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    STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
    1.
    发明公开
    STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING 审中-公开

    公开(公告)号：US20240342855A1

    公开(公告)日：2024-10-17

    申请号：US18632044

    申请日：2024-04-10

    Applicant: Applied Materials, Inc.

    Inventor： Chad Pollard ,  Sih-Ling Yeh ,  Jonathan P. Domin ,  Shou-Sung Chang ,  Haosheng Wu ,  Jeonghoon Oh ,  Jianshe Tang

    IPC: B24B37/015 ,  B24B37/04

    CPC classification number: B24B37/015 ,  B24B37/04

    Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, a motor to generate relative motion, a steam generator, and an arm extending over the platen with and at least one opening to deliver steam from the steam generator onto the polishing pad. The steam generator includes a canister, a barrier in the canister dividing the canister into a lower chamber having a water inlet and an upper chamber having a steam outlet, a heating element configured to apply heat to a portion of lower chamber, and a nucleation surface positioned in the lower chamber. The barrier has apertures for steam to pass from the lower chamber to the upper chamber and allows for condensation to pass from the upper chamber to the lower chamber.

    GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES
    3.
    发明公开
    GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES 审中-公开

    公开(公告)号：US20230381922A1

    公开(公告)日：2023-11-30

    申请号：US17974280

    申请日：2022-10-26

    Applicant: Applied Materials, Inc.

    Inventor： Chad Pollard ,  Shou-Sung Chang ,  Haosheng Wu

    IPC: B24B57/02 ,  B24B53/017 ,  F16L11/127

    CPC classification number: B24B57/02 ,  B24B53/017 ,  F16L11/127

    Abstract: A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.

    POLISHING SLURRY DISPENSE NOZZLE
    5.
    发明申请
    POLISHING SLURRY DISPENSE NOZZLE 有权

    公开(公告)号：US20230130235A1

    公开(公告)日：2023-04-27

    申请号：US17507704

    申请日：2021-10-21

    Applicant: Applied Materials, Inc.

    Inventor： Chih Chung Chou ,  Anand Nilakantan Iyer ,  Ekaterina A. Mikhaylichenko ,  Christopher HeungGyun Lee ,  Shou-Sung Chang

    IPC: B24B57/02

    Abstract: Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that is fluidly coupled with a slurry outlet of the slurry line. The nozzle may include a body defining a reservoir and an exit port. The reservoir may be fluidly coupled with a downstream end of the lumen. The exit port may be coupled with the reservoir. The nozzle may include a valve seat. The nozzle may include a valve member having a first surface positioned against the valve seat when in a closed position. The valve member may be movable to an open position in which the first surface is spaced apart from the valve seat. The nozzle may include an actuator coupled with a second surface of the valve member.

    Multi-disk chemical mechanical polishing pad conditioners and methods
    10.
    发明授权
    Multi-disk chemical mechanical polishing pad conditioners and methods 有权
    多盘化学机械抛光垫调节剂及方法

    公开(公告)号：US09308623B2

    公开(公告)日：2016-04-12

    申请号：US14256704

    申请日：2014-04-18

    Applicant: Applied Materials, Inc.

    Inventor： Hung Chen ,  Shou-Sung Chang ,  Jason Garcheung Fung ,  Matthew A. Gallelli ,  Paul D. Butterfield ,  Kevin Chou

    IPC: B24B53/017

    CPC classification number: B24B53/017

    Abstract: A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.

    Abstract translation: 衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。 在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。 多个垫调节器组件可以附接到主组件基板。 在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。 还提供了调整抛光垫的方法，以及其它方面。

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