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公开(公告)号：US20180340832A1
公开(公告)日：2018-11-29
申请号：US15663037
申请日：2017-07-28
Applicant: Applied Materials, Inc.
Inventor： Lara HAWRYLCHAK , Samuel C. HOWELLS , Wolfgang R. ADERHOLD , Leonid M. TERTITSKI , Michael LIU , Dongming IU , Norman L. TAM , Ji-Dih HU
IPC: G01J5/00 , H01L21/324 , G05D23/19 , H01L21/66 , H05B1/02
CPC classification number: G01J5/0007 , G01J5/602 , G01J2005/0051 , G05D23/1931 , H01L21/324 , H01L21/67109 , H01L21/67115 , H01L21/68735 , H01L22/10 , H01L22/12 , H01L22/20 , H05B1/0233 , H05B3/0047
Abstract: Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one example, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.
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公开(公告)号：US20220367216A1
公开(公告)日：2022-11-17
申请号：US17317684
申请日：2021-05-11
Applicant: Applied Materials, Inc.
Inventor： Tetsuya ISHIKAWA , Swaminathan T. SRINIVASAN , Matthias BAUER , Ala MORADIAN , Manjunath SUBBANNA , Kartik Bhupendra SHAH , Kostiantyn ACHKASOV , Errol Antonio C. SANCHEZ , Michael R. RICE , Marc SHULL , Ji-Dih HU
Abstract: The present disclosure generally relates to an epitaxial chamber for processing of semiconductor substrates. In one example, the epitaxial chamber has a chamber body assembly. The chamber body assembly includes a lower window and an upper window, wherein chamber body assembly, the lower window and the upper window enclose an internal volume. A susceptor assembly is disposed in the internal volume. The epitaxial chamber also has a plurality of temperature control elements. The plurality of temperature control elements include one or more of an upper lamp module, a lower lamp module, an upper heater, a lower heater, or a heated gas passage.
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公开(公告)号：US20220301904A1
公开(公告)日：2022-09-22
申请号：US17582912
申请日：2022-01-24
Applicant: Applied Materials, Inc.
Inventor： Ji-Dih HU , Chaitanya Anjaneyalu PRASAD , Dongming IU , Samuel C. HOWELLS , Vilen K. NESTOROV
IPC: H01L21/67 , H05B47/105
Abstract: Methods, systems, and apparatus provide for optically monitoring individual lamps of substrate processing chambers. In one aspect, the individual lamps are monitored to determine if one or more lamps are in need of replacement. A method includes using one or more camera coupled to a borescope to capture a plurality of images of one or more lamps in a substrate processing chamber. The plurality of images is analyzed to identify a change of mean light pixel intensity in an image reference region associated with each lamp. The method includes generating an alert based on the detection of the mean light pixel intensity change.
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公开(公告)号：US20200149968A1
公开(公告)日：2020-05-14
申请号：US16741907
申请日：2020-01-14
Applicant: Applied Materials, Inc.
Inventor： Lara HAWRYLCHAK , Samuel C. HOWELLS , Wolfgang R. ADERHOLD , Leonid M. TERTITSKI , Michael LIU , Dongming IU , Norman L. TAM , Ji-Dih HU
IPC: G01J5/00 , H05B1/02 , H01L21/66 , G05D23/19 , H01L21/324 , H01L21/67 , H05B3/00 , H01L21/687 , G01J5/60
Abstract: Examples described herein generally relate to apparatus and methods for rapid thermal processing (RTP) of a substrate. In one or more embodiments, a process chamber includes chamber body, a window disposed on a first portion of the chamber body, a chamber bottom, and a shield disposed on a second portion of the chamber body. The shield has a flat surface facing the window to reduce reflected radiant energy to a back side of a substrate disposed in the process chamber during operation. The process chamber further includes an edge support for supporting the substrate and a cooling member disposed on the chamber bottom. The cooling member is disposed in proximity of the edge support to cool the edge support during low temperature operation in order to improve the temperature uniformity of the substrate.
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公开(公告)号：US20190228997A1
公开(公告)日：2019-07-25
申请号：US16249588
申请日：2019-01-16
Applicant: Applied Materials, Inc.
Inventor： Ji-Dih HU , Ala MORADIAN
IPC: H01L21/67 , G01K11/12 , G01J5/34 , H01L21/66 , H01L21/324
Abstract: A method and apparatus to determine a temperature of a substrate using a spectrum of radiation is disclosed herein. In one aspect, a process chamber includes a lamp assembly optically coupled to a spectrometer. The spectrometer is used to determine a temperature of a substrate within the process chamber. A controller is coupled to the spectrometer and controls the lamp assembly to selectively heat and cool the substrate. In another aspect, a method of includes exposing a substrate to a radiation source. A spectrum of radiation is detected by a spectrometer across a substrate. The spectrum of radiation passed through the substrate is determined and used to determine a temperature of the substrate.
