公开(公告)号：US20230256562A1

公开(公告)日：2023-08-17

申请号：US18305793

申请日：2023-04-24

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher

IPC分类号： B24B53/017 ,  B24B53/00 ,  B24B57/02

CPC分类号： B24B53/017 ,  B24B53/005 ,  B24B57/02 ,  B24B41/061

摘要： A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

公开(公告)号：US20230182259A1

公开(公告)日：2023-06-15

申请号：US18107220

申请日：2023-02-08

申请人： Applied Materials, Inc.

发明人： Surajit Kumar ,  Hui Chen ,  Chih Chung Chou ,  Shou-Sung Chang

IPC分类号： B24B37/015 ,  B24B37/34

CPC分类号： B24B37/015 ,  B24B37/34

摘要： A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

公开(公告)号：US20220388041A1

公开(公告)日：2022-12-08

申请号：US17889330

申请日：2022-08-16

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC分类号： B08B3/10 ,  H01L21/67 ,  B24B37/34

摘要： An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US20200376522A1

公开(公告)日：2020-12-03

申请号：US16886567

申请日：2020-05-28

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC分类号： B08B3/10 ,  H01L21/02 ,  B08B1/00 ,  B24B37/20 ,  B24B53/017

摘要： A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.

公开(公告)号：US20200331117A1

公开(公告)日：2020-10-22

申请号：US16849912

申请日：2020-04-15

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC分类号： B24B57/02 ,  B24B37/04 ,  H01L21/304

摘要： A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.

公开(公告)号：US20200331114A1

公开(公告)日：2020-10-22

申请号：US16849884

申请日：2020-04-15

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC分类号： B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B55/02 ,  B24B37/34

摘要： A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.

公开(公告)号：US10256120B2

公开(公告)日：2019-04-09

申请号：US14523827

申请日：2014-10-24

申请人： Applied Materials, Inc.

发明人： Clinton P. Sakata ,  Hui Chen ,  Jim K. Atkinson ,  Brian J. Brown ,  Jianshe Tang ,  Yufei Chen ,  Yunshuang Ding

IPC分类号： H01L21/00 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04

摘要： In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

公开(公告)号：US20150114430A1

公开(公告)日：2015-04-30

申请号：US14523827

申请日：2014-10-24

申请人： Applied Materials, Inc.

发明人： Clinton P. Sakata ,  Hui Chen ,  Jim K. Atkinson ,  Brian J. Brian ,  Jianshe Tang ,  Yufei Chen ,  Yunshuang Ding

IPC分类号： B08B1/00

CPC分类号： B08B1/006 ,  B08B1/04 ,  H01L21/67046

摘要： In some embodiments, an apparatus for cleaning a substrate is provided that includes (1) a substrate chuck configured to support a substrate with a front side of the substrate accessible; (2) a buff pad assembly configured to support a buff pad having a diameter smaller than a diameter of the substrate; and (3) a swing arm coupled to the buff pad and configured to position and rotate the buff pad along the front side of the substrate, and control an amount of force applied by the buff pad against the front side of the substrate during cleaning. The substrate chuck, buff pad assembly and swing arm are configured to buff clean the substrate. Numerous additional aspects are disclosed.

摘要翻译： 在一些实施例中，提供了一种用于清洁衬底的设备，其包括（1）衬底卡盘，其构造成支撑具有可接近的衬底的前侧的衬底; （2）抛光垫组件，其构造成支撑直径小于所述基底的直径的抛光垫; 和（3）摆动臂，其联接到所述抛光垫并且构造成沿着所述基板的前侧定位和旋转所述抛光垫，并且在清洁期间控制由所述抛光垫施加在所述基板的前侧上的力的量。 衬底卡盘，抛光垫组件和摆臂配置为抛光清洁衬底。 公开了许多附加方面。

公开(公告)号：US20140310895A1

公开(公告)日：2014-10-23

申请号：US13866407

申请日：2013-04-19

申请人： APPLIED MATERIALS, INC.

发明人： Hui Chen

IPC分类号： H01L21/67 ,  H02P29/00 ,  H05K13/00

CPC分类号： H01L21/67046 ,  Y10T29/49117

摘要： A control assembly that may be used with a chemical mechanical polishing (CMP) cleaning unit may include a linkage arm that extends and retracts, a load cell sensor that senses a force on the linkage arm, and a motor. The motor may drive the linkage arm to an extended or retracted position to cause a scrubber brush assembly of the cleaning unit to move away from or into contact with a substrate to be cleaned. In response to a force sensed by the load cell sensor, the motor may adjust the position of the linkage arm to cause an adjustment of the scrubber brush assembly position relative to the substrate being cleaned. Methods of controlling a scrubber brush force are also provided, as are other aspects.

摘要翻译： 可以与化学机械抛光（CMP）清洁单元一起使用的控制组件可以包括延伸和缩回的联动臂，感测连杆臂上的力的测力传感器传感器和电动机。 马达可以将联动臂驱动到延伸或缩回位置，以使清洁单元的洗涤器刷组件移动远离或与待清洁的基板接触。 响应于由称重传感器感测到的力，马达可以调节联动臂的位置，以使洗涤器刷组件位置相对于待清洁的基底的位置调整。 还提供了控制洗涤器刷力的方法，以及其它方面。

公开(公告)号：US12030093B2

公开(公告)日：2024-07-09

申请号：US17889330

申请日：2022-08-16

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC分类号： B08B3/10 ,  B24B37/34 ,  H01L21/67

CPC分类号： B08B3/106 ,  B24B37/34 ,  H01L21/67051 ,  H01L21/67248 ,  B08B2203/007

摘要： An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.