Temperature controlled semiconductor processing chamber liner
    1.
    发明申请
    Temperature controlled semiconductor processing chamber liner 审中-公开
    温度控制半导体处理室内衬

    公开(公告)号:US20020069970A1

    公开(公告)日:2002-06-13

    申请号:US10055310

    申请日:2002-01-22

    Abstract: A thermally controlled chamber liner comprising a passage having an inlet and outlet adapted to flow a fluid through the one or more fluid passages formed at least partially therein. The chamber liner may comprise a first liner, a second liner or both a first liner and a second liner. The thermally controlled chamber liner maintains a predetermined temperature by running fluid from a temperature controlled, fluid source through the fluid passages. By maintaining a predetermined temperature, deposition of films on the chamber liner is discouraged and particulate generation due to stress cracking of deposited films is minimized.

    Abstract translation: 一种热控腔室衬套,其包括具有入口和出口的通道,其适于使流体流过至少部分地形成在其中的一个或多个流体通道。 腔室衬套可以包括第一衬垫,第二衬垫或第一衬垫和第二衬垫两者。 热控腔室衬里通过将流体从温度受控的流体源流过流体通道来维持预定的温度。 通过保持预定的温度,阻止膜在室衬里上的沉积,并且由于沉积膜的应力开裂引起的颗粒的产生被最小化。

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