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    SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS
    2.
    发明申请
    SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS 有权

    公开(公告)号：US20230116153A1

    公开(公告)日：2023-04-13

    申请号：US17851638

    申请日：2022-06-28

    Applicant: Applied Materials, Inc.

    Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Prashant A. DESAI ,  Thomas BREZOCZKY

    IPC: H01L21/67

    Abstract: Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.

    SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECE
    5.
    发明申请
    SUBSTRATE PROCESSING MODULE AND METHOD OF MOVING A WORKPIECE 有权

    公开(公告)号：US20220013383A1

    公开(公告)日：2022-01-13

    申请号：US16923792

    申请日：2020-07-08

    Applicant: Applied Materials, Inc.

    Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

    IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C23C14/35

    Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

    MULTISUBSTRATE PROCESS SYSTEM
    6.
    发明申请
    MULTISUBSTRATE PROCESS SYSTEM 审中-公开

    公开(公告)号：US20200381276A1

    公开(公告)日：2020-12-03

    申请号：US16877357

    申请日：2020-05-18

    Applicant: Applied Materials, Inc.

    Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Bhaskar PRASAD ,  Shashikanth CHENNAKESHAVA ,  Sreenath SOVENAHALLI ,  Shankar KODLE

    IPC: H01L21/67 ,  H01L21/687 ,  B25J15/00 ,  B25J9/04 ,  B25J11/00

    Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes at least one processing module that includes a plurality of process stations coupled thereto and a substrate transferring device disposed within a transfer region of the processing module for transferring a plurality of substrates to two or more of the plurality of process stations. The methods and apparatuses disclosed herein are useful for performing vacuum processing on substrates wherein one or more substrates are transferred within the transfer region of processing module that is in direct communication with at least a portion of a processing region of a plurality of separately isolatable process stations during the process of transferring the one or more substrates. In some embodiments, a substrate is positioned and maintained on the same substrate support member during the process of transferring the substrate within the processing module and while the substrate is being processed in each of the plurality of process stations.

    SEMICONDUCTOR PROCESS EQUIPMENT
    8.
    发明公开
    SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开

    公开(公告)号：US20240153801A1

    公开(公告)日：2024-05-09

    申请号：US18141926

    申请日：2023-05-01

    Applicant: Applied Materials, Inc.

    Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

    IPC: H01L21/677

    CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

    Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

    TRANSFER APPARATUS AND SUBSTRATE-SUPPORTING MEMBER
    9.
    发明申请
    TRANSFER APPARATUS AND SUBSTRATE-SUPPORTING MEMBER 有权

    公开(公告)号：US20220336248A1

    公开(公告)日：2022-10-20

    申请号：US17230775

    申请日：2021-04-14

    Applicant: Applied Materials, Inc.

    Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA ,  Lakshmikanth Krishnamurthy SHIRAHATTI

    IPC: H01L21/683 ,  H01L21/677

    Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for processing substrates. More specifically, embodiments of the present disclosure relate to transfer apparatus and substrate-supporting members. In an embodiment, an apparatus for transferring a substrate is provided. The apparatus includes a hub and a plurality of transfer arms extending from the hub. The apparatus further includes a plurality of substrate-supporting members, wherein each of the transfer arms has a first end coupled to the hub and a second end coupled to a respective one of the plurality of substrate-supporting members. The apparatus further includes a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member, and a second electrical interface connection for electrostatically chucking the substrate and located at a second position on each substrate-supporting member. Substrate processing modules are also described.

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