公开(公告)号：US11833637B2

公开(公告)日：2023-12-05

申请号：US17360907

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Calvin Lee ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Dmitry Sklyar ,  Paul D. Butterfield ,  Chad Pollard ,  Haosheng Wu

IPC: B24B37/015 ,  B24B37/04 ,  F22B35/00

CPC classification number: B24B37/015 ,  B24B37/042 ,  F22B35/00

Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

公开(公告)号：US20230054165A1

公开(公告)日：2023-02-23

申请号：US17405898

申请日：2021-08-18

Applicant: Applied Materials, Inc.

Inventor： Chih Chung Chou ,  Haosheng Wu ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Chad Pollard ,  Hari N. Soundararajan

IPC: B24B37/34 ,  H01L21/306 ,  H01L21/66 ,  B06B1/06 ,  B01F11/02 ,  B01F15/06

Abstract: Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. The assemblies may include one or more ultrasonic transducers coupled with the deagglomeration tube.

公开(公告)号：US20230415297A1

公开(公告)日：2023-12-28

申请号：US18465519

申请日：2023-09-12

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Calvin Lee ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Dmitry Sklyar ,  Paul D. Butterfield ,  Chad Pollard ,  Haosheng Wu

IPC: B24B37/015

CPC classification number: B24B37/015 ,  B24B37/042

Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

公开(公告)号：US20220282807A1

公开(公告)日：2022-09-08

申请号：US17680163

申请日：2022-02-24

Applicant: Applied Materials, Inc.

Inventor： Chad Pollard ,  Hari Soundararajan ,  Paul D. Butterfield ,  Shou-Sung Chang ,  Haosheng Wu ,  Calvin Lee ,  Balasubramaniam Coimbatore Jaganathan

IPC: F16L11/127 ,  B24B57/02

Abstract: A polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The chemical mechanical polishing system including a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes electrically insulative tubing, a conductive wrapper wrapped around an outer diameter of the tubing from a first end of the tubing to a second end of the tubing, and a conductive wire attached to the conductive wrapper first end. The conductive wrapper is configured to conduct an electrostatic discharge, and the conductive wire is configured to conduct the electrostatic discharge from the conductive wrapper to a grounding source.

公开(公告)号：US20210402554A1

公开(公告)日：2021-12-30

申请号：US17360907

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Calvin Lee ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Dmitry Sklyar ,  Paul D. Butterfield ,  Chad Pollard ,  Haosheng Wu

IPC: B24B37/015

Abstract: A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

公开(公告)号：US20240342855A1

公开(公告)日：2024-10-17

申请号：US18632044

申请日：2024-04-10

Applicant: Applied Materials, Inc.

Inventor： Chad Pollard ,  Sih-Ling Yeh ,  Jonathan P. Domin ,  Shou-Sung Chang ,  Haosheng Wu ,  Jeonghoon Oh ,  Jianshe Tang

IPC: B24B37/015 ,  B24B37/04

CPC classification number: B24B37/015 ,  B24B37/04

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, a motor to generate relative motion, a steam generator, and an arm extending over the platen with and at least one opening to deliver steam from the steam generator onto the polishing pad. The steam generator includes a canister, a barrier in the canister dividing the canister into a lower chamber having a water inlet and an upper chamber having a steam outlet, a heating element configured to apply heat to a portion of lower chamber, and a nucleation surface positioned in the lower chamber. The barrier has apertures for steam to pass from the lower chamber to the upper chamber and allows for condensation to pass from the upper chamber to the lower chamber.

公开(公告)号：US20240042570A1

公开(公告)日：2024-02-08

申请号：US18358563

申请日：2023-07-25

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Yasuhiro Hori ,  Sameer Deshpande ,  Chad Pollard ,  Sih-Ling Yeh ,  Priscilla Diep ,  Ningzhuo Cui ,  Brian J. Brown ,  Hui Chen

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.

公开(公告)号：US20230381922A1

公开(公告)日：2023-11-30

申请号：US17974280

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Chad Pollard ,  Shou-Sung Chang ,  Haosheng Wu

IPC: B24B57/02 ,  B24B53/017 ,  F16L11/127

CPC classification number: B24B57/02 ,  B24B53/017 ,  F16L11/127

Abstract: A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.

公开(公告)号：US11728185B2

公开(公告)日：2023-08-15

申请号：US17141622

申请日：2021-01-05

Applicant: Applied Materials, Inc.

Inventor： Jianshe Tang ,  Wei Lu ,  Haosheng Wu ,  Taketo Sekine ,  Shou-Sung Chang ,  Hari N. Soundararajan ,  Chad Pollard

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/12 ,  H01L21/306

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B3/08 ,  B08B3/12 ,  B08B5/02 ,  H01L21/02057 ,  H01L21/30625 ,  B08B2203/007 ,  B08B2230/01 ,  H01L21/02074 ,  H01L21/67109

Abstract: The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20240408650A1

公开(公告)日：2024-12-12

申请号：US18206367

申请日：2023-06-06

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Sih-Ling Yeh ,  Emily Drauss ,  Elton Zhong ,  Chad Pollard ,  Songling Shin ,  Jianshe Tang ,  Jeonghoon Oh

IPC: B08B3/02 ,  B05B7/24 ,  B08B13/00 ,  B24B57/04

Abstract: A chemical mechanical polishing system includes a first polishing station including a first platen to support a first polishing pad, a transfer station to receive a substrate from a robot, a carrier head movable on a predetermined path from the polishing station to the transfer station, a gas flow regulator having an input for a carrier gas, a liquid flow regulator having an input for a cleaning liquid, and a fluid jet cleaner at a position along the predetermined path. The fluid jet cleaner includes an atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner.