公开(公告)号：US11680338B2

公开(公告)日：2023-06-20

申请号：US16833352

申请日：2020-03-27

申请人： APPLIED MATERIALS, INC.

发明人： Brian Burrows ,  Shu-Kwan Danny Lau ,  Zhiyuan Ye

IPC分类号： C30B25/10 ,  G02B7/182 ,  C30B25/08 ,  C23C16/52 ,  C30B25/16 ,  C23C16/44 ,  G02B7/18

CPC分类号： C30B25/10 ,  C23C16/4411 ,  C23C16/52 ,  C30B25/08 ,  C30B25/16 ,  G02B7/181 ,  G02B7/182

摘要： Methods and apparatus for an upper reflector assembly for use in a process chamber are provided herein. In some embodiments, an upper reflector assembly for use in a process chamber includes a reflector mounting ring; and upper reflector plate coupled to the reflector mounting ring and having an upper surface and lower surface, wherein the lower surface includes a plurality of linear channels extending substantially parallel to each other across the lower surface, and wherein the upper reflector plate includes air cooling slots extending from the upper surface to the lower surface.

公开(公告)号：US12033874B2

公开(公告)日：2024-07-09

申请号：US17011781

申请日：2020-09-03

申请人： Applied Materials, Inc.

发明人： Shu-Kwan Danny Lau ,  Adel George Tannous ,  Patrick C. Genis ,  Zhiyuan Ye

IPC分类号： H01L21/67

CPC分类号： H01L21/67115

摘要： An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.

公开(公告)号：US12037701B2

公开(公告)日：2024-07-16

申请号：US17218892

申请日：2021-03-31

申请人： Applied Materials, Inc.

发明人： Zhiyuan Ye ,  Shu-Kwan Danny Lau ,  Brian H. Burrows ,  Lori Washington ,  Herman Diniz ,  Martin A. Hilkene ,  Richard O. Collins ,  Nyi O. Myo ,  Manish Hemkar ,  Schubert S. Chu

IPC分类号： C30B25/14 ,  C23C16/44 ,  C23C16/455 ,  C30B25/08 ,  C30B25/10 ,  H01L21/67

CPC分类号： C30B25/14 ,  C23C16/4412 ,  C23C16/455 ,  C30B25/105 ,  H01L21/6719 ,  C30B25/08

摘要： A method and apparatus for a process chamber for thermal processing is described herein. The process chamber is a dual process chamber and shares a chamber body. The chamber body includes a first and a second set of gas inject passages. The chamber body may also include a first and a second set of exhaust ports. The process chamber may have a shared gas panel and/or a shared exhaust conduit.

公开(公告)号：US11842907B2

公开(公告)日：2023-12-12

申请号：US16923949

申请日：2020-07-08

申请人： Applied Materials, Inc.

发明人： Shu-Kwan Danny Lau ,  Toshiyuki Nakagawa ,  Zhiyuan Ye

IPC分类号： H01L21/67 ,  F27B17/00 ,  F27D5/00 ,  B23K26/00 ,  B23K26/08 ,  H01L21/687 ,  H01L21/268 ,  B23K26/06 ,  B23K103/00 ,  F27D9/00

CPC分类号： H01L21/67115 ,  B23K26/0006 ,  B23K26/0648 ,  B23K26/0869 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/268 ,  H01L21/68764 ,  B23K2103/56 ,  F27D2009/007

摘要： Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.

公开(公告)号：US10770319B2

公开(公告)日：2020-09-08

申请号：US16273902

申请日：2019-02-12

申请人： Applied Materials, Inc.

发明人： Shu-Kwan Danny Lau ,  Zhiyuan Ye ,  Zuoming Zhu ,  Nyi O. Myo ,  Errol Antonio C. Sanchez ,  Schubert S. Chu

IPC分类号： H01L21/67 ,  H01L21/687 ,  B23K26/0622

摘要： Embodiments described herein provide processing chambers that include an enclosure for a processing volume, a rotatable support within the enclosure, the support having a shaft that extends outside the enclosure, wherein the shaft has a signal feature located outside the processing volume, an energy module within the enclosure, wherein the shaft extends through the energy module, one or more directed energy sources coupled to the enclosure, and one or more signalers positioned proximate to the signal feature, each signaler coupled to at least one of the directed energy sources.