B24B49/14

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended over the platen to direct the polishing liquid onto the polishing surface, wherein the source of the heating fluid is coupled to the dispenser and configured to deliver the heating fluid into the polishing liquid to heat the polishing liquid after the polishing liquid leaves the reservoir and before the polishing liquid is dispensed onto the polishing surface.

公开(公告)号：US10672628B2

公开(公告)日：2020-06-02

申请号：US15659417

申请日：2017-07-25

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown

IPC: H01L21/67

Abstract: An apparatus for drying of wet substrates in a post CMP cleaning apparatus is provided. The apparatus provides a waterfall or shallow reservoir of rinsing solution, such as DIW, through which a substrate may be lifted. A solvent vapor may be provided at the rinsing solution interface on the substrate, such as in a Marangoni process. In certain embodiments, the volume of solution through which the substrate is lifted is reduced, which may provide for reduced or eliminated particle reattachment to the substrate.